公开(公告)号：US07969741B2

公开(公告)日：2011-06-28

申请号：US12065177

申请日：2006-02-20

申请人： Haruo Hayakawa ,  Masahiro Ono ,  Seiji Yamaguchi ,  Yoshihiro Uda ,  Kazuhiro Shinchi ,  Satoru Tomekawa ,  Kiyoshi Nakanishi ,  Kosuke Kubota ,  Atsushi Katagiri ,  Motohisa Kotani ,  Kazuhiro Konishi ,  Eiji Nishimura ,  Takeo Matsuki

发明人： Haruo Hayakawa ,  Masahiro Ono ,  Seiji Yamaguchi ,  Yoshihiro Uda ,  Kazuhiro Shinchi ,  Satoru Tomekawa ,  Kiyoshi Nakanishi ,  Kosuke Kubota ,  Atsushi Katagiri ,  Motohisa Kotani ,  Kazuhiro Konishi ,  Eiji Nishimura ,  Takeo Matsuki

IPC分类号： H05K7/20

CPC分类号： H05K3/284 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/0218 ,  H05K1/0274 ,  H05K7/20463 ,  H05K9/0047 ,  H05K9/0086 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/10128 ,  H05K2201/10515 ,  H05K2201/2054 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2224/0401

摘要： It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. In the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.

摘要翻译： 旨在提供确保共同覆盖多个电子部件并能够减小，减薄和减少部件数量的树脂部件的屏蔽性和散热性的基板结构。 第一实施例的基板结构20设置有基板21，沿着基板21安装的多个电子部件22和覆盖电子部件22并与基板21紧密接触的树脂部25。 基板结构体20中，树脂部25设置有覆盖电子部件22并具有导热性和增强性的加强放热层26和覆盖加强放热层26的屏蔽层27以及覆盖加强放热层26的表面o28 屏蔽层27形成为与显示装置30的与树脂部25相邻的表面结构对应的规定形状。

公开(公告)号：US07759784B2

公开(公告)日：2010-07-20

申请号：US11196269

申请日：2005-08-04

申请人： Masahiro Ono ,  Shigeru Kondou ,  Kazuhiro Nishikawa ,  Kazuto Nishida

发明人： Masahiro Ono ,  Shigeru Kondou ,  Kazuhiro Nishikawa ,  Kazuto Nishida

IPC分类号： H01L23/02

CPC分类号： H05K1/183 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2924/1627 ,  H01L2924/3511 ,  H05K2201/0382 ,  H05K2201/10674 ,  H05K2201/2018 ,  H05K2203/0278

摘要： A 3D circuit module which is highly reliable, easily layered and able to mount electronic components in high density is obtained by providing a support member having a frame in the periphery thereof and a recess; a coating layer for coating the frame and filling in the recess, the coating layer being made of resin material which is adhesive and has a softening temperature lower than the softening temperature of the support member; a wiring pattern formed on the coating layer, the wiring pattern including a first land on the frame, a second land on the recess, and a wiring part for connecting between the first land and the second land; and an electronic component having a projecting electrode formed on a side thereof, the electronic component being bonded to the coating layer and accommodated in the recess, with the projecting electrode connected to the second land.

摘要翻译： 通过在其周边设置具有框架的支撑构件和凹部，获得高度可靠，容易分层并能够以高密度安装电子部件的3D电路模块; 用于涂覆所述框架并填充所述凹部的涂层，所述涂层由粘合剂并且具有低于所述支撑构件的软化温度的软化温度的树脂材料制成; 形成在所述涂层上的布线图案，所述布线图案包括所述框架上的第一平台，所述凹部上的第二平台，以及用于连接所述第一平台和所述第二平台之间的布线部分; 以及电子部件，其具有在其一侧形成的突出电极，所述电子部件被接合到所述涂层并容纳在所述凹部中，所述突出电极连接到所述第二焊盘。

