公开(公告)号：US07540428B2

公开(公告)日：2009-06-02

申请号：US10998138

申请日：2004-11-29

申请人： Shunji Baba ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Takatoyo Yamakami ,  Masumi Katayama

发明人： Shunji Baba ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Takatoyo Yamakami ,  Masumi Katayama

IPC分类号： G06K19/06

CPC分类号： H01Q1/2208 ,  A63B43/00 ,  A63B2225/54 ,  G06K19/07749 ,  G06K19/07758 ,  G06K19/07786 ,  H01Q7/00

摘要： A radio-frequency-identification tag antenna includes a film base, a plurality of antenna patterns for transmission and reception, which is formed in parallel on the film base, and a cut line that is formed on the film base between adjacent antenna patterns along the antenna patterns from an inside to an outer edge of the film base. A part of the film base on which the antenna patterns are formed is folded or bent in a predetermined direction using the cut line.

摘要翻译： 射频识别标签天线包括薄膜基底，在薄膜基底上平行形成的用于发送和接收的多个天线图案，以及沿着沿着薄膜基底的相邻天线图案之间的薄膜基底上形成的切割线 天线图案从胶片底部的内侧到外缘。 使用切割线将形成有天线图案的胶片基底的一部分以预定方向折叠或弯曲。

公开(公告)号：US20070296136A1

公开(公告)日：2007-12-27

申请号：US11763345

申请日：2007-06-14

申请人： Tetsuro Fukusaka ,  Yuzo Matsumoto ,  Naoki Ishikawa

发明人： Tetsuro Fukusaka ,  Yuzo Matsumoto ,  Naoki Ishikawa

IPC分类号： B65H5/08

CPC分类号： B65H3/128 ,  B65H2406/3662 ,  B65H2406/41

摘要： A sheet feeding apparatus includes a sheet feeding unit configured to suction a stored sheet with a negative pressure to feed the suctioned sheet, a suction duct connected to the sheet feeding unit, a suction fan configured to generate a negative pressure in the suction duct, a shutter disposed in the suction duct and configured to allow and shut off communication between the sheet feeding unit and the suction fan, and a communicating mechanism configured to cause a space in the suction duct between the shutter and the sheet feeding unit to communicate with an outside of the suction duct. The communicating mechanism is configured to cause the space in the suction duct to communicate with the outside of the suction duct according to the shutter shutting off communication between the sheet feeding unit and the suction fan.

摘要翻译： 送纸装置包括：纸张进给单元，其被配置为以负压抽吸存储的纸张以供给吸引的纸张;连接到纸张进给单元的吸引管道;被构造成在吸入管道中产生负压的吸入风扇， 挡板，其布置在吸入管道中并且构造成允许和切断供纸单元和吸风扇之间的连通;以及连通机构，其构造成使得快门和供纸单元之间的吸入管道中的空间与外部连通 的吸气管。 连通机构构成为根据供纸单元和吸风扇之间的快门关闭连通，使吸引管道中的空间与吸入管道的外部连通。

公开(公告)号：US20070215203A1

公开(公告)日：2007-09-20

申请号：US11631480

申请日：2005-06-15

申请人： Naoki Ishikawa ,  Satoyuki Ojima ,  Hiroyuki Ohtsuka ,  Haruhiko Kano ,  Masanobu Yano

发明人： Naoki Ishikawa ,  Satoyuki Ojima ,  Hiroyuki Ohtsuka ,  Haruhiko Kano ,  Masanobu Yano

IPC分类号： H01L31/00

CPC分类号： H01B1/16 ,  H01L31/022433 ,  Y02E10/50

摘要： The present invention is an electrode material comprising at least, a silver powder, a glass frit, and an organic vehicle, wherein a rate of Ag content of the electrode material is 75 wt % to 95 wt %, and a ratio of contents of Ag grains having an average grain diameter of 0.5 μm to 3 μm and Ag grains having an average grain diameter of 4 μm to 8 μm in the electrode material is (the Ag grains having an average grain diameter of 0.5 μm to 3 μm):(the Ag grains having an average grain diameter of 4 μm to 8 μm)=20-80 wt %:80-20 wt %, and a solar cell comprising an electrode formed by using the electrode material. Thereby, an electrode material that can be stably filled in an electrode groove formed on a semiconductor device and that an electrode with narrow line width and small resistance loss can be easily formed by, and a solar cell with high power having an electrode formed by using the electrode material are provided.

