Abstract:
A semiconductor structure includes at least a semiconductor body, a delimiting structure delimiting a cup-shaped recess in the body and a conductive region in the recess. The conductive region is made of a low-melting-temperature material, having a melting temperature lower than that of the materials forming the delimiting structure.
Abstract:
An embodiment of a process for manufacturing a system for electrical testing of a through via extending in a vertical direction through a substrate of semiconductor material envisages integrating an electrical testing circuit in the body to enable detection of at least one electrical parameter of the through via through a microelectronic buried structure defining an electrical path between electrical-connection elements towards the outside and a buried end of the through via; the integration step envisages providing a trench and forming a doped buried region at the bottom of the trench, having a doping opposite to that of the substrate so as to form a semiconductor junction, defining the electrical path when it is forward biased; in particular, the semiconductor junction has a junction area smaller than the area of a surface of the conductive region in a horizontal plane transverse to the vertical direction, in such a way as to have a reduced reverse saturation current.
Abstract:
A MEMS detection structure is provided with: a substrate having a top surface, on which a first fixed-electrode arrangement is set; a sensing mass, extending in a plane and suspended above the substrate and above the first fixed-electrode arrangement at a separation distance; and connection elastic elements that support the sensing mass so that it is free to rotate out of the plane about an axis of rotation, modifying the separation distance, as a function of a quantity to be detected along an axis orthogonal to the plane. The MEMS detection structure also includes: a coupling mass, suspended above the substrate and connected to the sensing mass via the connection elastic elements; and an anchoring arrangement, which anchors the coupling mass to the substrate with a first point of constraint, set at a distance from the axis of rotation and in a position corresponding to the first fixed-electrode arrangement.
Abstract:
The present invention relates to the use of a nitroaniline derivative of Formula I for the production of nitric oxide and for the preparation of a medicament for the treatment of a disease wherein the administration of nitric oxide is beneficial. The present invention furthermore relates to a method for the production of NO irradiating a nitroaniline derivative of Formula I, a kit comprising a nitroaniline derivative of Formula I and a carrier and to a system comprising a source of radiations and a container associated to a nitroaniline derivative of Formula I. In Formula I, R and RI are each independently hydrogen or a C1-C3 alkyl group; RII is hydrogen or an alkyl group.
Abstract:
There is provided a lead frame and a packaging method. The lead frame comprises a first plurality of die pads, a second plurality of leads extending from the first plurality of die pads, and a third plurality of tie elements, each of which connects one of the first plurality of die pads to another.
Abstract:
A sensing device includes a first current mirror configured to mirror a current flowing through a thermistor, a second current mirror configured to mirror a current flowing through a reference resistor a comparator configured to compare voltages on the thermistor and the resistor, and a counter configured to generate a control signal representative of a temperature difference based on the comparison. The control signal controls a mirroring ratio of the second current mirror. The sensing device may be employed to generate a droop current of a voltage regulator.
Abstract:
An integrated control circuit of a switch is described, which is adapted to open or close a current path; said integrated circuit includes a comparator to compare a first signal with a second signal representative of the current flowing through said current path. The comparator outputs a third variable signal between a low logic level and a high logic level according to whether said second signal is lower than said first signal or vice versa; the integrated circuit has a driver to generate a signal to drive said switch in response to the third signal, and is configured to detect a spike on the leading edge of said second signal and to blank said third signal for a first blanking time period which depends on a turn-on delay of said switch and a second blanking period which depends on the duration of said spike on the leading edge of said second signal.
Abstract:
Solar thin film modules are provided with reduced lateral dimensions of isolation trenches and contact trenches, which provide for a series connection of the individual solar cells. To this end lithography and etch techniques are applied to pattern the individual material layers, thereby reducing parasitic shunt leakages compared to conventional laser scribing techniques. In particular, there may be series connected solar cells formed on a flexible substrate material that are highly efficient in indoor applications.
Abstract:
A method of performing a cryptographic operation including: receiving a plurality of binary input values; splitting the binary input values into a plurality of non-binary digits of base r, where r is an integer greater than 2 and not equal to a power of 2; and performing, by a cryptographic block on each of the plurality of non-binary digits, a different modulo r operation to generate at least one output digit) of base r.
Abstract:
A generator of a voltage logarithmically variable with temperature may include a differential amplifier having a pair of transistors, each coupled with a respective bias network adapted to bias in a conduction state the transistors first and second respectively with a constant current and with a current proportional to the working absolute temperature. The pair of transistors may generate between their control nodes the voltage logarithmically variable with temperature. The differential amplifier may have a common bias current generator coupled between the common terminal of the differential pair of transistors and a node at a reference potential, and a feedback line to provide a path for the current difference between the sum of currents flowing through the transistors of the differential pair and the common bias current.