公开(公告)号：US20150059987A1

公开(公告)日：2015-03-05

申请号：US14468662

申请日：2014-08-26

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Kayo KUMAKURA ,  Tomoya AOYAMA ,  Akihiro CHIDA ,  Kohei YOKOYAMA ,  Masakatsu OHNO ,  Satoru IDOJIRI ,  Hisao IKEDA ,  Hiroki ADACHI ,  Yoshiharu HIRAKATA ,  Shingo EGUCHI ,  Yasuhiro JINBO

IPC: B32B43/00

CPC classification number: B32B43/006 ,  B26D1/04 ,  B26D2001/006 ,  B32B38/10 ,  B32B2457/00 ,  G02B6/00 ,  H01L21/67092 ,  H01L27/1248 ,  H01L27/3258 ,  H01L27/3262 ,  H01L51/56 ,  H01L2221/68327 ,  H01L2227/323 ,  H01L2251/5338 ,  Y10T156/1126 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1184 ,  Y10T156/1933 ,  Y10T156/1944 ,  Y10T156/1961 ,  Y10T156/1967

Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.

Abstract translation: 提供堆叠的处理装置。 堆叠包括彼此附接的两个基板，其间隙设置在它们的端部之间。 处理装置包括：固定机构，其固定堆叠的一部分;多个吸附夹具，其固定堆叠的一个基板的外周边缘;以及楔形夹具，其插入到堆叠的角部。 多个吸附夹具包括允许吸附夹具在垂直方向和水平方向上分开移动的机构。 处理装置还包括传感器，其感测堆叠中的端部之间的间隙的位置。 楔形夹具的尖端沿着形成在堆叠的端表面上的倒角移动。 楔形夹具插入到堆叠中的端部之间的间隙中。

公开(公告)号：US20140252386A1

公开(公告)日：2014-09-11

申请号：US13999502

申请日：2014-03-05

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Minato ITO ,  Kohei YOKOYAMA ,  Yusuke NISHIDO

IPC: H01L33/52 ,  H01L33/50

CPC classification number: H01L51/529 ,  H01L27/322 ,  H01L27/3276 ,  H01L51/524 ,  H01L51/5246 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided is a device in which heat conduction from a sealant to a functional element is suppressed and whose bezel is slim. The sealing structure includes a first substrate, a second substrate whose surface over which a sealed component is provided faces the first substrate, and a frame-like sealant which seals a space between the first substrate and the second substrate with the first substrate and the second substrate. The second substrate includes a groove portion between the sealant and the sealed component. The groove portion is in a vacuum or includes a substance whose heat conductivity is lower than that of the second substrate.

Abstract translation: 提供了一种从密封剂到功能元件的热传导被抑制并且其表圈苗条的装置。 所述密封结构包括第一基板，其表面上设有密封部件的第二基板面对所述第一基板;以及框状密封剂，其利用所述第一基板密封所述第一基板和所述第二基板之间的空间，并且所述第二基板 基质。 第二基板包括在密封剂和密封部件之间的槽部。 槽部处于真空状态，或者包含导热率低于第二基板的物质。

公开(公告)号：US20240105737A1

公开(公告)日：2024-03-28

申请号：US18534908

申请日：2023-12-11

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Hisao IKEDA ,  Kouhei TOYOTAKA ,  Hideaki SHISHIDO ,  Hiroyuki MIYAKE ,  Kohei YOKOYAMA ,  Yasuhiro JINBO ,  Yoshitaka DOZEN ,  Takaaki NAGATA ,  Shinichi HIRASA

IPC: H01L27/12 ,  G09G3/20 ,  G09G3/3233 ,  H01L29/786 ,  H10K59/131 ,  H10K59/35

CPC classification number: H01L27/124 ,  G09G3/2003 ,  G09G3/3233 ,  H01L27/1225 ,  H01L27/1266 ,  H01L29/78648 ,  H10K59/131 ,  H10K59/352 ,  H10K59/353 ,  G09G3/3648 ,  G09G2300/0452 ,  G09G2300/0842 ,  G09G2320/0295 ,  G09G2320/043 ,  G09G2320/0693

Abstract: Provided is a display device with extremely high resolution, a display device with higher display quality, a display device with improved viewing angle characteristics, or a flexible display device. Same-color subpixels are arranged in a zigzag pattern in a predetermined direction. In other words, when attention is paid to a subpixel, another two subpixels exhibiting the same color as the subpixel are preferably located upper right and lower right or upper left and lower left. Each pixel includes three subpixels arranged in an L shape. In addition, two pixels are combined so that pixel units including subpixel are arranged in matrix of 3×2.

