公开(公告)号：US09515367B2

公开(公告)日：2016-12-06

申请号：US14939128

申请日：2015-11-12

Applicant: Texas Instruments Incorporated

Inventor： Juan Alejandro Herbsommer ,  Robert Floyd Payne ,  Gerd Schuppener ,  Baher Haroun

IPC: H01P5/00 ,  H01Q13/00 ,  H01P3/16 ,  H01P5/08 ,  G02B6/44 ,  H01P11/00 ,  H01Q1/50 ,  H01Q19/10 ,  H04B1/40 ,  H01Q19/30 ,  H01P3/12 ,  H01P5/107 ,  H01P5/18

CPC classification number: H01P3/16 ,  G02B6/4416 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01P3/121 ,  H01P3/165 ,  H01P5/00 ,  H01P5/087 ,  H01P5/107 ,  H01P5/184 ,  H01P11/001 ,  H01P11/002 ,  H01Q1/50 ,  H01Q19/108 ,  H01Q19/30 ,  H04B1/40 ,  Y10T29/49016 ,  Y10T29/49826

Abstract: A metallic waveguide is mounted on a multilayer substrate. The metallic waveguide has an open end formed by a top, bottom and sides configured to receive a core member of a dielectric waveguide, and an opposite tapered end formed by declining the top of the metallic waveguide past the bottom of the metallic waveguide and down to contact the multilayer substrate. A pinnacle of the tapered end is coupled to the ground plane element, and the bottom side of the metallic waveguide is in contact with the multiplayer substrate and coupled to the microstrip line.

Abstract translation: 金属波导安装在多层基板上。 金属波导具有由顶部，底部和侧面形成的开口端，该开口端被配置为容纳电介质波导的芯构件，并且相反的锥形端通过使金属波导的顶部通过金属波导的底部下降到 接触多层基板。 锥形末端的顶点耦合到接地平面元件，并且金属波导的底侧与多人基板接触并耦合到微带线。

公开(公告)号：US09450282B2

公开(公告)日：2016-09-20

申请号：US14397048

申请日：2013-04-23

Applicant: NEC Corporation

Inventor： Muneyasu Kawata

IPC: H01P5/107 ,  H01P1/04 ,  H01P5/08 ,  H01P11/00

CPC classification number: H01P5/107 ,  H01P1/042 ,  H01P5/08 ,  H01P11/002 ,  H01P11/003 ,  Y10T29/49018

Abstract: Provided are a new connection structure connecting a high frequency circuit and a waveguide which allows a substrate opening size to be made common without causing deterioration of a transmission line conversion characteristic, and a manufacturing method of the connection structure.The connection structure includes a module substrate (1) on which the high frequency circuit (11) is mounted and a transmission line conversion means (9, 7) is provided between the high frequency circuit and the waveguide (3), a waveguide conductor (8) in which the waveguide is formed, and a mother substrate (2) which is provided on the waveguide conductor and includes an opening having a size larger than an opening size (d) of the waveguide, and the module substrate is fixed to the mother substrate so as to cover the opening of the mother substrate and a choke is formed utilizing a space among the module substrate, the mother substrate, and the waveguide conductor.

Abstract translation: 连接结构包括安装有高频电路（11）的模块基板（1），并且在高频电路和波导管（3）之间设置有传输线转换装置（9,7），波导管（ 8），以及设置在波导管上并具有比波导的开口尺寸（d）大的开口部的母体基板（2），将该模块基板固定于 母基板以覆盖母基板的开口，并且利用模块基板，母基板和波导导体之间的空间形成扼流圈。

公开(公告)号：US20160145757A1

公开(公告)日：2016-05-26

申请号：US14551716

申请日：2014-11-24

Applicant: METAL INDUSTRIES RESEARCH&DEVELOPMENT CENTRE

Inventor： SHENG-YUAN CHENG

IPC: C25D5/02 ,  C25D7/00 ,  B65H81/00 ,  C25D11/20

CPC classification number: B65H81/00 ,  B65H81/06 ,  C25D1/00 ,  C25D7/00 ,  C25D11/022 ,  C25D11/20 ,  H01P11/002

