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    Multilayer capacitors and methods for making the same
    22.
    发明授权
    Multilayer capacitors and methods for making the same 有权
    多层电容器及其制造方法

    公开(公告)号：US08094429B2

    公开(公告)日：2012-01-10

    申请号：US12488780

    申请日：2009-06-22

    申请人： Chien-Min Hsu ,  Min-Lin Lee ,  Shinn-Juh Lai

    发明人： Chien-Min Hsu ,  Min-Lin Lee ,  Shinn-Juh Lai

    IPC分类号： H01G4/228

    CPC分类号： H05K1/162 ,  H01G4/1209 ,  H01G4/232 ,  H01G4/30 ,  H01G4/35 ,  H01L28/86 ,  H05K3/429 ,  H05K2201/0187 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/09718 ,  Y10T29/43

    摘要： A capacitor device may include a first electrode, a second electrode, a third electrode, a first dielectric layer, and a second dielectric layer. The first electrode may be coupled with a first terminal of the capacitor device. The second electrode is under the first electrode and may be coupled with a second terminal of the capacitor device. The second electrode may be electrically isolated from the first electrode. The third electrode is under the first electrode and the second electrode and may be electrically isolated from the second electrode and electrically coupled with the first electrode. The first dielectric layer has a first dielectric constant and may be sandwiched between the first electrode and the second electrode. The second dielectric layer may have a second dielectric constant and may be sandwiched between the second electrode and the third electrode. In one embodiment, the second dielectric constant is at least five times larger than the first dielectric constant.

    摘要翻译： 电容器装置可以包括第一电极，第二电极，第三电极，第一电介质层和第二电介质层。 第一电极可以与电容器装置的第一端子耦合。 第二电极位于第一电极下方并且可以与电容器装置的第二端子耦合。 第二电极可以与第一电极电隔离。 第三电极在第一电极和第二电极之下，并且可以与第二电极电隔离并与第一电极电耦合。 第一电介质层具有第一介电常数并且可夹在第一电极和第二电极之间。 第二电介质层可以具有第二介电常数并且可以夹在第二电极和第三电极之间。 在一个实施例中，第二介电常数比第一介电常数大至少五倍。

    Capacitor devices
    23.
    发明申请
    Capacitor devices 有权
    电容器件

    公开(公告)号：US20100321862A1

    公开(公告)日：2010-12-23

    申请号：US12805886

    申请日：2010-08-23

    申请人： Shih-Hsien Wu ,  Shinn-Juh Lai ,  Min-Lin Lee ,  Shur-Fen Liu

    发明人： Shih-Hsien Wu ,  Shinn-Juh Lai ,  Min-Lin Lee ,  Shur-Fen Liu

    IPC分类号： H01G4/06

    CPC分类号： H01G4/06 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/14 ,  H01G4/20 ,  H01G4/206 ,  H05K1/162 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2201/09672 ,  H05K2201/2036 ,  Y10T29/417

    摘要： A capacitor device with a capacitance is introduced. The capacitor device includes at least one capacitive element. The at least capacitive element comprises a pair of first conductive layers being opposed to each other, at least one first dielectric layer formed on a surface of at least one of the first conductive layers, and a second dielectric layer being sandwiched between the first conductive layers. The first dielectric layer has a first dielectric constant and the second dielectric layer has a second dielectric constant. The capacitance of the capacitor device depends on dielectric parameters of the first dielectric layer and the second dielectric layer. The dielectric parameters comprise the first dielectric constant and thickness of the at least one first dielectric layer and the second dielectric constant and thickness of the second dielectric layer.

    摘要翻译： 引入具有电容的电容器件。 电容器装置包括至少一个电容元件。 所述至少电容元件包括彼此相对的一对第一导电层，至少一个形成在所述第一导电层中的至少一个的表面上的第一电介质层，以及夹在所述第一导电层 。 第一介电层具有第一介电常数，第二介电层具有第二介电常数。 电容器器件的电容取决于第一介电层和第二介电层的介电参数。 介电参数包括第一介电常数和至少一个第一介电层的厚度和第二介电常数和第二介电层的厚度。

    Electrically conductive structure of circuit board and circuit board using the same
    27.
    发明授权
    Electrically conductive structure of circuit board and circuit board using the same 有权
    导电结构的电路板和电路板使用相同

    公开(公告)号：US08071890B2

    公开(公告)日：2011-12-06

    申请号：US12181330

    申请日：2008-07-29

    申请人： Chien-Min Hsu ,  Shih-Hsien Wu ,  Shinn-Juh Lai ,  Min-Lin Lee

    发明人： Chien-Min Hsu ,  Shih-Hsien Wu ,  Shinn-Juh Lai ,  Min-Lin Lee

    IPC分类号： H05K1/16

    CPC分类号： H05K1/112 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K1/0228 ,  H05K1/0231 ,  H05K1/0263 ,  H05K1/162 ,  H05K1/185 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09245 ,  H05K2201/09627 ,  H05K2201/09709 ,  H05K2201/10734 ,  H01L2224/05599

    摘要： An electrically conductive structure includes a first conductive structure and a second conductive structure. Each has a conducting section at one end and a coupling section at the other end. The first and second conducting sections are electrically connected to a power and ground contact of an electronic device, respectively. The first and second coupling sections are respectively connected with power and ground layer of a circuit board. The first coupling sections are connected with the first conducting section through first extending sections and the second coupling sections are connected with the second conducting section through second extending sections. At least two coupling sections of the conductive structures are arranged in pairs. The first conductive structure and the second conductive structure are arranged in a staggered array to form two wiring loops having opposite current directions, thereby generating a magnetic flux cancellation effect.

