公开(公告)号：US20230352905A1

公开(公告)日：2023-11-02

申请号：US18344546

申请日：2023-06-29

申请人： HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.

发明人： Xiao CHEN ,  Yunsong ZHAO ,  Jingsi LI ,  Zhicheng LIU ,  Zhaosong LI

IPC分类号： H01S5/02315 ,  H01S5/02345 ,  H04B10/50

CPC分类号： H01S5/02315 ,  H01S5/02345 ,  H04B10/503

摘要： Disclosed is an optical module, comprising: a light emitting component for generating and outputting signal light, including a laser; the laser includes: a laser chip for generating signal light; a substrate which is provided with a chip mounting groove in its top side, a circuit is laid on a top surface of the substrate, the laser chip is arranged in the chip mounting groove, with the laser chip being connected to the circuit via bonding wires.

公开(公告)号：US11799267B2

公开(公告)日：2023-10-24

申请号：US17874383

申请日：2022-07-27

申请人： Sumitomo Electric Industries, Ltd.

发明人： Kosuke Okawa ,  Naoki Itabashi ,  Tomoya Saeki ,  Hiroshi Hara

IPC分类号： H05K1/02 ,  H01S5/0237 ,  H01S5/02315 ,  H05K3/34 ,  H05K1/18

CPC分类号： H01S5/0237 ,  H01S5/02315 ,  H05K1/0218 ,  H05K1/18 ,  H05K3/34

摘要： An optical module includes a circuit board having a through hole for the lead terminal, a signal wiring connected to the lead terminal, a ground layer providing a reference potential, an opening through which the ground layer is exposed, and a bonding material connecting the ground layer to the metallic base. The lead terminal extends in a first direction, and the circuit board and the signal wiring extend in a second direction. When the circuit board is viewed from the first direction, the opening overlaps with the signal wiring, or when the opening does not overlap with the signal wiring, a first distance between the signal wiring and a closest point of the opening to the signal wiring is smaller than a second distance between the closest point and an edge of the circuit board.

公开(公告)号：US11799266B2

公开(公告)日：2023-10-24

申请号：US16673519

申请日：2019-11-04

申请人： ROHM CO., LTD.

发明人： Yuki Tanuma

IPC分类号： H01S5/02257 ,  H01S5/02315 ,  H01S5/02216 ,  H01S5/42 ,  H01S5/0237 ,  H01S5/343 ,  H01S5/02335 ,  H01S5/183 ,  H01S5/02345

CPC分类号： H01S5/02257 ,  H01S5/02216 ,  H01S5/02315 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/49175 ,  H01L2924/16195 ,  H01S5/0237 ,  H01S5/02335 ,  H01S5/02345 ,  H01S5/18313 ,  H01S5/18347 ,  H01S5/3432 ,  H01S5/34353 ,  H01S5/423

摘要： A semiconductor light-emitting device, includes: a semiconductor light-emitting element; a support including a base and a conductive part and configured to support the semiconductor light-emitting element; and a cover configured to overlap the semiconductor light-emitting element as viewed in a first direction, and to transmit light from the semiconductor light-emitting element, wherein the cover includes a base layer having a front surface and a rear surface which transmit the light from the semiconductor light-emitting element and face opposite sides to each other in the first direction, wherein the rear surface faces the semiconductor light-emitting element, wherein the base layer includes a plurality of undulation parts bonded to the support by a bonding material, and wherein the undulation parts are more uneven than the rear surface.