摘要翻译： 本发明是至少包含银粉，玻璃料和有机载体的电极材料，其中电极材料的Ag含量的比例为75重量％〜95重量％，Ag的含量比例 （平均粒径为0.5〜3μm的Ag粒子）:(平均粒径为0.5〜3μm的Ag粒子）（平均粒径为0.5〜3μm的Ag粒子）:(平均粒径为0.5〜3μm的Ag粒子） 平均粒径为4μm〜8μm的Ag粒子）= 20〜80wt％：80〜20wt％，以及包含使用电极材料形成的电极的太阳能电池。 由此，可以容易地形成能够稳定地填充在形成于半导体装置上的电极槽中的电极材料，并且能够容易地形成具有窄线宽度和小电阻损失的电极，并且可以容易地形成具有通过使用电极形成的电极的具有高功率的太阳能电池 提供电极材料。

公开(公告)号：US20060131426A1

公开(公告)日：2006-06-22

申请号：US11091934

申请日：2005-03-29

申请人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： G06K19/06 ,  G08B13/14 ,  H01Q17/00

CPC分类号： H01L24/12 ,  G06K19/07749 ,  G06K19/0775 ,  H01L23/49855 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/8159 ,  H01L2224/816 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49018 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2224/29075 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention provides a radio frequency identification (RFID) tag which exchanges information with an external device in a noncontact manner, in which a paste is used as a material for an antenna, and which is designed to prevent sinking of bumps. A stopper for limiting sinking of bumps of a circuit chip caused by a pressing force when the circuit chip is connected to an antenna is provided on the circuit chip or a base at a position adjacent to the bumps.

摘要翻译： 本发明提供了一种射频识别（RFID）标签，其以非接触方式与外部设备交换信息，其中使用糊料作为天线的材料，并且被设计成防止凸起的下沉。 当电路芯片连接到天线时，用于限制由压力引起的电路芯片的凸块的下沉的止动器设置在电路芯片或与凸块相邻的位置的基座上。

公开(公告)号：US20060030076A1

公开(公告)日：2006-02-09

申请号：US11246267

申请日：2005-10-11

申请人： Hiroshi Kobayashi ,  Naoki Ishikawa ,  Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Shuichi Takeuchi ,  Takayoshi Matsumura

发明人： Hiroshi Kobayashi ,  Naoki Ishikawa ,  Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Shuichi Takeuchi ,  Takayoshi Matsumura

IPC分类号： H01L21/48 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L24/29 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13644 ,  H01L2224/13664 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： The semiconductor device of the present invention is capable of restricting alloying metals and improving electrical connection between a semiconductor chip and a mount board. The semiconductor device comprises: the semiconductor chip having terminal sections; and bumps for electrical connection, the bumps being formed at the terminal sections. Each of the bumps is made of a two-layer wire, which includes a core member and a jacket member, and formed by a stud bump bonding process.

摘要翻译： 本发明的半导体器件能够限制合金化金属和改善半导体芯片和安装基板之间的电连接。 半导体器件包括：具有端子部分的半导体芯片; 以及用于电连接的凸块，在端子部分处形成凸点。 每个凸块由包括芯构件和护套构件的双层线制成，并且通过柱凸块接合工艺形成。

公开(公告)号：US06458237B1

公开(公告)日：2002-10-01

申请号：US09045115

申请日：1998-03-20

申请人： Kazuhisa Tsunoi ,  Hidehiko Kira ,  Shunji Baba ,  Akira Fujii ,  Toshihiro Kusagaya ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

发明人： Kazuhisa Tsunoi ,  Hidehiko Kira ,  Shunji Baba ,  Akira Fujii ,  Toshihiro Kusagaya ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

IPC分类号： B32B700

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/11 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81001 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/00

摘要： A method of mounting a semiconductor device having bumps on a board having pads so that each of the bumps is joined to a corresponding one of the pads is provided. Adhesive to be hardened by heat is provided between the semiconductor device and the board. The method includes the steps of pressing the bumps of the semiconductor device on the pads of the board, and heating a portion in which each of the bumps and a corresponding one of the pads are in contact with each other. A pressure of the bumps to the pads reaches a predetermined value before a temperature of the adhesive to which heat is supplied in the above step reaches a temperature at which the adhesive is hardened.

摘要翻译： 提供了一种将具有凸块的半导体器件安装在具有焊盘的板上，使得每个凸起接合到相应的一个焊盘的方法。 在半导体器件和电路板之间提供通过加热硬化的粘合剂。 该方法包括以下步骤：将半导体器件的凸起按压在板的焊盘上，并且加热其中每个凸块和相应的一个焊盘彼此接触的部分。 在上述步骤中供应热量的粘合剂的温度达到粘合剂硬化的温度之前，焊盘的凸块的压力达到预定值。

公开(公告)号：US06240634B1

公开(公告)日：2001-06-05

申请号：US09460727

申请日：1999-12-14

申请人： Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

发明人： Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

IPC分类号： H05K330

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/743 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75743 ,  H01L2224/75745 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/53178 ,  H01L2924/00

摘要： In a method of production of a multichip package module, rough-pitch bare chips are positioned at first locations on a printed-circuit board, and the rough-pitch bare chips are temporarily attached to the board at the first locations. The rough-pitch bare chips are mounted on the board at the same time by applying heat and pressure to the rough-pitch bare chips simultaneously. A respective one of fine-pitch bare chips is positioned at a respective one of second locations on the board other than the first locations, and the respective one of the fine-pitch bare chips is mounted on the board by applying heat and pressure to the fine-pitch bare chips individually, in order to produce the multichip package module.