    摘要翻译： 导电结构包括第一导电结构和第二导电结构。 每个在一端具有导电部分，另一端具有耦合部分。 第一和第二导电部分分别电连接到电子设备的电源和接地触点。 第一和第二耦合部分分别与电路板的电源层和接地层连接。 第一耦合部分通过第一延伸部分与第一导电部分连接，第二耦合部分通过第二延伸部分与第二导电部分连接。 导电结构的至少两个耦合部分成对布置。 第一导电结构和第二导电结构以交错阵列布置以形成具有相反电流方向的两个布线环，从而产生磁通消除效果。

    MULTILAYER CAPACITORS AND METHODS FOR MAKING THE SAME
    28.
    发明申请
    MULTILAYER CAPACITORS AND METHODS FOR MAKING THE SAME 有权
    多层电容器及其制造方法

    公开(公告)号：US20100321858A1

    公开(公告)日：2010-12-23

    申请号：US12488780

    申请日：2009-06-22

    申请人： Chien-Min Hsu ,  Min-Lin Lee ,  Shinn-Juh Lai

    发明人： Chien-Min Hsu ,  Min-Lin Lee ,  Shinn-Juh Lai

    IPC分类号： H01G4/30 ,  H01G7/00

    CPC分类号： H05K1/162 ,  H01G4/1209 ,  H01G4/232 ,  H01G4/30 ,  H01G4/35 ,  H01L28/86 ,  H05K3/429 ,  H05K2201/0187 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/09718 ,  Y10T29/43

    摘要： A capacitor device may include a first electrode, a second electrode, a third electrode, a first dielectric layer, and a second dielectric layer. The first electrode may be coupled with a first terminal of the capacitor device. The second electrode is under the first electrode and may be coupled with a second terminal of the capacitor device. The second electrode may be electrically isolated from the first electrode. The third electrode is under the first electrode and the second electrode and may be electrically isolated from the second electrode and electrically coupled with the first electrode. The first dielectric layer has a first dielectric constant and may be sandwiched between the first electrode and the second electrode. The second dielectric layer may have a second dielectric constant and may be sandwiched between the second electrode and the third electrode. In one embodiment, the second dielectric constant is at least five times larger than the first dielectric constant.

    摘要翻译： 电容器装置可以包括第一电极，第二电极，第三电极，第一电介质层和第二电介质层。 第一电极可以与电容器装置的第一端子耦合。 第二电极位于第一电极下方并且可以与电容器装置的第二端子耦合。 第二电极可以与第一电极电隔离。 第三电极在第一电极和第二电极之下，并且可以与第二电极电隔离并与第一电极电耦合。 第一电介质层具有第一介电常数并且可夹在第一电极和第二电极之间。 第二电介质层可以具有第二介电常数并且可以夹在第二电极和第三电极之间。 在一个实施例中，第二介电常数比第一介电常数大至少五倍。

    Wiring structure of laminated capacitors
    29.
    发明授权
    Wiring structure of laminated capacitors 有权
    层压电容器的接线结构

    公开(公告)号：US07742276B2

    公开(公告)日：2010-06-22

    申请号：US11950381

    申请日：2007-12-04

    申请人： Chien-Min Hsu ,  Shih-Hsien Wu ,  Min-Lin Lee ,  Shinn-Juh Lai

    发明人： Chien-Min Hsu ,  Shih-Hsien Wu ,  Min-Lin Lee ,  Shinn-Juh Lai

    IPC分类号： H01G4/228

    CPC分类号： H05K1/162 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/112 ,  H05K3/429 ,  H05K3/4688 ,  H05K2201/0792 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09636 ,  H05K2201/10734 ,  H01L2224/0401

    摘要： The present invention relates to a wiring structure for reducing the equivalent series inductance (ESL) of a laminated capacitor. The laminated capacitor comprises a number of conductive layers, a power via extending along a thickness direction of the laminated capacitor and arranged to extend from the top conductive layer to the bottom conductive layer, and a ground via extending along the thickness direction of the laminated capacitor and arranged to extend from the top conductive layer to the bottom conductive layer. The conductive layers include a set of first conductive layers and a set of second conductive layers. The power via is electrically coupled to the first conductive layers and the ground via is electrically coupled to the second conductive layers. The laminated capacitor further comprises a supplemental via between the power via and the ground via. The supplemental via is shorter in length than the power via and the ground via. The supplemental via is electrically coupled to one of the first conductive layers and the second conductive layer.

    摘要翻译： 本发明涉及一种用于降低层叠电容器的等效串联电感（ESL）的布线结构。 层叠电容器包括多个导电层，沿层叠电容器的厚度方向延伸的电力通孔，并且从顶部导电层延伸至底部导电层，沿着层叠电容器的厚度方向延伸的接地通孔 并布置成从顶部导电层延伸到底部导电层。 导电层包括一组第一导电层和一组第二导电层。 电源通孔电耦合到第一导电层，并且接地通孔电耦合到第二导电层。 层叠电容器还包括电源通孔和接地通孔之间的补充通路。 补充通孔的长度要短于电源通孔和接地通孔。 辅助通孔电耦合到第一导电层和第二导电层之一。