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公开(公告)号：US09548159B2
公开(公告)日：2017-01-17
申请号：US14731521
申请日：2015-06-05
发明人： Kazuo Hattori , Isamu Fujimoto
IPC分类号： H05K7/00 , H05K1/11 , H01G4/12 , H01G2/06 , H05K1/18 , H01G4/01 , H01G4/224 , H01G4/30 , H05K1/14 , H05K3/34 , H05K1/02
CPC分类号： H01G4/12 , H01G2/06 , H01G4/01 , H01G4/224 , H01G4/30 , H05K1/0271 , H05K1/141 , H05K1/181 , H05K3/3442 , H05K2201/041 , H05K2201/049 , H05K2201/09181 , H05K2201/10015 , H05K2201/2045 , Y02P70/611
摘要： A multilayer ceramic capacitor includes flat-shaped inner electrodes that are laminated. An interposer includes an insulating substrate that is larger than contours of the multilayer ceramic capacitor. A first mounting electrode that mounts the multilayer ceramic capacitor is located on a first principal surface of the insulating substrate, and a first external connection electrode for connection to an external circuit board located on a second principal surface. The multilayer ceramic capacitor is mounted onto the interposer in such a way that the principal surfaces of the inner electrodes are parallel or substantially parallel to the principal surface of the interposer, that is, the first and second principal surfaces of the insulating substrate.
摘要翻译： 多层陶瓷电容器包括层叠的扁平状内部电极。 插入器包括比多层陶瓷电容器的轮廓大的绝缘基板。 安装多层陶瓷电容器的第一安装电极位于绝缘基板的第一主表面上，以及用于连接到位于第二主表面上的外部电路板的第一外部连接电极。 多层陶瓷电容器以这样的方式安装到内插器上，使得内部电极的主表面平行或基本上平行于中介层的主表面，即绝缘基板的第一和第二主表面。
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公开(公告)号：US20160360619A1
公开(公告)日：2016-12-08
申请号：US14954273
申请日：2015-11-30
申请人： YAGEO CORPORATION
发明人： Sheng-Li HSIAO , Yung-Han Liu , Shih-Hsin CHANG , Ping-Chuen KUO , Shu-Fang CHEN , Ching-Chang LIN
CPC分类号： H05K1/18 , H05K1/113 , H05K1/141 , H05K1/167 , H05K2201/049 , H05K2201/10636 , Y02P70/611
摘要： A passive device includes a substrate that has opposite first and second surfaces, an electrical connecting unit, a first passive unit, and a second passive unit. The electrical connecting unit includes a first pad formed on the first surface and a second pad formed on the second surface and is electrically connected to the first pad. The first passive unit is formed on the first surface and electrically connected to the first pad. The second passive unit is formed on the second surface and includes two separated electrode layers electrically insulated from the electrical connecting unit, and an insulator layer interconnecting the electrode layers.
摘要翻译： 无源器件包括具有相对的第一和第二表面的基板，电连接单元，第一无源单元和第二无源单元。 电连接单元包括形成在第一表面上的第一焊盘和形成在第二表面上并与第一焊盘电连接的第二焊盘。 第一无源单元形成在第一表面上并电连接到第一焊盘。 第二无源单元形成在第二表面上，并且包括与电连接单元电绝缘的两个分开的电极层和互连电极层的绝缘体层。
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公开(公告)号：US20160205795A1
公开(公告)日：2016-07-14
申请号：US14613017
申请日：2015-02-03
发明人： WEN-HSIANG HUNG , CHUN-BAO GU , HONG-MEI ZHANG
CPC分类号： H05K1/141 , H05K3/301 , H05K2201/049 , H05K2201/10189 , H05K2201/10598
摘要： An electronic device includes an enclosure, a circuit board mounted in the enclosure, an electronic component attached to the circuit board, an antenna module mounted to the electronic component, and a mounting apparatus configured to mount the antenna module. The mounting apparatus includes a pressing member mounted on the circuit board. The mounting apparatus includes a pressing panel, a pressing block extending from the pressing panel, a positioning piece extending from the pressing panel, and a pressing piece extending from the pressing block. The pressing piece has a back wall. The pressing block presses the electronic component, the pressing panel presses the antenna module, and the back wall and the positioning piece abut against two adjacent sidewalls of the electronic component.