Abstract: A wiring apparatus includes a substrate, two winding modules, and an axial wire dividing module. The two winding modules are disposed on the substrate. Each winding module includes a clamping mechanism with a chuck, a rotary mechanism having a rotation driving unit driving the chuck; and a reciprocating mechanism with a rail-slider assembly, the rotation driving unit connected to the slider. The axial wire dividing module is disposed on the substrate and located between the two winding modules with a wire supply channel provided with a wire inlet and a wire outlet. The wire outlet is provided with a cutter aligned with the center of the wire supply channel, and a cutting edge of the cutter faces the wire inlet; a waveguide prototype mould is formed by dividing a wire in real time and winding wires in grooves of a waveguide prototype.

Abstract translation: 布线装置包括基板，两个卷绕模块和轴向分线模块。 两个绕组模块设置在基板上。 每个卷绕模块包括具有卡盘的夹紧机构，具有驱动卡盘的旋转驱动单元的旋转机构; 以及具有轨道滑动器组件的往复运动机构，旋转驱动单元连接到滑块。 轴线分割模块设置在基板上并且位于两个卷绕模块之间，其中线材供应通道设置有导线入口和电线出口。 电线出口设置有与电线供给通道的中心对准的切割器，并且切割器的切割刃面对电线入口; 波导原型模具通过将导线实时分割和绕组线形成在波导原型的凹槽中。

公开(公告)号：US09312589B2

公开(公告)日：2016-04-12

申请号：US14293696

申请日：2014-06-02

Applicant: Nuvotronics, LLC

Inventor： David W. Sherrer ,  John J. Fisher

IPC: H01P3/06 ,  H01P11/00 ,  H01P1/08 ,  H01P5/103 ,  H05K1/02 ,  H01P3/00 ,  H05K3/46

CPC classification number: H01P3/06 ,  H01P1/08 ,  H01P3/00 ,  H01P5/103 ,  H01P5/183 ,  H01P11/002 ,  H01P11/003 ,  H01P11/005 ,  H05K1/0221 ,  H05K1/0272 ,  H05K3/4644 ,  H05K3/4685 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49123

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Abstract translation: 提供同轴波导微结构。 微结构包括设置在衬底上方的衬底和同轴波导。 同轴波导包括：中心导体; 包括一个或多个壁的外导体，与中心导体间隔开并设置在中心导体周围; 一个或多个电介质支撑构件，用于支撑与中心导体接触并封闭在外部导体内的中心导体; 以及中心导体和外部导体之间的芯体积，其中芯体积处​​于真空状态或气体状态。 还提供了通过顺序构建工艺形成同轴波导微结构的方法和包括同轴波导微结构的密封封装。

公开(公告)号：US09306263B2

公开(公告)日：2016-04-05

申请号：US13854939

申请日：2013-04-01

Applicant: Texas Instruments Incorporated

Inventor： Juan Alejandro Herbsommer ,  Eunyoung Seok ,  Baher Haroun

IPC: H01P5/107 ,  H01P3/16 ,  H01P5/08 ,  G02B6/44 ,  H01P11/00 ,  H01P5/00 ,  H01Q1/50 ,  H01Q19/10 ,  H04B1/40 ,  H01Q19/30 ,  H01P3/12

CPC classification number: H01P3/16 ,  G02B6/4416 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01P3/121 ,  H01P3/165 ,  H01P5/00 ,  H01P5/087 ,  H01P5/107 ,  H01P5/184 ,  H01P11/001 ,  H01P11/002 ,  H01Q1/50 ,  H01Q19/108 ,  H01Q19/30 ,  H04B1/40 ,  Y10T29/49016 ,  Y10T29/49826

Abstract: An electronic device has a multilayer substrate that has an interface surface configured for interfacing to a dielectric waveguide. A conductive layer on the substrate is etched to form a dipole antenna disposed adjacent the interface surface to provide coupling to the dielectric waveguide. A reflector structure is formed in the substrate adjacent the dipole antenna opposite from the interface surface.

