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公开(公告)号：US09971368B2
公开(公告)日：2018-05-15
申请号：US14963790
申请日：2015-12-09
Applicant: QUALCOMM Incorporated
Inventor： Rajat Mittal , Mehdi Saeidi , Arpit Mittal , Emil Rahim
CPC classification number: G05F1/463 , G01K13/00 , G06F1/206 , G06F1/3206
Abstract: In one embodiment, a temperature management system comprises a plurality of temperature sensors on a chip, and a temperature manager. The temperature manager is configured to receive a plurality of temperature readings from the temperature sensors, to determine a plurality of power values based on the temperature readings, to determine a plurality of temperature values based on the determined power values, the determined temperature values corresponding to a plurality of different locations on the chip, and to estimate a temperature of a hotspot on the chip based on the determined temperature values.
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公开(公告)号：US09746889B2
公开(公告)日：2017-08-29
申请号：US14709276
申请日：2015-05-11
Applicant: QUALCOMM Incorporated
Inventor： Rajat Mittal , Hee Jun Park , Peng Wang , Mehdi Saeidi , Arpit Mittal
IPC: H01L29/15 , H01L21/20 , G06F1/20 , H01L23/34 , H01L23/38 , H01L25/065 , H01L25/10 , G01K7/04 , G05D23/19 , H01L23/498 , H01L23/367
CPC classification number: G06F1/206 , G01K7/04 , G05D23/1906 , H01L23/34 , H01L23/3677 , H01L23/38 , H01L23/49811 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/1094 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
Abstract: A package-on-package (PoP) device includes a first package, a second package, and a bi-directional thermal electric cooler (TEC). The first package includes a first substrate and a first die coupled to the first substrate. The second package is coupled to the first package. The second package includes a second substrate and a second die coupled to the second substrate. The TEC is located between the first die and the second substrate. The TEC is adapted to dynamically dissipate heat back and forth between the first package and the second package. The TEC is adapted to dissipate heat from the first die to the second die in a first time period. The TEC is further adapted to dissipate heat from the second die to the first die in a second time period. The TEC is adapted to dissipate heat from the first die to the second die through the second substrate.
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23.发明申请公开(公告)号：US20170083063A1
公开(公告)日：2017-03-23
申请号：US14860127
申请日：2015-09-21
Applicant: QUALCOMM Incorporated
Inventor： Mehdi Saeidi , Melika Roshandell , Arpit Mittal , Farsheed Mahmoudi
Abstract: A method includes: receiving an electrical signal from a temperature sensor, wherein the temperature sensor is disposed within a package including a processor chip, further wherein the temperature sensor is thermally separated from the processor chip by materials within the package, generating temperature information from the electrical signal, processing the temperature information to determine that a performance of the processor chip should be mitigate, and mitigating the performance of the processor chip in response to the temperature information, wherein processing the temperature information and mitigating the performance of the processor are performed by the processor chip.
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公开(公告)号：US20170074729A1
公开(公告)日：2017-03-16
申请号：US14852350
申请日：2015-09-11
Applicant: QUALCOMM Incorporated
Inventor： Ryan Michael Coutts , Rajat Mittal , Mehdi Saeidi , Paul Ivan Penzes
CPC classification number: G01K13/00 , G05B15/02 , G06F1/04 , G06F1/206 , G06F1/3206 , G06F1/324 , G06F1/3296 , G06F11/3058 , G06F11/3093 , G06F2201/81 , Y02D10/126 , Y02D10/16
Abstract: In one embodiment, a temperature management system comprises a plurality of thermal sensors at different locations on a chip, and a temperature manager. The temperature manager is configured to receive a plurality of temperature readings from the thermal sensors, to fit a quadratic temperature model to the received temperature readings, and to estimate a hotspot temperature on the chip using the fitted quadratic temperature model.
Abstract translation: 在一个实施例中，温度管理系统包括在芯片上的不同位置处的多个热传感器和温度管理器。 温度管理器被配置为从热传感器接收多个温度读数，以将二次温度模型拟合到接收到的温度读数，并且使用拟合的二次温度模型来估计芯片上的热点温度。
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公开(公告)号：US20160216719A1
公开(公告)日：2016-07-28
申请号：US14603058
申请日：2015-01-22
Applicant: QUALCOMM, Incorporated
Inventor： Mehdi Saeidi , Rajat Mittal , Arpit Mittal , Ryan Michael Coutts
CPC classification number: G05D23/1917 , G01K3/08 , G01K3/10 , G05B15/02 , G06F1/206
Abstract: In one embodiment, a method of temperature control comprises receiving temperature readings from a temperature sensor on a chip, calculating one or more second derivatives of temperature with respect to time based on the temperature readings, and determining whether to perform temperature mitigation on the chip based on the one or more calculated second derivatives of temperature.