公开(公告)号：US07697567B2

公开(公告)日：2010-04-13

申请号：US10345311

申请日：2003-01-16

申请人： Masahiro Ono ,  Yasuhiko Matsunaga

发明人： Masahiro Ono ,  Yasuhiko Matsunaga

IPC分类号： H04J3/16

CPC分类号： H04W28/14 ,  H04L47/10 ,  H04L47/14 ,  H04L47/2441 ,  H04L47/41 ,  H04L47/50 ,  H04L47/6215 ,  H04L47/626

摘要： In a packet repeater of a wireless base station, a packet analyzer receives uplink packets from mobile terminals and stores data indicating quality of each wireless link between the base station and each mobile terminal in a memory. A packet sorter receives downlink packets from a network and stores the received packets into buffers according to the destinations of downlink packets and their service classes. According to the data stored in the memory, packets in the buffers are into a first group of queues in which quality of service is not satisfied and a second group of queues in which quality of service is satisfied. A packet scheduler sequentially transmits all packets from the first-group queues to mobile terminals, and reorders the second-group queues in a descending order of their qualities of wireless links and sequentially transmits all packets from the reordered queues to the mobile terminals.

摘要翻译： 在无线基站的分组中继器中，分组分析器从移动终端接收上行分组，并存储表示基站与每个移动终端之间的每个无线链路的质量的数据。 分组排序器从网络接收下行链路分组，并根据下行链路分组的目的地及其服务类别将接收的分组存储到缓冲器中。 根据存储在存储器中的数据，缓冲器中的数据包进入不满足服务质量的第一组队列和满足服务质量的第二组队列。 分组调度器顺序地将所有分组从第一组队列发送到移动终端，并且以其无线链路的质量的降序重新排序第二组队列，并且将所有分组从重新排序的队列顺序地发送到移动终端。

公开(公告)号：US20100044100A1

公开(公告)日：2010-02-25

申请号：US12065042

申请日：2006-08-03

申请人： Masahiro Ono ,  Yosihiro Uda ,  Seiji Yamaguchi ,  Kazuhiro Shinchi ,  Satoru Tomekawa

发明人： Masahiro Ono ,  Yosihiro Uda ,  Seiji Yamaguchi ,  Kazuhiro Shinchi ,  Satoru Tomekawa

IPC分类号： H01L23/28

CPC分类号： H05K3/284 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K7/20463 ,  H05K9/0083 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2201/2018 ,  H01L2224/0401

摘要： A substrate structure whereby a resin part for coating a plurality of electronic components by one operation is given a shielding property and the mounting strength of electronic components with respect to the substrate is secured and an electronic device including the substrate structure are provided.A substrate structure 10 includes a substrate 11, a plurality of electronic components 12 mounted along the substrate 11, and a resin part 13 coating each electronic component 12 with a resin 18 while kept in close contact with the substrate 11. The substrate structure 10 includes a frame body 15 surrounding each electronic component 12 while kept in close contact with the substrate 11 and a lid part 17 closing an opening 16 in the frame body 15, and a resin 18 is filled inside the frame body 15.

摘要翻译： 具有通过一次操作涂覆多个电子部件的树脂部件的基板结构被确定，并且确保了电子部件相对于基板的安装强度，并且提供了包括该基板结构的电子设备。 基板结构10包括基板11，沿着基板11安装的多个电子部件12以及与基板11保持紧密接触的，用树脂18涂覆各电子部件12的树脂部13。 同时保持与基板11紧密接触的每个电子部件12的框体15和封闭框体15中的开口16的盖部17，并且树脂18填充在框体15的内部。

公开(公告)号：US20070208033A1

公开(公告)日：2007-09-06

申请号：US11704860

申请日：2007-02-09

申请人： Toru Yamazaki ,  Shigeyuki Kikumoto ,  Masahiro Ono ,  Atsushi Saitou ,  Haruka Takahashi ,  Sei Kumakura ,  Kunitaka Hirose ,  Mikiro Yanaka ,  Yoshiyuki Takemura ,  Shigeru Suzuki ,  Ryo Matsui

