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公开(公告)号:US20240363675A1
公开(公告)日:2024-10-31
申请号:US18767003
申请日:2024-07-09
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Jong Hyeon CHAE , Seong Gyu JANG , Ho Joon LEE , Chang Yeon KIM , Chung Hoon LEE
IPC: H01L27/15 , H01L25/065 , H01L25/075 , H01L25/11 , H01L25/13 , H01L33/00 , H01L33/10 , H01L33/38 , H01L33/40 , H01L33/42 , H01L33/50 , H01L33/62 , H10K10/84 , H10K50/813 , H10K50/818 , H10K50/822 , H10K50/828 , H10K59/32 , H10K59/35
CPC classification number: H01L27/156 , H01L25/0756 , H01L25/13 , H01L33/0093 , H01L33/10 , H01L33/405 , H01L33/42 , H01L33/507 , H01L33/62 , H01L25/0655 , H01L25/0753 , H01L25/115 , H01L33/38 , H01L33/382 , H10K10/84 , H10K50/813 , H10K50/818 , H10K50/822 , H10K50/828 , H10K59/32 , H10K59/35
Abstract: A light emitting diode (LED) stack for a display including a first LED stack including a first conductivity-type semiconductor layer and a second conductivity-type semiconductor layer, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, an intermediate bonding layer disposed between the first LED stack and the second LED stack to bond the second LED stack to the first LED stack, an upper bonding layer disposed between the second LED stack and the third LED stack to couple the third LED stack to the second LED stack, and a first hydrophilic material layer disposed between the first LED stack and the upper bonding layer.
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公开(公告)号:US20230025374A1
公开(公告)日:2023-01-26
申请号:US17960097
申请日:2022-10-04
Applicant: Seoul Viosys Co., Ltd.
Inventor: Jong Min JANG , Chang Yeon KIM , Myoung Hak YANG
Abstract: A light emitting device includes a first light emitting part including a first n-type semiconductor layer, and a first mesa structure including a first active layer, a first p-type semiconductor layer, and a first transparent electrode vertically stacked one over another and exposing a portion of a first surface of the first n-type semiconductor layer, a second light emitting part spaced apart from the first mesa structure, and including a second n-type semiconductor layer, a second active layer, a second p-type semiconductor layer, and a second transparent electrode and exposing a portion of a first surface of the second n-type semiconductor layer, and a first bonding layer on which the first and second light emitting parts are disposed and electrically coupling the first n-type semiconductor layer and the second n-type semiconductor layer to each other.
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公开(公告)号:US20210351230A1
公开(公告)日:2021-11-11
申请号:US17366462
申请日:2021-07-02
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Jong Hyeon CHAE , Chung Hoon LEE , Seong Gyu JANG , Chang Yeon KIM , Ho Joon LEE
Abstract: A light emitting diode (LED) stack for a display including a substrate, a first LED stack disposed on the substrate, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, a first color filter interposed between the first LED stack and the second LED stack, and a second color filter interposed between the second LED stack and the third LED stack, in which the second LED stack and the third LED stack are configured to transmit light generated from the first LED stack to the outside, and the third LED stack is configured to transmit light generated from the second LED stack to the outside.
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公开(公告)号:US20210126174A1
公开(公告)日:2021-04-29
申请号:US17076750
申请日:2020-10-21
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Jong Min JANG , Chang Yeon KIM
IPC: H01L33/62 , H01L33/24 , H01L25/075 , H01L33/00 , H01L33/56
Abstract: A light emitting device including a first light emitting stack, a second light emitting stack, and a third light emitting stack each including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, a first adhesive layer bonding the first light emitting stack and the second light emitting stack, and a second adhesive layer bonding the second light emitting stack and the third light emitting stack, in which the second light emitting stack is disposed between the first light emitting stack and the third light emitting stack, and one of the first adhesive layer and the second adhesive layer electrically connects adjacent light emitting stacks.
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公开(公告)号:US20210082887A1
公开(公告)日:2021-03-18
申请号:US17020834
申请日:2020-09-15
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Jong Min JANG , Chang Yeon KIM
IPC: H01L25/075 , H01L33/62 , H01L23/00
Abstract: A light emitting device for a display including a first LED sub-unit, a second LED sub-unit disposed on the first LED sub-unit, and a third LED sub-unit disposed on the second LED sub-unit, in which the third LED sub-unit is configured to emit light having a shorter wavelength than that of light emitted from the first LED sub-unit, and to emit light having a longer wavelength than that of light emitted from the second LED sub-unit.
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公开(公告)号:US20210074889A1
公开(公告)日:2021-03-11
申请号:US17099781
申请日:2020-11-17
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Jong Min JANG , Chang Yeon KIM
Abstract: A light emitting device including a first light emitting part including a first n-type semiconductor layer, a first active layer, a first p-type semiconductor layer, and a first transparent electrode, a second light emitting part disposed over the first light emitting part and including a second n-type semiconductor layer, a second active layer, a second p-type semiconductor layer, and a second transparent electrode, and a third light emitting part disposed over the second light emitting part and including a third n-type semiconductor layer, a third active layer, a third p-type semiconductor layer, and a third transparent electrode, in which the light emitting device has substantially a quadrangular shape when viewed from the top, and has first to fourth corners, and a length between first and second corners of the third light emitting part is less than a length between third and fourth corners of the third light emitting part.
