DRIVING APPARATUS FOR OPENING AND CLOSING BODY FOR VEHICLE
    24.
    发明申请
    DRIVING APPARATUS FOR OPENING AND CLOSING BODY FOR VEHICLE 有权
    用于车辆开启和关闭机构的驾驶装置

    公开(公告)号:US20130160581A1

    公开(公告)日:2013-06-27

    申请号:US13702326

    申请日:2011-06-03

    IPC分类号: B60J5/04 E05F15/14

    摘要: A hypocycloid reducer 70 for reducing rotation of a flat motor 60 to output the speed-reduced rotation to a drum is provided between the drum and the flat motor 60, a rotor shalt member 65 which is rotated with the same rotation number as the flat motor 60 is axially aligned with the drum is provided on the same side as the flat motor 60. An output rotation body 74 for outputting the speed-reduced rotation is axially aligned with the drum and provided on the same side as the drum. Since the rotor shaft member 65 and the output rotation body 74 are axially aligned with the drum, turning force can be transmitted bi-directionally between the rotor shaft member 65 and the output rotation body 74. Therefore, it is possible to eliminate an electromagnetic clutch to reduce the driving apparatus in size and weight, and since wires and control logic of the electromagnetic clutch are not needed for the driving apparatus, the driving apparatus can be reduced in production cost.

    摘要翻译: 在鼓和平面电动机60之间设置有用于减小平面电动机60的旋转以将减速旋转输出到鼓的低音圈减速器70,以与平面电动机相同的转数旋转的转子轴部件65 60与滚筒轴向对齐设置在与平坦马达60相同的一侧上。用于输出减速旋转的输出旋转体74与滚筒轴向对齐并设置在与滚筒相同的一侧。 由于转子轴构件65和输出旋转体74与滚筒轴向对准,因此转动力可以在转子轴构件65和输出旋转体74之间双向传递。因此,可以消除电磁离合器 以减小驱动装置的尺寸和重量,并且由于驱动装置不需要电磁离合器的电线和控制逻辑,所以可以降低驱动装置的生产成本。

    Electric motor and reduction motor
    25.
    发明授权
    Electric motor and reduction motor 有权
    电机和还原电机

    公开(公告)号:US08436505B2

    公开(公告)日:2013-05-07

    申请号:US12998316

    申请日:2009-10-07

    IPC分类号: H02K13/00

    摘要: Disclosed is a motor in which a commutator (10) is provided with connecting wires which short-circuit equipotential segments; brushes (21) are constituted by a low-speed brush (21a), a high-speed brush (21b), and a common brush (21c) used in common by the low-speed and high-speed brushes, and are juxtaposed along the circumferential direction. The circumferential brush width (W2) of the high-speed brush is set to be smaller than the circumferential brush width (W1) of the low-speed brush. The high-speed brush and the low-speed brush are formed so that simultaneous sliding contact with equipotential segments (15) can be avoided. Additionally, armature cores (8) are provided such that a plurality of teeth (12) is point-symmetrical about a rotary shaft (3) at equal intervals in the circumferential direction, and the teeth and slots (13) are formed so as to exist alternately at intervals of 90 degrees in the circumferential direction. By virtue of the above configuration, vibration and noise can be reduced while achieving miniaturization and high performance of a motor.

    摘要翻译: 公开了一种电动机,其中换向器(10)设置有短路等电位段的连接线; 刷子(21)由低速和高速刷子共同使用的低速刷子(21a),高速刷子(21b)和普通刷子(21c)构成,并且并排 圆周方向。 高速刷的圆周刷宽度(W2)设定为小于低速刷的周向刷宽(W1)。 形成高速电刷和低速电刷,可以避免与等电位段(15)的同时滑​​动接触。 另外,电枢铁芯(8)设置成使得多个齿(12)在圆周方向上以相等的间隔围绕旋转轴(3)点对称,并且形成齿和槽(13),以便 在圆周方向以90度的间隔交替地存在。 通过上述结构,可以在实现电动机的小型化和高性能的同时降低振动和噪音。

    Semiconductor integrated circuit device with a connective portion for multilevel interconnection
    29.
    发明授权
    Semiconductor integrated circuit device with a connective portion for multilevel interconnection 有权
    具有用于多层互连的连接部分的半导体集成电路器件

    公开(公告)号:US07095120B2

    公开(公告)日:2006-08-22

    申请号:US10263829

    申请日:2002-10-04

    IPC分类号: H01L23/48 H01L23/52 H01L29/40

    摘要: In manufacturing a semiconductor integrated circuit device, an interconnect trench and a contact hole are formed in an interlayer insulating film formed over a first-level interconnect on a semiconductor substrate, a barrier film is formed inside of the trench and contact hole so that its film thickness increases from the center of the bottom of the hole toward the sidewalls all around the bottom of the contact hole, a copper film is formed over the barrier film, and a second-level interconnect and a connector portion (plug) are formed by polishing by CMP. In this way, the geometrically shortest pathway of an electrical current flowing from the second-level interconnect toward the first-level interconnect through a connector portion (plug) does not coincide with a thin barrier film portion which has the lowest electrical resistance, so that the current pathway can be dispersed and a concentration of electrons does not occur readily.

    摘要翻译: 在制造半导体集成电路器件时,在形成于半导体衬底上的第一级互连件上的层间绝缘膜中形成互连沟槽和接触孔,在沟槽和接触孔内部形成阻挡膜,使其膜 厚度从孔的底部的中心朝向接触孔底部的侧壁增加,在阻挡膜上形成铜膜,并且通过抛光形成第二级互连和连接器部分(插塞) 通过CMP。 以这种方式,通过连接器部分(插头)从第二级互连件流向第一级互连件的电流的几何最短路径与具有最低电阻的薄阻挡膜部分不一致,使得 电流路径可以分散,并且电子的浓度不容易发生。