发明人： Toru Yamazaki ,  Shigeyuki Kikumoto ,  Masahiro Ono ,  Atsushi Saitou ,  Haruka Takahashi ,  Sei Kumakura ,  Kunitaka Hirose ,  Mikiro Yanaka ,  Yoshiyuki Takemura ,  Shigeru Suzuki ,  Ryo Matsui

IPC分类号： A61K31/497 ,  A61K31/4709 ,  A61K31/4439 ,  A61K31/433 ,  A61K31/4196 ,  A61K31/4184 ,  A61K31/4178 ,  C07D403/02

CPC分类号： C07D233/64 ,  C07D401/12 ,  C07D401/14 ,  C07D403/12 ,  C07D403/14 ,  C07D405/14 ,  C07D417/12 ,  C07D417/14

摘要： It is intended to provide novel amine compounds which are efficacious against diseases such as infection with HIV virus, rheumatism and cancer metastasis. Namely, amine compounds represented by the following general formula (1): In a typical case, A1 and A2 represent each an optionally substituted monocyclic or polycyclic aromatic heterocycle; W represents cyclic C3-10 alkylene, an optionally substituted monocyclic or polycyclic aromatic heterocycle, a monocyclic or polycyclic aromatic ring or a partly saturated polycyclic aromatic ring; X represents O, CH2, C(═O) or NR11; and D is a group represented by the following general formula (4) or (6). In the formula (6), Q represents a single bond, S, O or NR12; and Y is a group represented by the following general formula (7). z represents an optionally substituted monocyclic or polycyclic aromatic ring. In the formula (6), B represents NR25R26. In the above formulae, R1 to R26 each represents hydrogen, alkyl, alkenyl or alkynyl.

摘要翻译： 旨在提供对HIV病毒感染，风湿病和癌症转移等疾病有效的新型胺化合物。 即，由以下通式（1）表示的胺化合物：在典型情况下，A1和A2各自表示任选取代的单环或多环芳族杂环; W表示环状C 3-10亚烷基，任选取代的单环或多环芳族杂环，单环或多环芳环或部分饱和多环芳环; X表示O，CH 2，C（-O）或NR 11; D为由以下通式（4）或（6）表示的基团。 在式（6）中，Q表示单键，S，O或NR 12; Y为由以下通式（7）表示的基团。 z表示任选取代的单环或多环芳环。 式（6）中，B表示NR25R26。 在上式中，R 1至R 26各自表示氢，烷基，烯基或炔基。

公开(公告)号：US20060038274A1

公开(公告)日：2006-02-23

申请号：US11196269

申请日：2005-08-04

申请人： Masahiro Ono ,  Shigeru Kondou ,  Kazuhiro Nishikawa ,  Kazuto Nishida

发明人： Masahiro Ono ,  Shigeru Kondou ,  Kazuhiro Nishikawa ,  Kazuto Nishida

IPC分类号： H01L23/02

CPC分类号： H05K1/183 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2924/1627 ,  H01L2924/3511 ,  H05K2201/0382 ,  H05K2201/10674 ,  H05K2201/2018 ,  H05K2203/0278

摘要： A 3D circuit module which is highly reliable, easily layered and able to mount electronic components in high density is obtained by providing a support member having a frame in the periphery thereof and a recess; a coating layer for coating the frame and filling in the recess, the coating layer being made of resin material which is adhesive and has a softening temperature lower than the softening temperature of the support member; a wiring pattern formed on the coating layer, the wiring pattern including a first land on the frame, a second land on the recess, and a wiring part for connecting between the first land and the second land; and an electronic component having a projecting electrode formed on a side thereof, the electronic component being bonded to the coating layer and accommodated in the recess, with the projecting electrode connected to the second land.

