公开(公告)号：US20140112617A1

公开(公告)日：2014-04-24

申请号：US14145807

申请日：2013-12-31

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alberto PAGANI ,  Alessando MOTTA ,  Sara LOI ,  Guido CHIARETTI

IPC: G02B6/12

CPC classification number: G02B6/12002 ,  G02B6/12004 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/43 ,  H01L31/02327 ,  H01L31/103 ,  H01L31/125

Abstract: An integrated electronic device, delimited by a first surface and by a second surface and including: a body made of semiconductor material, formed inside which is at least one optoelectronic component chosen between a detector and an emitter; and an optical path which is at least in part of a guided type and extends between the first surface and the second surface, the optical path traversing the body. The optoelectronic component is optically coupled, through the optical path, to a first portion of free space and a second portion of free space, which are arranged, respectively, above and underneath the first and second surfaces.

公开(公告)号：US20210104626A1

公开(公告)日：2021-04-08

申请号：US17017565

申请日：2020-09-10

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alessandro Paolo BRAMANTI ,  Alberto PAGANI ,  Antonello SANTANGELO

IPC: H01L29/78 ,  H01L43/06 ,  H01L29/417 ,  H01L49/02 ,  H01L43/14 ,  H03K17/687 ,  G01R33/07

Abstract: Various embodiments of the present disclosure provide a power device including at least one first conductive element adapted to generate a magnetic field when traversed by a current, and characterised in that it further comprises a Hall sensor electrically insulated from the first conductive element. The sensor and the first conductive element are mutually arranged so as to detect said magnetic field indicative of the current that traverses the first conductive element.

公开(公告)号：US20190244948A1

公开(公告)日：2019-08-08

申请号：US16389475

申请日：2019-04-19

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto PAGANI

IPC: H01L27/02 ,  H01L23/00 ,  H01L25/10 ,  H01L21/683 ,  H01L23/66 ,  H01L23/48 ,  H01L23/31 ,  H05K1/18 ,  H01L25/065 ,  H01L21/768

CPC classification number: H01L27/0203 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/768 ,  H01L22/22 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/49833 ,  H01L23/66 ,  H01L24/02 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/09 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/94 ,  H01L24/95 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68304 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/6677 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/02321 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05569 ,  H01L2224/06187 ,  H01L2224/08137 ,  H01L2224/08146 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/14183 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2105 ,  H01L2224/211 ,  H01L2224/28105 ,  H01L2224/29024 ,  H01L2224/30183 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48 ,  H01L2224/48091 ,  H01L2224/48175 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73251 ,  H01L2224/82106 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2225/06531 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06596 ,  H01L2225/1023 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15159 ,  H01L2924/207 ,  H05K1/181 ,  H05K1/189 ,  H05K2201/10515 ,  Y02P70/611 ,  H01L2224/02 ,  H01L2224/08 ,  H01L2224/16 ,  H01L2224/32 ,  H01L2224/19 ,  H01L2924/00

Abstract: An electronic system supports superior coupling by implementing a communication mechanism that provides at least for horizontal communication for example, on the basis of wired and/or wireless communication channels, in the system. Hence, by enhancing vertical and horizontal communication capabilities in the electronic system, a reduced overall size may be achieved, while nevertheless reducing complexity in printed circuit boards coupled to the electronic system. In this manner, overall manufacturing costs and reliability of complex electronic systems may be enhanced.

公开(公告)号：US20180226307A1

公开(公告)日：2018-08-09

申请号：US15943076

申请日：2018-04-02

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto PAGANI

IPC: H01L21/66 ,  G01R31/28 ,  H01L21/768 ,  H01L23/48 ,  H01L29/861

CPC classification number: H01L22/34 ,  G01R31/2853 ,  G01R31/2884 ,  H01L21/76898 ,  H01L22/14 ,  H01L23/481 ,  H01L29/8613

Abstract: A substrate includes first and second semiconductor layers doped with opposite conductivity type in contact with each other at a PN junction to form a junction diode. At least one through silicon via structure, formed by a conductive region surrounded laterally by an insulating layer, extends completely through the first semiconductor layer and partially through the second semiconductor layer with a back end embedded in, and in physical and electrical contact with, the second semiconductor layer. A first electrical connection is made to the first through silicon via structure and a second electrical connection is made to the first semiconductor layer. A testing current is applied to and sensed at the first and second electrical connections in order to detect a defect in the at least one through silicon via structure.

公开(公告)号：US20140375398A1

公开(公告)日：2014-12-25

申请号：US14479089

申请日：2014-09-05

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alberto PAGANI

IPC: H01F38/14 ,  H02J17/00 ,  H04B5/00 ,  H01P5/04

CPC classification number: H01F38/14 ,  H01F2038/146 ,  H02J17/00 ,  H02J50/05 ,  H02J50/10 ,  H02J50/40 ,  H02J50/70 ,  H02J50/80 ,  H04B5/0012 ,  H04B5/0037 ,  H04B5/0075 ,  H04B5/0093

Abstract: An embodiment of an electronic system includes a first electronic circuit and a second electronic circuit. The electronic system further includes a resonant LC circuit having a resonance frequency for coupling the first electronic circuit and the second electronic circuit; each electronic circuit includes functional means for providing a signal at the resonance frequency to be transmitted to the other electronic circuit through the LC circuit andor for receiving the signal from the other electronic circuit. The LC circuit also include capacitor means having at least one first capacitor plate included in the first electronic circuit and at least one second capacitor plate included in the second electronic circuit. The LC circuit further includes first inductor means included in the first electronic circuit andor second inductor means included in the second electronic circuit. The at least one capacitor plate of each electronic circuit is coupled with the corresponding functional means through the possible corresponding inductor means.

