Process for producing a resonator in a semiconductor laser device
    24.
    发明授权
    Process for producing a resonator in a semiconductor laser device 失效
    在半导体激光装置中制造谐振器的方法

    公开(公告)号:US5825789A

    公开(公告)日:1998-10-20

    申请号:US577620

    申请日:1995-12-22

    CPC分类号: H01S5/0201 H01S5/028

    摘要: A method for forming a resonator in a semiconductor laser device comprises the steps of; filling with a resin a gap surrounding the side surfaces of the waveguide for a resonator other than the end-surface to be polished; polishing the end-surface and the resin surrounding it; forming a predetermined optical coating on the polished end-surface and the resin in the state of the laser waveguide and the electrode being embedded; and removing the embedding resin. Both the bending of polished end-surfaces and the entering of the thin film into the side surface of the laser waveguide is prevented so that a high smooth end-surface of mirror coating for resonator is achieved. Furthermore, any crystals are used for a substrate carrying a semiconductor laser structure with a resonator even if that crystal is of non-cleavage, according to that method.

    摘要翻译: 一种在半导体激光器件中形成谐振器的方法包括以下步骤: 用树脂填充围绕波导的侧表面的间隙,用于除了待抛光的端面之外的谐振器; 抛光端面和周围的树脂; 在激光波导和电极嵌入的状态下在抛光的端面上形成预定的光学涂层和树脂; 并除去嵌入树脂。 抛光端面的弯曲和薄膜进入激光波导的侧表面均被防止,从而实现了用于谐振器的镜面涂层的高光滑端面。 此外,根据该方法,任何晶体都用于携带具有谐振器的半导体激光器结构的衬底,即使该晶体是非分裂的。

    Group III nitride compound semiconductor laser diode and method for
producing same
    25.
    发明授权
    Group III nitride compound semiconductor laser diode and method for producing same 失效
    III族氮化物半导体激光二极管及其制造方法

    公开(公告)号:US5604763A

    公开(公告)日:1997-02-18

    申请号:US423940

    申请日:1995-04-19

    IPC分类号: H01S5/02 H01S5/323 H01S3/19

    摘要: An improved laser diode is made of a gallium nitride compound semiconductor ((Al.sub.x Ga.sub.1-x).sub.y In.sub.1-y N; 0.ltoreq.x.ltoreq.1; 0.ltoreq.x.ltoreq.1) with a double heterojunction structure having the active layer held between layers having a greater band gap. The laser diode comprises mirror surfaces formed by cleaving the multi-layered coating and the sapphire substrate in directions parallel to (c axis) of the sapphire substrate. The intermediate zinc oxide (ZnO) layer is selectively removed by wet etching with a ZnO-selective liquid etchant so as to form gaps between the sapphire substrate and the bottom-most sub-layer of the semiconductor laser element layer. The semiconductor laser element layer is cleaved with the aid of the gaps, and the resulting planes of cleavage are used as the mirror surfaces of the laser cavity.

    摘要翻译: 改进的激光二极管由氮化镓化合物半导体((Al x Ga 1-x)y In 1-y N; 0 (c轴)平行的方向上切割多层涂层和蓝宝石衬底而形成的镜面。 通过用ZnO选择性液体蚀刻剂的湿蚀刻选择性地除去中间氧化锌(ZnO)层,以便在蓝宝石衬底和半导体激光元件层的最底层子层之间形成间隙。 借助于间隙切割半导体激光元件层,并将所得到的切割平面用作激光腔的镜面。

    Light-emitting semiconductor device using gallium nitride group compound
    26.
    发明授权
    Light-emitting semiconductor device using gallium nitride group compound 失效
    使用氮化镓族化合物的发光半导体装置

    公开(公告)号:US5281830A

    公开(公告)日:1994-01-25

    申请号:US781910

    申请日:1991-10-24

    摘要: There are disclosed two types of gallium nitride LED having the pn junction. An LED of gallium nitride compound semiconductor (Al.sub.x Ga.sub.1-x N, where 0.ltoreq.x

    摘要翻译: 公开了具有pn结的两种类型的氮化镓LED。 氮化镓化合物半导体(Al x Ga 1-x N,其中0 <= x <1)的LED包括n层; 在掺杂p型杂质和照射电子线时显示p型导电的p层,p层与n层的接合; 用于n层的第一电极,以连接到n层,穿过形成在从p层延伸到n层的p层中的孔; 以及p层的第二电极,其形成在由p层中形成的沟槽分隔开的区域中,以便从p层的上表面延伸到所述n层。 LED包括n层; 掺有p型杂质的i层,i层与n层结合; 用于所述n层的第一电极,以连接到n层,穿过形成在从i层的上表面延伸到n层的i层中的孔; 在i层的特定区域中的p型部分,其通过用电子射线转换成p型导电,所述p型部分被形成为使得所述第一电极被所述i层绝缘和分离; 和用于所述p型部件的第二电极。

    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    30.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号:US20130330913A1

    公开(公告)日:2013-12-12

    申请号:US14001454

    申请日:2011-02-25

    IPC分类号: H01L21/02

    摘要: A structure includes a substrate, a template layer formed on the surface of the substrate and including an AlN layer, and a device structure portion formed by stacking AlGaN semiconductor layers on the template layer. For the structure, the AlN layer is irradiated from a side close to the substrate with a laser light with a wavelength by which the laser light passes through the substrate and the laser light is absorbed by the AlN layer, in a state in which the AlN layer receives compressive stress from the substrate. This allows the AlN layer to expand more than the surface of the substrate on at least an interface between the AlN layer and the substrate so as to increase the compressive stress, in order to remove the substrate from the AlN layer.

    摘要翻译: 一种结构包括基板,形成在基板的表面上并包括AlN层的模板层,以及通过在模板层上堆叠AlGaN半导体层而形成的器件结构部分。 对于该结构,通过激光通过基板的激光的激光和激光被AlN层吸收,AlN层从靠近基板的一侧照射,其中AlN 层从基底接收压应力。 这允许AlN层在AlN层和衬底之间的至少一个界面上比衬底的表面更多地膨胀,以便增加压缩应力,以便从AlN层去除衬底。