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公开(公告)号:US20200066691A1
公开(公告)日:2020-02-27
申请号:US16673184
申请日:2019-11-04
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Jong Hyeon CHAE , Chang Yeon KIM , Seong Gyu JANG , Ho Joon LEE , Jong Min JANG , Dae Sung CHO
IPC: H01L25/075 , H01L33/50 , H01L33/08 , H01L33/38
Abstract: A light emitting device for a display includes a pixel region including first, second, and third LED stacks, an adhesive layer disposed between the first and second LED stacks, or between the second and third LED stacks, a metal bonding layer at least partially surrounded by the adhesive layer, and disposed between and is electrically connected to the first and second LED stacks, or the second and third LED stacks, and a common electrode pad connected to the first, second, and third LED stacks, first, second, and third electrode pads connected to the first, second, and third LED stacks, respectively, and the first, second, and third LED stacks are configured to be independently driven using the electrode pads.
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公开(公告)号:US20190189867A1
公开(公告)日:2019-06-20
申请号:US16266717
申请日:2019-02-04
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Jong Hyeon CHAE , Jong Min JANG , Won Young ROH , Dae Woong SUH , Min Woo KANG , Joon Sub LEE , Hyun A. KIM , Kyoung Wan KIM , Chang Yeon KIM
Abstract: An LED is provided to include: a first conductive type semiconductor layer; an active layer positioned over the first conductive type semiconductor layer; a second conductive type semiconductor layer positioned over the active layer; and a defect blocking layer comprising a masking region to cover at least a part of the top surface of the second conductive semiconductor layer and an opening region to partially expose the top surface of the second conductive type semiconductor layer, wherein the active layer and the second conductive type semiconductor layer are disposed to expose a part of the first conductive type semiconductor layer, and wherein the defect blocking layer comprises a first region and a second region surrounding the first region, and a ratio of the area of the opening region to the area of the masking region in the first region is different from a ratio of the area of the opening region to the area of the masking region in the second region.
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公开(公告)号:US20170279020A1
公开(公告)日:2017-09-28
申请号:US15514492
申请日:2015-09-14
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Chang Yeon KIM , Ju Yong PARK , Sung Su SON
IPC: H01L33/62 , H01L33/38 , H01L33/46 , H01L23/00 , H01L33/32 , H01L33/06 , H01L33/00 , H01L33/64 , H01L33/50
CPC classification number: H01L33/62 , H01L24/11 , H01L24/13 , H01L33/007 , H01L33/0079 , H01L33/06 , H01L33/32 , H01L33/38 , H01L33/382 , H01L33/46 , H01L33/486 , H01L33/502 , H01L33/647 , H01L2224/11318 , H01L2224/1132 , H01L2224/11505 , H01L2224/13239 , H01L2224/13244 , H01L2224/13247 , H01L2224/13269 , H01L2224/1329 , H01L2924/12041 , H01L2933/0016 , H01L2933/0025 , H01L2933/0041 , H01L2933/0066 , H01L2933/0075 , H01L2933/0091
Abstract: Provided are a light emitting device and a method of fabricating the same. The light emitting device includes: a light emitting structure including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer and including a first surface and a second surface; first and second contact electrodes each ohmic-contacting the first and second conductivity type semiconductor layers; and first and second electrodes disposed on the first surface of the light emitting structure, in which the first and second electrodes each include sintered metal particles and the first and second electrodes each include inclined sides of which the tangential gradients with respect to sides of vertical cross sections thereof are changing.
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公开(公告)号:US20140138702A1
公开(公告)日:2014-05-22
申请号:US14085876
申请日:2013-11-21
Applicant: SEOUL VIOSYS CO., LTD.
Inventor: Joo Won CHOI , Chang Yeon KIM , Jeong Hoon HEO , Young Wug KIM , Su Yeon HONG , Sang Wan RYU
CPC classification number: H01L21/02032 , H01L21/02013 , H01L21/02019 , H01L29/2003 , H01L33/007 , H01L33/0079
Abstract: Exemplary embodiments of the present invention provide a substrate recycling method and a recycled substrate. The method includes separating a substrate having a first surface from an epitaxial layer, performing a first etching of the first surface using electrochemical etching, and performing, after the first etching, a second etching of the first surface using chemical etching, dry etching, or performing, after the first etching, chemical mechanical polishing of the first surface.
Abstract translation: 本发明的示例性实施方案提供了基材回收方法和再循环基材。 该方法包括将具有第一表面的衬底与外延层分离,使用电化学蚀刻来执行第一表面的第一蚀刻,以及在第一蚀刻之后,使用化学蚀刻,干蚀刻或 在第一次蚀刻之后进行第一表面的化学机械抛光。
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