Abstract translation: 电子系统的实施例包括第一电子电路和第二电子电路。 电子系统还包括具有用于耦合第一电子电路和第二电子电路的谐振频率的谐振LC电路; 每个电子电路包括用于以谐振频率提供要通过LC电路传输到另一电子电路的信号的功能装置，并且用于从另一电子电路接收信号。 LC电路还包括具有包括在第一电子电路中的至少一个第一电容器板和包含在第二电子电路中的至少一个第二电容器板的电容器装置。 LC电路还包括包括在第一电子电路中的第一电感器装置和包括在第二电子电路中的第二电感器装置。 每个电子电路的至少一个电容器板通过可能的相应的电感器装置与相应的功能装置耦合。

公开(公告)号：US20140347244A1

公开(公告)日：2014-11-27

申请号：US14283326

申请日：2014-05-21

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto PAGANI ,  Alessandro FINOCCHIARO ,  Giovanni GIRLANDO

IPC: H01Q21/00 ,  H02J5/00 ,  H01Q7/00

CPC classification number: H01Q21/00 ,  G06K19/07773 ,  G06K19/07794 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01Q7/00 ,  H01Q9/065 ,  H01Q9/24 ,  H02J50/20

Abstract: An electronic device for electromagnetic expansion and concentration is described, including: —a module to be monitored including a first antenna and an integrated control circuitry, the first antenna being electrically coupled to the integrated control circuitry; an electromagnetic expansion and concentration module comprising a second antenna configured to communicate with a remote antenna of an external data collection and control device, relative to the electromagnetic expansion and concentration module, by an electromagnetic coupling, said electromagnetic expansion and concentration module comprising a third antenna electrically coupled to said second antenna, said third antenna being configured to communicate with said first antenna of the module to be monitored by a near-field magnetic coupling. The second antenna is configured to communicate with said remote antenna, relative to the electromagnetic expansion and concentration module by a far-field electromagnetic coupling. The electromagnetic expansion and concentration module further comprises a fourth antenna electrically coupled between said second antenna and said third antenna, said fourth antenna being configured to communicate with a further remote antenna of a further external data collection and control device, relative to the electromagnetic expansion and concentration module by a near-field magnetic coupling.

Abstract translation: 描述了用于电磁膨胀和集中的电子设备，包括： - 待监控的模块，包括第一天线和集成控制电路，所述第一天线电耦合到所述集成控制电路; 一种电磁膨胀和浓度模块，包括第二天线，其被配置为通过电磁耦合与外部数据收集和控制装置相对于电磁膨胀和浓缩模块与远程天线进行通信，所述电磁膨胀和集中模块包括第三天线 电耦合到所述第二天线，所述第三天线被配置为通过近场磁耦合与待监视的模块的所述第一天线通信。 第二天线被配置为通过远场电磁耦合相对于电磁膨胀和浓度模块与所述远程天线进行通信。 电磁膨胀和浓度模块还包括电耦合在所述第二天线和所述第三天线之间的第四天线，所述第四天线被配置为与另外的外部数据收集和控制装置的远程天线相对于电磁膨胀进行通信， 浓度模块通过近场磁耦合。

公开(公告)号：US20140084909A1

公开(公告)日：2014-03-27

申请号：US14027940

申请日：2013-09-16

Applicant: STMICROELECTRONICS S.R.L

Inventor： Alberto PAGANI

IPC: G01N27/72

CPC classification number: G01N27/82 ,  G01N27/72 ,  G01N33/381 ,  G01N33/383 ,  Y10T29/49018 ,  Y10T29/4902

Abstract: A building structure includes a block of building material and a magnetic circuit buried in the block of building material. The structure also includes a plurality of sensing devices buried in the block of building material. Each sensing device may include a contactless power supplying circuit magnetically coupled with the magnetic circuit to generate a supply voltage when the magnetic circuit is subject to a variable magnetic field.

Abstract translation: 建筑结构包括建筑材料块和埋在建筑材料块中的磁路。 该结构还包括埋在建筑材料块中的多个感测装置。 每个感测装置可以包括与磁路磁耦合的非接触供电电路，以在磁路经受可变磁场时产生电源电压。

公开(公告)号：US20140083206A1

公开(公告)日：2014-03-27

申请号：US14027990

申请日：2013-09-16

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alberto PAGANI ,  Federico Giovanni ZIGLIOLI

IPC: G01L1/00

CPC classification number: G01L1/005 ,  G01N33/38 ,  H05K1/0239 ,  H05K1/0278 ,  H05K1/189 ,  H05K2201/09081 ,  H05K2201/10098 ,  H05K2201/10151 ,  Y10T156/1051

Abstract: A planar electric circuit board may include a planar support of a foldable material defining a base surface and wings coupled to the base surface along respective folding lines so that the wings, when folded along the folding lines, are erected with respect to the base surface and remain in that position. An auxiliary circuit is on the planar support and may include pairs of capacitive coupling plates defined on the wings and on the base surface, and electric communication lines coupled to corresponding ones of the pairs of capacitive coupling plates.

Abstract translation: 平面电路板可以包括限定基部表面的可折叠材料的平面支撑件和沿着各个折叠线连接到基座表面的翼片，使得当沿着折叠线折叠时的翼片相对于基部表面竖立，并且 保持在这个位置。 辅助电路在平面支撑件上，并且可以包括限定在翼部和基部表面上的成对的电容耦合板，以及耦合到成对的电容耦合板中的对应的电气通信线。