摘要翻译： 通过在其周边设置具有框架的支撑构件和凹部，获得高度可靠，容易分层并能够以高密度安装电子部件的3D电路模块; 用于涂覆所述框架并填充所述凹部的涂层，所述涂层由粘合剂并且具有低于所述支撑构件的软化温度的软化温度的树脂材料制成; 形成在所述涂层上的布线图案，所述布线图案包括所述框架上的第一平台，所述凹部上的第二平台，以及用于连接所述第一平台和所述第二平台之间的布线部分; 以及电子部件，其具有在其一侧形成的突出电极，所述电子部件被接合到所述涂层并容纳在所述凹部中，所述突出电极连接到所述第二焊盘。

公开(公告)号：US20050260867A1

公开(公告)日：2005-11-24

申请号：US11118403

申请日：2005-05-02

申请人： Masahiro Ono ,  Shigeru Kondou ,  Kazuhiro Nishikawa ,  Kazuto Nishida ,  Hiroyuki Inoue ,  Osamu Miyazaki ,  Hiroshi Takeda ,  Tsuneyuki Ejima

发明人： Masahiro Ono ,  Shigeru Kondou ,  Kazuhiro Nishikawa ,  Kazuto Nishida ,  Hiroyuki Inoue ,  Osamu Miyazaki ,  Hiroshi Takeda ,  Tsuneyuki Ejima

IPC分类号： H01R12/00 ,  H01R13/24 ,  H01R33/76 ,  H05K1/14

CPC分类号： H05K1/144 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01R12/52 ,  H05K3/3426 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/2018

摘要： The present invention includes a plurality of lead terminals made of a conductive material having spring elasticity; and insulative housing that buries a part of the region of lead terminal and fixedly retains a plurality of lead terminals in an arrangement having been set in advance. Lead terminal is composed of a buried part that is a part of lead terminal buried in housing; bottom end joint that is extended from one end of the buried part, is exposed through bottom end surface of housing, and extracted in width direction of bottom end surface; and flexibly changing part that is exposed from another end of the buried part through one wall surface orthogonal to bottom end surface, and is extended along this wall surface to top end surface facing to bottom end surface, being spaced from wall surface and top end surface.

摘要翻译： 本发明包括由具有弹性弹性的导电材料制成的多个引线端子; 绝缘壳体，其埋设引线端子区域的一部分，并且在预先设置的布置中固定地保持多个引线端子。 引线端子由掩埋在壳体中的引线端子的一部分构成; 从埋藏部分的一端延伸的底端接头通过壳体的底端表面暴露，并在底端表面的宽度方向上提取; 以及通过与底端表面正交的一个壁面暴露于埋藏部分的另一端的柔性变化部分，并且沿着该壁表面延伸到面向底端表面的顶端表面，与壁表面和顶端表面间隔开 。

公开(公告)号：US06909180B2

公开(公告)日：2005-06-21

申请号：US10030739

申请日：2001-05-11

申请人： Masahiro Ono ,  Tsukasa Shiraishi

发明人： Masahiro Ono ,  Tsukasa Shiraishi

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/498 ,  H05K3/32 ,  H01L23/495

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/31 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/13318 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/1336 ,  H01L2224/13364 ,  H01L2224/13369 ,  H01L2224/13386 ,  H01L2224/1339 ,  H01L2224/13444 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/321 ,  Y10T156/1056 ,  Y10T428/24917 ,  Y10T428/24983 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29347 ,  H01L2224/29344 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29318 ,  H01L2224/29444 ,  H01L2224/05599

摘要： The invention is intended for providing a semiconductor package structure which prevents degradation in characteristics of a semiconductor device, and breakage of interconnections, when the semiconductor device is packaged on a circuit substrate. In the package structure having the semiconductor device mounted on the circuit substrate, bump electrodes of the semiconductor device are placed on input/output terminal electrodes of the circuit substrate and are electrically and mechanically connected thereto by bonding with a conductive adhesive, and the semiconductor device is bonded and fixed to the circuit substrate by a resin film formed previously on a surface of a main body of the circuit substrate. The structure does no damage to a semiconductor functional part and to interconnections, and allows mounting with a lower load as compared to structures using conventional anisotropic conductive films and the like.