Abstract translation: 电子设备具有多层基板，该多层基板具有被配置为与电介质波导连接的界面。 蚀刻衬底上的导电层以形成邻近界面表面设置的偶极天线，以提供与介质波导的耦合。 反射器结构形成在与界面表面相对的偶极子天线附近的衬底中。

公开(公告)号：US09166269B2

公开(公告)日：2015-10-20

申请号：US13907949

申请日：2013-06-02

Applicant: Texas Instruments Incorporated

Inventor： Baher Haroun ,  Juan Alejandro Herbsommer

IPC: H01P1/10 ,  H01P3/16 ,  H01P5/08 ,  G02B6/44 ,  H01P11/00 ,  H01P5/00 ,  H01Q1/50 ,  H01Q19/10 ,  H04B1/40 ,  H01Q19/30 ,  H01P3/12 ,  H01P5/107

CPC classification number: H01P3/16 ,  G02B6/4416 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01P3/121 ,  H01P3/165 ,  H01P5/00 ,  H01P5/087 ,  H01P5/107 ,  H01P5/184 ,  H01P11/001 ,  H01P11/002 ,  H01Q1/50 ,  H01Q19/108 ,  H01Q19/30 ,  H04B1/40 ,  Y10T29/49016 ,  Y10T29/49826

Abstract: A rotatable coupler for dielectric wave guides is described. A first dielectric wave guide (DWG) has an interface surface at a one end of the DWG. A second DWG has a matching interface surface at an end of the second DWG. A rotatable coupling mechanism is coupled to the two DWG ends and is configured to hold the interface surface of the first DWG in axial alignment with the interface surface of the second DWG while allowing the interface surface of the first DWG to rotate axially with respect to the interface surface of the second DWG.

Abstract translation: 描述了用于介质波导的可旋转耦合器。 第一介质波导（DWG）在DWG的一端具有界面。 第二个DWG在第二个DWG的末尾具有匹配的界面。 可旋转的联接机构联接到两个DWG端部并且被配置为保持第一DWG的接口表面与第二DWG的界面表面轴向对准，同时允许第一DWG的界面相对于第二DWG轴向旋转 第二个DWG的界面。

公开(公告)号：US20140347144A1

公开(公告)日：2014-11-27

申请号：US14453563

申请日：2014-08-06

Applicant: AVIAT U.S., INC.

Inventor： Jayesh Nath ,  Ying Shen ,  Edwin Nealis

IPC: H03H7/46 ,  H03H3/00 ,  H01P11/00

CPC classification number: H01P11/003 ,  B33Y70/00 ,  B33Y80/00 ,  G02B6/125 ,  G02B6/138 ,  H01P1/207 ,  H01P11/001 ,  H01P11/002 ,  H03H3/00 ,  H03H3/007 ,  H03H7/468 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49117

Abstract: Various embodiments are directed toward systems and method for manufacturing low cost passive waveguide components. For example, various embodiments relate to low cost manufacturing of passive waveguide components, including without limitation, waveguide filters, waveguide diplexers, waveguide multiplexers, waveguide bends, waveguide transitions, waveguide spacers, and antenna adapters. Some embodiments comprise manufacturing a passive waveguide component by creating a non-conductive structure using a low cost fabrication technology, such as injection molding or three-dimensional (3D) printing, and then forming a conductive layer over the non-conductive structure such that the conductive layer creates an electrical feature of the passive waveguide component.

Abstract translation: 各种实施例涉及用于制造低成本无源波导部件的系统和方法。 例如，各种实施例涉及无源波导部件的低成本制造，包括但不限于波导滤波器，波导双工器，波导复用器，波导弯曲，波导转换，波导间隔器和天线适配器。 一些实施例包括通过使用诸如注射成型或三维（3D）印刷的低成本制造技术产生非导电结构制造无源波导部件，然后在非导电结构上形成导电层，使得 导电层产生无源波导部件的电气特征。

公开(公告)号：US20140340178A1

公开(公告)日：2014-11-20

申请号：US14253541

申请日：2014-04-15

Applicant: Cecile Jung-Kubiak ,  Theodore Reck ,  Goutam Chattopadhyay ,  Jose Vicente Siles Perez ,  Robert H. Lin ,  Imran Mehdi ,  Choonsup Lee ,  Ken B. Cooper ,  Alejandro Peralta