公开(公告)号：US20230327396A1

公开(公告)日：2023-10-12

申请号：US18189290

申请日：2023-03-24

申请人： NICHIA CORPORATION

发明人： Tadaaki MIYATA

IPC分类号： H01S5/024 ,  H01S5/02218 ,  H01S5/02315

CPC分类号： H01S5/02453 ,  H01S5/02218 ,  H01S5/02315 ,  H01S5/02476

摘要： A light source device includes: a substrate having a support face; a lateral wall part disposed on the substrate and having an upper face and inner wall faces, the inner wall faces defining a space; a laser diode located in the space; a first submount having a mounting face bonded to an upper face of the laser diode, and an upper face located opposite the mounting face; a sealing member bonded to the upper face of the lateral wall part and the upper face of the first submount, thereby sealing the space; a heat dissipating block located above the first submount; and a heat conducting member located between the first submount and the heat dissipating block.

公开(公告)号：US20230318255A1

公开(公告)日：2023-10-05

申请号：US18124658

申请日：2023-03-22

申请人： HAMAMATSU PHOTONICS K.K.

发明人： Shohei HAYASHI ,  Kazuue FUJITA ,  Akio ITO ,  Atsushi NAKANISHI

IPC分类号： H01S5/02253 ,  H01S5/02216 ,  H01S5/34 ,  H01S5/02315 ,  H01S5/14 ,  H01S5/06

CPC分类号： H01S5/02253 ,  H01S5/02216 ,  H01S5/3402 ,  H01S5/02315 ,  H01S5/141 ,  H01S5/0607 ,  H01S2302/02

摘要： The laser module includes a QCL element and a support member. The QCL element has a first end surface located on a first side in a second direction orthogonal to a stacking direction and a second end surface located on a second side opposite to the first side in the second direction. The substrate has first to fourth substrate-surfaces. The support member has a first portion having a first surface facing at least a portion of the fourth substrate-surface, and a second portion having a second surface facing at least a portion of the first substrate-surface and a third surface located opposite to the second surface in the second direction. At least a part of the terahertz wave generated in the active layer is incident on the second surface of the support member through the substrate and is emitted from the third surface through the inside of the second portion.

公开(公告)号：US20230246412A1

公开(公告)日：2023-08-03

申请号：US18002647

申请日：2020-10-01

申请人： Mitsubishi Electric Corporation

发明人： Nobuyuki OGAWA

IPC分类号： H01S5/02315 ,  H01S5/0237 ,  H01S5/042

CPC分类号： H01S5/02315 ,  H01S5/0237 ,  H01S5/04256

摘要： A semiconductor laser device includes a submount having a bottom plate part and a projecting part projecting from a surface of the bottom plate part, and a semiconductor laser bonded to the submount. The semiconductor laser includes a semiconductor substrate, a semiconductor structure part that is formed on the semiconductor substrate and has an active layer, a first electrode, and a second electrode. A side face of the semiconductor laser facing the projecting part, and the second electrode thereof are respectively bonded to the projecting part facing the semiconductor laser and the bottom plate part with a bonding member. The bonding member for bonding the projecting part and the side face of the semiconductor laser is such that an end part thereof in a z-direction in which the projecting part projects is located further away in the z-direction than a surface of the semiconductor substrate of the semiconductor laser.

公开(公告)号：US20230198219A1

公开(公告)日：2023-06-22

申请号：US18107379

申请日：2023-02-08

申请人： Hisense Laser Display Co., Ltd

发明人： Wei Li ,  Xiaoqiang Gu ,  Youliang Tian

IPC分类号： H01S5/02253 ,  H01S5/02315 ,  H01S5/0233 ,  H01S5/40 ,  G02B27/30

CPC分类号： H01S5/02253 ,  G02B27/30 ,  H01S5/0233 ,  H01S5/02315 ,  H01S5/4087 ,  H01S5/02216

摘要： A laser device includes a base plate, a plurality of light-emitting chips, a frame and a collimating lens group. The plurality of light-emitting chips are configured to emit laser beams. The laser beams emitted by the plurality of light-emitting chips each have a first axis and a second axis. The collimating lens group is disposed on a side of the frame away from the base plate, and includes a plurality of collimating lenses. The plurality of collimating lenses correspond to the plurality of light-emitting chips. The collimating lens is configured to reduce a divergence angle of the laser beam incident on the collimating lens, so as to make a reduction of the divergence angle of the laser beam passing through the collimating lens in the first axis less than a reduction of the divergence angle of the laser beam passing through the collimating lens in the second axis.