公开(公告)号：US20180247990A1

公开(公告)日：2018-08-30

申请号：US15966640

申请日：2018-04-30

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Yasuhiro JINBO ,  Kohei YOKOYAMA ,  Yuki TAMATSUKURI ,  Naoto GOTO ,  Masami JINTYOU ,  Masayoshi DOBASHI ,  Masataka NAKADA ,  Akihiro CHIDA ,  Naoyuki SENDA

IPC: H01L27/32 ,  H01L51/52

CPC classification number: H01L27/3258 ,  H01L51/5253 ,  H01L2251/301 ,  H01L2251/5338

Abstract: To provide a display device with a manufacturing yield and/or a display device with suppressed mixture of colors between adjacent pixels. The display device includes a first pixel electrode, a second pixel electrode, a first insulating layer, a second insulating layer, and an adhesive layer. The first insulating layer includes a first opening. The second insulating layer includes a second opening. The first opening and the second opening are provided between the first pixel electrode and the second pixel electrode. In a top view, a periphery of the second opening is positioned on an inner side than a periphery of the first opening. The adhesive layer has a region overlapping with the second insulating layer below the second insulating layer.

公开(公告)号：US20180072033A1

公开(公告)日：2018-03-15

申请号：US15804319

申请日：2017-11-06

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Masakatsu OHNO ,  Yoshiharu HIRAKATA ,  Shingo EGUCHI ,  Yasuhiro JINBO ,  Hisao IKEDA ,  Kohei YOKOYAMA ,  Hiroki ADACHI ,  Satoru IDOJIRI

IPC: B32B37/00 ,  B32B37/12 ,  B32B17/10 ,  B32B27/08 ,  B32B27/20 ,  B32B27/36 ,  B32B38/18 ,  B32B38/00

CPC classification number: B32B37/0046 ,  B32B17/10431 ,  B32B27/08 ,  B32B27/20 ,  B32B27/36 ,  B32B37/0015 ,  B32B37/003 ,  B32B37/1284 ,  B32B38/0008 ,  B32B38/18 ,  B32B38/1841 ,  B32B38/1858 ,  B32B2264/102 ,  B32B2264/105 ,  B32B2309/68 ,  B32B2457/14 ,  B32B2457/20 ,  H01L2224/01 ,  Y10T156/15 ,  Y10T156/1798

Abstract: A yield in the step of bonding two members together is improved. A bonding apparatus includes a stage capable of supporting a first member having a sheet-like shape, a fixing mechanism capable of fixing one end portion of a second member having a sheet-like shape so that the second member overlaps with the first member, and a pressurizing mechanism capable of moving from a side of the one end portion of the second member to a side of the other end portion and spreading a bonding layer under pressure between the first member and the second member. The first member and the second member are bonded to each other.

公开(公告)号：US20180052535A1

公开(公告)日：2018-02-22

申请号：US15673769

申请日：2017-08-10

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Tatsuya SAKUISHI ,  Kohei YOKOYAMA ,  Yasuhiro JINBO

IPC: G06F3/0354

CPC classification number: G06F3/03545 ,  G06F3/03546 ,  G06F3/0412 ,  G06F3/044 ,  G06F2203/04103

Abstract: A highly usable touch pen and a method for providing input to an electronic device using the touch pen are provided. A ball that is formed using a material not slipping on the surface of an input portion of an electronic device and that can rotate in the touch pen is set at the tip of the touch pen. The ball includes an elastic material. Alternatively, the tip of the touch pen is movable. When input is provided to an electronic device by moving the touch pen, the tip of which is provided with the ball formed using a material not slipping on the input portion surface of the electronic device, the ball rolls on the input portion surface while providing input.

公开(公告)号：US20170104049A1

公开(公告)日：2017-04-13

申请号：US15290085

申请日：2016-10-11

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Daiki NAKAMURA ,  Kohei YOKOYAMA ,  Yasuhiro JINBO ,  Toshiki SASAKI ,  Masataka NAKADA ,  Naoto GOTO ,  Takahiro IGUCHI

IPC: H01L27/32 ,  H01L29/786 ,  G02F1/1343 ,  G02F1/1333 ,  G02F1/1368 ,  H01L27/12 ,  G02F1/1335

CPC classification number: H01L27/3267 ,  G02F1/133345 ,  G02F1/133553 ,  G02F1/134309 ,  G02F1/1368 ,  G02F2201/44 ,  H01L27/124 ,  H01L27/3232 ,  H01L29/7869

Abstract: A novel display device that is highly convenient with low power consumption is provided. The display device includes a display element including a liquid crystal layer, a display element including a light-emitting layer, and a pixel circuit. Electrodes of the display element including the liquid crystal layer and the display element including the light-emitting layer are electrically connected to the pixel circuit. The electrode of the display element including the liquid crystal layer includes a reflective film including an opening. The pixel circuit includes a transistor including a semiconductor film. The number of insulating films in a region overlapping with the opening is smaller than that of insulating films overlapping with the semiconductor film. In addition, the display element including the light-emitting layer includes two light-emitting elements. The number of optical elements overlapping with one light-emitting element is smaller than that of optical elements overlapping with the other light-emitting element.