摘要翻译： 在制造多芯片封装模块的方法中，将粗间距裸芯片定位在印刷电路板上的第一位置处，并且在第一位置将粗糙间距裸芯片暂时附接到板上。 通过同时向粗糙的裸芯片施加热量和压力，同时将粗糙的裸芯片安装在板上。 微细间距裸芯片中的相应一个位于除了第一位置之外的板上的第二位置中的相应一个处，并且通过向第一位置施加热和压力将精细间距裸芯片中的相应一个安装在板上 单芯片的裸芯片，以生产多芯片封装模块。

公开(公告)号：US6122823A

公开(公告)日：2000-09-26

申请号：US401985

申请日：1999-09-23

申请人： Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

发明人： Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

IPC分类号： H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L25/04 ,  H01L25/18 ,  H05K3/34

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/743 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75743 ,  H01L2224/75745 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/53178

摘要： In a method of production of a multichip package module, rough-pitch bare chips are positioned at first locations on a printed-circuit board, and the rough-pitch bare chips are temporarily attached to the board at the first locations. The rough-pitch bare chips are mounted on the board at the same time by applying heat and pressure to the rough-pitch bare chips simultaneously. A respective one of fine-pitch bare chips is positioned at a respective one of second locations on the board other than the first locations, and the respective one of the fine-pitch bare chips is mounted on the board by applying heat and pressure to the fine-pitch bare chips individually, in order to produce the multichip package module.

摘要翻译： 在制造多芯片封装模块的方法中，将粗间距裸芯片定位在印刷电路板上的第一位置处，并且在第一位置将粗糙间距裸芯片临时附接到板上。 通过同时向粗糙的裸芯片施加热量和压力，同时将粗糙的裸芯片安装在板上。 微细间距裸芯片中的相应一个位于除了第一位置之外的板上的第二位置中的相应一个处，并且通过向第一位置施加热和压力将精细间距裸芯片中的相应一个安装在板上 单芯片的裸芯片，以生产多芯片封装模块。

公开(公告)号：US6006426A

公开(公告)日：1999-12-28

申请号：US26490

申请日：1998-02-19

申请人： Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

发明人： Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

IPC分类号： H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L25/04 ,  H01L25/18 ,  H05K3/30

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/743 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75743 ,  H01L2224/75745 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/53178

摘要： In a method of production of a multichip package module, rough-pitch bare chips are positioned at first locations on a printed-circuit board, and the rough-pitch bare chips are temporarily attached to the board at the first locations. The rough-pitch bare chips are mounted on the board at the same time by applying heat and pressure to the rough-pitch bare chips simultaneously. A respective one of fine-pitch bare chips is positioned at a respective one of second locations on the board other than the first locations, and the respective one of the fine-pitch bare chips is mounted on the board by applying heat and pressure to the fine-pitch bare chips individually, in order to produce the multichip package module.

摘要翻译： 在制造多芯片封装模块的方法中，将粗间距裸芯片定位在印刷电路板上的第一位置处，并且在第一位置将粗糙间距裸芯片临时附接到板上。 通过同时向粗糙的裸芯片施加热量和压力，同时将粗糙的裸芯片安装在板上。 微细间距裸芯片中的相应一个位于除了第一位置之外的板上的第二位置中的相应一个处，并且通过向第一位置施加热和压力将精细间距裸芯片中的相应一个安装在板上 单芯片的裸芯片，以生产多芯片封装模块。

公开(公告)号：US08783174B2

公开(公告)日：2014-07-22

申请号：US12702695

申请日：2010-02-09

申请人： Ryo Mitta ,  Hiroyuki Otsuka ,  Ikuo Sakai ,  Kenji Abe ,  Naoki Ishikawa

发明人： Ryo Mitta ,  Hiroyuki Otsuka ,  Ikuo Sakai ,  Kenji Abe ,  Naoki Ishikawa

IPC分类号： B41M1/12 ,  B41F15/08

CPC分类号： B41F33/0081 ,  B41F15/0881 ,  B41F15/26 ,  B41M1/12 ,  B41M1/26 ,  B41M3/00 ,  B41P2233/52 ,  H01L31/022425 ,  H01L31/18 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/1216 ,  H05K2201/09918 ,  H05K2203/1476 ,  Y02E10/50

摘要： The method for screen printing improves accuracy during a plurality of screen printing steps. After a first layer and an alignment mark are printed on a workpiece, the alignment mark is imaged by a camera so that the alignment mark is stored as image data in an image processing device adapted to deliver reference data for subsequent printing, and the image data is used to renew the reference data in the image processing device.

摘要翻译： 丝网印刷方法在多个丝网印刷步骤期间提高了精度。 在工件上印刷第一层和对准标记之后，通过照相机对准标记成像，使得对准标记作为图像数据存储在适于传送用于后续打印的参考数据的图像处理装置中，并且图像数据 用于更新图像处理装置中的参考数据。