公开(公告)号：US20240348008A1

公开(公告)日：2024-10-17

申请号：US18335937

申请日：2023-06-15

申请人： Lumentum Operations LLC

发明人： Siu Kwan CHEUNG ,  Lijun ZHU ,  Matthew Glenn PETERS ,  Jacob U. LOPEZ RUVALCABA

IPC分类号： H01S5/042 ,  H01S5/02315 ,  H01S5/0234 ,  H01S5/183 ,  H01S5/42 ,  H05K1/02

CPC分类号： H01S5/04256 ,  H01S5/02315 ,  H01S5/0234 ,  H01S5/18305 ,  H01S5/423 ,  H05K1/0218

摘要： In some implementations, a vertical cavity surface emitting laser (VCSEL) device includes a substrate and a plurality of VCSELs on the substrate. The VCSEL device may include an anode layer on the substrate and electrically connected to the plurality of VCSELs. The VCSEL device may include a cathode electrode over at least a portion of one or more VCSELs, of the plurality of VCSELs, and electrically connected to the one or more VCSELs. The VCSEL device may include a ground layer electrically isolated from the at least one anode layer and the cathode electrode by one or more isolation layers, wherein the ground layer is on the anode layer and the cathode electrode, between the anode layer and the cathode electrode, or underneath the anode layer.

公开(公告)号：US20240258764A1

公开(公告)日：2024-08-01

申请号：US18561240

申请日：2022-05-23

申请人： ams-OSRAM International GmbH

发明人： Markus Keidler ,  Martin Mueller

IPC分类号： H01S5/02 ,  B23K26/53 ,  B23K101/40 ,  H01S5/02315 ,  H01S5/0237

CPC分类号： H01S5/0201 ,  B23K26/53 ,  H01S5/02315 ,  H01S5/0237 ,  B23K2101/40

摘要： In an embodiment a method includes providing at least one semiconductor wafer, which has a semiconductor layer sequence and a plurality of single diode elements arranged next to and connected to one another, generating thermally induced predetermined breaking locations in the semiconductor layer sequence between the single diode elements using first laser radiation, arranging the semiconductor wafer on a carrier, and connecting the semiconductor wafer to the carrier, the single diode elements being at least partially separated from one another at the thermally induced predetermined breaking locations, wherein thermally induced predetermined breaking locations are generated in the carrier using second laser radiation so that the carrier has a plurality of carrier elements connected to one another, and wherein the carrier elements are separated from one another at the predetermined breaking locations by a connecting process.

公开(公告)号：US12044956B2

公开(公告)日：2024-07-23

申请号：US17268288

申请日：2019-07-26

申请人： Sony Corporation

发明人： Hisayoshi Motobayashi ,  Hidekazu Kawanishi ,  Yoshiro Takiguchi ,  Masahiro Murayama ,  Hiroyuki Miyahara ,  Hitoshi Domon

IPC分类号： G03B21/20 ,  H01S5/02218 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02315 ,  H01S5/02325 ,  H01S5/0239 ,  H01S5/024 ,  H01S5/323 ,  H01S5/40

CPC分类号： G03B21/2033 ,  G03B21/208 ,  H01S5/02218 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02315 ,  H01S5/02325 ,  H01S5/0239 ,  H01S5/02469 ,  H01S5/32341 ,  H01S5/4031 ,  H01S5/4087

摘要： A light-emitting device including: a package including a light-emitting element, a reflection member that reflects light outputted from the light-emitting element, and a sealed space that accommodates the light-emitting element and the reflection member; a base plate on which a plurality of the packages is mounted; and lenses opposed to the base plate with the plurality of packages interposed therebetween, the lenses being opposed to the respective packages.