摘要翻译： 电子设备包括外壳，安装在外壳中的电路板，连接到电路板的电子部件，安装到电子部件的天线模块以及被配置为安装天线模块的安装装置。 安装装置包括安装在电路板上的按压部件。 安装装置包括按压板，从按压板延伸的按压块，从按压板延伸的定位件以及从压块延伸的按压件。 压制件具有后壁。 按压块按压电子部件，按压板按压天线模块，并且后壁和定位件抵靠电子部件的两个相邻的侧壁。
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公开(公告)号：US09313892B2
公开(公告)日：2016-04-12
申请号：US14198610
申请日：2014-03-06
发明人： Kazuo Hattori , Isamu Fujimoto , Masanori Fujidai
CPC分类号： H05K1/141 , H01G2/065 , H01G4/232 , H01G4/30 , H05K3/3442 , H05K2201/049 , H05K2201/09181 , H05K2201/10015 , H05K2201/2045 , Y02P70/613
摘要： An electronic component includes a laminated capacitor and a substrate-type terminal including a substrate main body, first and second component connection electrodes, first and second external connection electrodes, and first and second connection electrodes. The substrate main body is made of a material and has a thickness that significantly reduces or prevents vibration being transmitted to a circuit substrate on which it is mounted.
摘要翻译： 电子部件包括层叠电容器和包括基板主体，第一和第二部件连接电极，第一和第二外部连接电极以及第一和第二连接电极的基板型端子。 基板主体由材料制成，并且具有显着减小或防止振动传递到其所安装的电路基板的厚度。
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25.发明授权High performance surface mount electrical interconnect with external biased normal force loading 有权具有外部偏置法向力加载的高性能表面贴装电气互连公开(公告)号：US09196980B2
公开(公告)日：2015-11-24
申请号：US13418853
申请日：2012-03-13
申请人： James Rathburn
发明人： James Rathburn
IPC分类号： H05K1/00 , H01R12/52 , H01C1/14 , H01G4/228 , H01R12/70 , H05K7/10 , H05K1/02 , H05K1/14 , H05K3/34 , H05K3/40
CPC分类号： H01R12/523 , H01C1/14 , H01G4/228 , H01R12/7082 , H05K1/0231 , H05K1/141 , H05K3/3436 , H05K3/4038 , H05K3/4092 , H05K7/1069 , H05K7/1092 , H05K2201/049 , Y10T29/43 , Y10T29/49016 , Y10T29/49099 , Y10T29/4913 , Y10T29/49155 , Y10T29/49222
摘要： A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. A socket substrate is provided with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality of electrically conductive contact tabs are attached to the socket substrate so that contact tips on the contact tabs extend into the openings. The contact tips electrically couple with the BGA device when the solder balls are positioned in the openings. Vias electrically couple the contact tabs to contact pads located proximate the second surface of the socket substrate. Solder balls are bonded to the contact pads to electrically and mechanically couple the electrical interconnect to the PCB.
摘要翻译： 适于在BGA器件上的焊球和PCB之间提供界面的表面贴装电互连。 插座衬底设置有第一表面，第二表面和多个开口，其尺寸和构造用于容纳BGA器件上的焊球。 多个导电接触突片附接到插座基底，使得接触片上的接触尖端延伸到开口中。 当焊球定位在开口中时，接触尖端与BGA器件电耦合。 通孔将接触片电耦合到位于插座衬底的第二表面附近的接触垫。 焊球结合到接触焊盘，以电连接和机械耦合电互连到PCB。
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26.发明申请公开(公告)号：US20150122534A1
公开(公告)日：2015-05-07
申请号：US14171289
申请日：2014-02-03
发明人： Sang Soo Park , Heung Kil Park
CPC分类号： H01G4/30 , H01G2/065 , H01G4/228 , H05K1/141 , H05K2201/049 , H05K2201/10015 , H05K2201/10378
摘要： There is provided a multilayer ceramic electronic component including: a multilayer ceramic capacitor including first and second external electrodes formed of a conductive paste on both ends of a ceramic body; and an interposer substrate attached to a mounting surface of the multilayer ceramic capacitor and including first and second connection terminals connected to the first and second external electrodes at both ends of an insulation substrate, respectively, the first and second connection terminals having a double-layer structure including first and second conductive resin layers and first and second plating layers formed on the first and second conductive resin layers.