Inventor： Cecile Jung-Kubiak ,  Theodore Reck ,  Goutam Chattopadhyay ,  Jose Vicente Siles Perez ,  Robert H. Lin ,  Imran Mehdi ,  Choonsup Lee ,  Ken B. Cooper ,  Alejandro Peralta

IPC: H01P3/16 ,  H01P11/00

CPC classification number: H01P3/16 ,  H01P11/002 ,  H01P11/006

Abstract: A multi-step silicon etching process has been developed to fabricate silicon-based terahertz (THz) waveguide components. This technique provides precise dimensional control across multiple etch depths with batch processing capabilities. Nonlinear and passive components such as mixers and multipliers waveguides, hybrids, OMTs and twists have been fabricated and integrated into a small silicon package. This fabrication technique enables a wafer-stacking architecture to provide ultra-compact multi-pixel receiver front-ends in the THz range.

Abstract translation: 已经开发了多步硅蚀刻工艺来制造基于硅的太赫兹（THz）波导部件。 该技术通过批处理功能提供跨多个蚀刻深度的精确尺寸控制。 已经制造了非线性和无源部件，例如混频器和乘法器波导，混合器，OMT和扭曲器并集成到小型硅封装中。 这种制造技术使得晶片堆叠架构能够在太赫兹范围内提供超紧凑的多像素接收机前端。

公开(公告)号：US20140287701A1

公开(公告)日：2014-09-25

申请号：US13854939

申请日：2013-04-01

Applicant: Texas Instruments Incorporated

Inventor： Juan Alejandro Herbsommer ,  Eunyoung Seok ,  Baher Haroun

IPC: H01Q1/50 ,  H04B1/40 ,  H01Q19/10

CPC classification number: H01P3/16 ,  G02B6/4416 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01P3/121 ,  H01P3/165 ,  H01P5/00 ,  H01P5/087 ,  H01P5/107 ,  H01P5/184 ,  H01P11/001 ,  H01P11/002 ,  H01Q1/50 ,  H01Q19/108 ,  H01Q19/30 ,  H04B1/40 ,  Y10T29/49016 ,  Y10T29/49826

Abstract: An electronic device has a multilayer substrate that has an interface surface configured for interfacing to a dielectric waveguide. A conductive layer on the substrate is etched to form a dipole antenna disposed adjacent the interface surface to provide coupling to the dielectric waveguide. A reflector structure is formed in the substrate adjacent the dipole antenna opposite from the interface surface.

Abstract translation: 电子设备具有多层基板，该多层基板具有被配置为与电介质波导连接的界面。 蚀刻衬底上的导电层以形成邻近界面表面设置的偶极天线，以提供与介质波导的耦合。 反射器结构形成在与界面表面相对的偶极子天线附近的衬底中。

公开(公告)号：US20140254979A1

公开(公告)日：2014-09-11

申请号：US14149965

申请日：2014-01-08

Applicant: Northrop Grumman Systems Corporation

Inventor： Chunbo Zhang ,  Peter Ngo ,  Gershon Akerling ,  Kevin M. Leong ,  Patty Chang-Chien ,  Kelly J. Hennig ,  William R. Deal

IPC: G02B6/42 ,  G02B6/13 ,  H01L21/762

CPC classification number: H01L27/14685 ,  H01L21/76254 ,  H01L23/055 ,  H01L23/147 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14687 ,  H01L31/186 ,  H01L31/1876 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81022 ,  H01L2224/81024 ,  H01L2224/81054 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81204 ,  H01L2224/81805 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/12032 ,  H01L2924/13064 ,  H01L2924/14215 ,  H01L2924/1423 ,  H01L2924/15313 ,  H01L2924/157 ,  H01L2924/37001 ,  H01P11/002 ,  H01Q13/02 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/81 ,  H01L2924/01079

Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.

Abstract translation: 公开了一种用于将单个III-V MMIC集成到微加工波导封装中的方法和装置。 MMIC在集成之前进行筛选，仅允许已知的芯片集成，从而提高产量。 该方法和装置用于实现用于亚毫米波（SMMW）相机的微集成焦平面阵列（mFPA）技术，尽管许多其他应用是可能的。 不同技术的MMIC可以集成到相同的微加工包装中，从而实现与多晶圆WLP集成相同的技术集成水平。