Abstract translation: 在一个实施例中，温度控制的方法包括从芯片上的温度传感器接收温度读数，基于温度读数计算温度相对于时间的一个或多个二次导数，以及确定是否在基于芯片的基础上执行温度降低 在一个或多个计算的温度的二阶导数上。
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Patent Agency Ranking
公开(公告)号：US10649503B2
公开(公告)日：2020-05-12
申请号：US15637901
申请日：2017-06-29
Applicant: QUALCOMM Incorporated
Inventor： Vivek Sahu , Mehdi Saeidi
IPC: G06F1/18 , H01L23/40 , H01L23/13 , H01L23/14 , H01L23/373 , H01L23/433 , H01L23/552 , H01L23/00 , H05K3/36 , H01L25/065 , H01L23/42 , H01L25/10 , H01L21/56 , H01L23/367
Abstract: A device that includes a die, a thermal interface material (TIM) coupled to the die, and an electromagnetic (EMI) shield coupled to the thermal interface material (TIM). The electromagnetic (EMI) shield is configured to compress the thermal interface material (TIM). The electromagnetic (EMI) shield comprises a flexible portion. In some implementations, the thermal interface material (TIM) is compressed by the electromagnetic (EMI) shield such that the thickness of the thermal interface material (TIM) is reduced by about at least 10˜20 percent.
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公开(公告)号：US10061331B2
公开(公告)日：2018-08-28
申请号：US14603058
申请日：2015-01-22
Applicant: QUALCOMM Incorporated
Inventor： Mehdi Saeidi , Rajat Mittal , Arpit Mittal , Ryan Michael Coutts
CPC classification number: G05D23/1917 , G01K3/08 , G01K3/10 , G05B15/02 , G06F1/206 , G06F1/3206 , G06F1/3243 , G06F1/3296
Abstract: In one embodiment, a method of temperature control comprises receiving temperature readings from a temperature sensor on a chip, calculating one or more second derivatives of temperature with respect to time based on the temperature readings, and determining whether to perform temperature mitigation on the chip based on the one or more calculated second derivatives of temperature.
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公开(公告)号：US09943008B2
公开(公告)日：2018-04-10
申请号：US15087864
申请日：2016-03-31
Applicant: QUALCOMM Incorporated
Inventor： Rajat Mittal , Mehdi Saeidi , Vivek Sahu , Ryan Coutts
CPC classification number: H05K7/2039 , H01L41/042 , H01L41/0926 , H01L41/0973 , H05K7/20445 , H05K7/20472
Abstract: An electronic device includes an integrated circuit, a flexible heat spreader, an actuator, and a controller. The actuator is coupled to the flexible heat spreader and the controller is configured to control the actuator between a first actuation mode and a second actuation mode. When in the first actuation mode, the actuator positions the flexible heat spreader with an air gap between the flexible heat spreader and the integrated circuit such that the flexible heat spreader is thermally separated from the integrated circuit to increase a thermal impedance between the flexible heat spreader and the integrated circuit. When in the second actuation mode, the actuator positions the flexible heat spreader in thermal contact with the integrated circuit without the air gap there between to reduce the thermal impedance between the flexible heat spreader and the integrated circuit.
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公开(公告)号：US09930769B2
公开(公告)日：2018-03-27
申请号：US14181187
申请日：2014-02-14
Applicant: QUALCOMM Incorporated
Inventor： Arpit Mittal , Alvin Leng Sun Loke , Mehdi Saeidi , Patrick Drennan
IPC: H01L29/00 , H05K1/02 , H01C1/08 , H01C1/01 , H01L49/02 , H01C1/084 , H01L23/522 , H01L23/367
CPC classification number: H05K1/0204 , H01C1/01 , H01C1/08 , H01C1/084 , H01L23/367 , H01L23/3677 , H01L23/5228 , H01L28/20 , H01L28/24 , H01L2924/0002 , H01L2924/00
Abstract: Metal thermal grounds are used for dissipating heat from integrated-circuit resistors. The resistors may be formed using a front end of line layer, for example, a titanium-nitride layer. A metal region (e.g., in a first metal layer) is located over the resistors to form a heat sink. An area of thermal posts connected to the metal region is also located over the resistor. The metal region can be connected to the substrate of the integrated circuit to provide a low impedance thermal path out of the integrated circuit.
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30.发明申请公开(公告)号：US20180011520A1
公开(公告)日：2018-01-11
申请号：US15205678
申请日：2016-07-08
Applicant: QUALCOMM Incorporated
Inventor： Mehdi Saeidi , Melika Roshandell , Rajat Mittal
CPC classification number: G06F1/206 , G01R31/00 , G06F1/203 , G06F1/3287 , G06F1/3296
Abstract: A method includes generating temperature information from a plurality of temperature sensors within a computing device; and processing the temperature information to generate voltage reduction steps based on an observed rate of change of the temperature information.
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