公开(公告)号：US20170092885A1

公开(公告)日：2017-03-30

申请号：US15252295

申请日：2016-08-31

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Tatsuya SAKUISHI ,  Yutaka UCHIDA ,  Hiroki ADACHI ,  Saki EGUCHI ,  Junpei YANAKA ,  Kayo KUMAKURA ,  Seiji YASUMOTO ,  Kohei YOKOYAMA ,  Akihiro CHIDA

IPC: H01L51/00 ,  B32B37/10 ,  B32B37/02 ,  B32B37/18

CPC classification number: H01L51/0097 ,  B32B7/02 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  B32B17/00 ,  B32B17/06 ,  B32B27/20 ,  B32B27/286 ,  B32B27/30 ,  B32B27/325 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B37/02 ,  B32B37/10 ,  B32B37/1292 ,  B32B37/18 ,  B32B38/10 ,  B32B2250/05 ,  B32B2255/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2264/102 ,  B32B2307/202 ,  B32B2307/40 ,  B32B2307/50 ,  B32B2307/536 ,  B32B2307/558 ,  B32B2310/0843 ,  B32B2315/08 ,  B32B2457/20 ,  H01L51/003 ,  H01L51/5253 ,  H01L2251/5338 ,  Y02E10/549 ,  Y02P70/521

Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.

公开(公告)号：US20150380673A1

公开(公告)日：2015-12-31

申请号：US14746925

申请日：2015-06-23

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Minato ITO ,  Kohei YOKOYAMA

IPC: H01L51/52 ,  H01L51/00

CPC classification number: H01L51/0097 ,  H01L27/322 ,  H01L27/3244 ,  H01L51/524 ,  H01L2251/5307 ,  H01L2251/5315 ,  H01L2251/5338 ,  H01L2251/558 ,  Y02E10/549

Abstract: A device in which warpage or distortion is less likely to occur even in a high-temperature or high-humidity environment is provided. A light-emitting device includes a first flexible substrate, a second flexible substrate, and an element layer. The first flexible substrate includes an organic resin. The second flexible substrate includes an organic resin. The element layer is positioned between the first flexible substrate and the second flexible substrate. The element layer includes a light-emitting element. The light-emitting element emits light to the first flexible substrate side. The first flexible substrate has higher average transmittance of light having a wavelength of greater than or equal to 400 nm and less than or equal to 800 nm than the second flexible substrate.

Abstract translation: 提供了即使在高温或高湿度环境下也不易发生翘曲或变形的装置。 发光器件包括第一柔性衬底，第二柔性衬底和元件层。 第一柔性基板包括有机树脂。 第二柔性基板包括有机树脂。 元件层位于第一柔性基板和第二柔性基板之间。 元件层包括发光元件。 发光元件向第一柔性基板侧发光。 第一柔性基板具有比第二柔性基板具有大于或等于400nm且小于或等于800nm的波长的较高的平均透射率。

公开(公告)号：US20150236280A1

公开(公告)日：2015-08-20

申请号：US14621914

申请日：2015-02-13

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Tatsuya SAKUISHI ,  Yutaka UCHIDA ,  Hiroki ADACHI ,  Saki EGUCHI ,  Junpei YANAKA ,  Kayo KUMAKURA ,  Seiji YASUMOTO ,  Kohei YOKOYAMA ,  Akihiro CHIDA

IPC: H01L51/00 ,  H01L27/32 ,  B32B38/10 ,  B32B7/02 ,  B32B37/02 ,  B32B37/18 ,  H01L51/56 ,  H01L51/52

CPC classification number: H01L51/0097 ,  B32B7/02 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  B32B17/00 ,  B32B17/06 ,  B32B27/20 ,  B32B27/286 ,  B32B27/30 ,  B32B27/325 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B37/02 ,  B32B37/10 ,  B32B37/1292 ,  B32B37/18 ,  B32B38/10 ,  B32B2250/05 ,  B32B2255/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2264/102 ,  B32B2307/202 ,  B32B2307/40 ,  B32B2307/50 ,  B32B2307/536 ,  B32B2307/558 ,  B32B2310/0843 ,  B32B2315/08 ,  B32B2457/20 ,  H01L51/003 ,  H01L51/5253 ,  H01L2251/5338 ,  Y02E10/549 ,  Y02P70/521

Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.

Abstract translation: 提供了灵活的设备。 柔性装置的粘合层的硬度设定为高于70°的肖氏D值，或优选高于或等于邵氏D的80°。挠性装置的柔性基板的膨胀系数设定得较小 比58ppm /℃，或优选小于或等于30ppm /℃