摘要翻译： 本发明旨在提供一种当将半导体器件封装在电路基板上时，防止半导体器件的特性劣化以及互连断裂的半导体封装结构。 在具有安装在电路基板上的半导体器件的封装结构中，半导体器件的突起电极被放置在电路基板的输入/输出端子电极上，并通过与导电粘合剂结合而电连接和机械连接，半导体器件 通过预先形成在电路基板的主体的表面上的树脂膜粘结固定在电路基板上。 与使用常规的各向异性导电膜等的结构相比，该结构不会损坏半导体功能部件和互连，并且允许以较低的负载进行安装。

公开(公告)号：US06696907B1

公开(公告)日：2004-02-24

申请号：US09926155

申请日：2001-09-14

申请人： Hitoshi Iwaya ,  Shinichiro Ito ,  Minoru Anbo ,  Masahiro Ono

发明人： Hitoshi Iwaya ,  Shinichiro Ito ,  Minoru Anbo ,  Masahiro Ono

IPC分类号： H01J2970

CPC分类号： H01J29/762 ,  H01J29/76 ,  H01J2229/7031 ,  H01J2229/7032

摘要： A deflecting yoke core with which magnetic saturation is prevented by optimizing the relationship between the core sectional area and the density of the magnetic flux distribution. The deflecting yoke core to be mounted between a neck and a funnel of a cathode ray tube has a hole 2 extending from an opening end of a neck portion 3 to an opening end of a funnel portion 1. The hole 2 at the funnel portion 1 widens toward the opening end of the funnel portion 1. An outer shape at the opening end of the funnel portion 1 has a short diameter Dx1 along a minor axis X and a long diameter Dy1 along a major axis Y. Core sectional areas along a plane parallel to and passing through a core axis O1 are largest within an angular range of 30° to 65° measured around the core axis O1 from a 0° reference angle at the minor axis X.

摘要翻译： 通过优化磁芯截面积和磁通分布密度之间的关系来防止磁饱和的偏转轭铁芯。 安装在阴极射线管的颈部和漏斗之间的偏转轭芯具有从颈部3的开口端延伸到漏斗部1的开口端的孔2.漏斗部1的孔2 在漏斗部分1的开口端处变宽。在漏斗部分1的开口端处的外形沿着短轴X具有短径Dx1和沿长轴Y的长直径Dy1。沿着平面的核心截面积 平行于芯线轴线O1并且穿过芯轴线O1在从轴0的0°基准角处绕芯轴线O1测量的30°至65°的角度范围内最大。

公开(公告)号：US6000572A

公开(公告)日：1999-12-14

申请号：US758569

申请日：1996-12-03

申请人： Junichiro Kako ,  Shigeru Yabuya ,  Minoru Shibata ,  Masahiro Ono

发明人： Junichiro Kako ,  Shigeru Yabuya ,  Minoru Shibata ,  Masahiro Ono

IPC分类号： B60R7/04 ,  B25H3/02 ,  B65D85/00

CPC分类号： B25H3/023

摘要： A console box for storing small articles includes a box body, an outer lid pivotally mounted for opening and closing the box body and an inner lid disposed between the box body and the outer lid. The box body has a first space for storing small articles. The outer lid pivots within a first angle with respect to the box body. The outer lid is box-shaped and has a second space inside. The inner lid has a third space for storing other small articles. The inner lid is located in the second space of the outer lid when the outer lid is closed. The inner lid pivots in accordance with the movement of the outer lid to a second angle that is smaller than the first angle with respect to the box body. The box body according to the present invention may have a stopper for limiting a maximum opening angle of the outer lid.

摘要翻译： 用于存放小物品的控制箱包括一个箱体，一个用于打开和关闭箱体的枢轴安装的外盖和一个设置在箱体和外盖之间的内盖。 盒体具有用于存储小物品的第一空间。 外盖相对于箱体在第一角度内枢转。 外盖是箱形的，内部有第二个空间。 内盖具有用于存储其他小物品的第三空间。 当外盖关闭时，内盖位于外盖的第二空间中。 内盖根据外盖的移动相对于相对于箱体小于第一角度的第二角度而枢转。 根据本发明的箱体可以具有用于限制外盖的最大开启角度的止动件。