摘要翻译： 提供了一种多层陶瓷电子部件，其包括：多层陶瓷电容器，其包括由陶瓷体的两端由导电性糊料形成的第一外部电极和第二外部电极; 以及安装在所述层叠陶瓷电容器的安装面上的插入体基板，分别具有在绝缘基板的两端与所述第一外部电极和所述第二外部电极连接的第一和第二连接端子，所述第一和第二连接端子具有双层 包括第一和第二导电树脂层以及形成在第一和第二导电树脂层上的第一和第二镀层的结构。
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公开(公告)号：US20150077905A1
公开(公告)日：2015-03-19
申请号：US14485622
申请日：2014-09-12
发明人： Hong Kyu SHIN , Jae Bum CHO , Wan Suk YANG , Hyun Sub OH
CPC分类号： H01G9/15 , H01G9/012 , H01G9/08 , H01G9/10 , H05K1/0265 , H05K1/181 , H05K2201/049 , H05K2201/0979 , H05K2201/10015 , Y02P70/611
摘要： A solid electrolytic capacitor may include: a capacitor body containing a tantalum powder and having a tantalum wire formed on one end portion thereof; a mounting board formed on a lower surface of the capacitor body and including an insulating layer and wiring layers formed on an upper surface and a lower surface of the insulating layer; a side electrode contacting an end portion of the tantalum wire and connected to the wiring layers of the mounting board; and a molding part enclosing the capacitor body and the tantalum wire. The mounting board may have a via electrode penetrating through the insulating layer and electrically connecting the wiring layers formed on the upper surface and the lower surface of the insulating layer.
摘要翻译： 固体电解电容器可以包括：在其一个端部形成有钽粉末并具有钽线的电容器主体; 形成在所述电容器主体的下表面上的安装板，其包括形成在所述绝缘层的上表面和下表面上的绝缘层和布线层; 与所述钽线的端部接触并与所述安装基板的配线层连接的侧面电极; 以及包围电容器体和钽丝的成型部。 安装板可以具有穿过绝缘层的通孔电极，并且电连接形成在绝缘层的上表面和下表面上的布线层。
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公开(公告)号：US08908385B2
公开(公告)日：2014-12-09
申请号：US11659124
申请日：2005-06-29
申请人： Claus Moessner , Burkhard Triess , Gert Maier , Peter Bach
发明人： Claus Moessner , Burkhard Triess , Gert Maier , Peter Bach
IPC分类号： H05K1/18 , H01L23/498 , H05K3/34 , H05K3/22 , H05K1/14
CPC分类号： H01L23/49827 , H01L23/49838 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/15312 , H05K1/141 , H05K1/144 , H05K3/225 , H05K3/3436 , H05K2201/049 , H05K2201/10325 , H05K2201/10734 , H05K2203/176 , H01L2224/0401
摘要： An interface module has an integrated component for replacing a component on a circuit board, the terminal contacts on the bottom side of the interface module being designed as provided for the contacts of the component on the circuit board, the interface module being divided into an adaptor part as a base module and a protocol converter part as a tool access module.
摘要翻译： 接口模块具有用于替换电路板上的部件的集成部件，接口模块的底侧上的端子触点设计为为电路板上的部件的触点提供，接口模块被分成适配器 部分作为基本模块和协议转换器部分作为工具访问模块。
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公开(公告)号：US08878339B2
公开(公告)日：2014-11-04
申请号：US13569454
申请日：2012-08-08
申请人： Kazuo Hattori , Isamu Fujimoto
发明人： Kazuo Hattori , Isamu Fujimoto
IPC分类号： H01L21/02 , H01G4/232 , H01L49/02 , H01G2/06 , H05K3/34 , H01L23/13 , H01L23/498 , H01G4/12 , H05K1/18
CPC分类号： H01G4/232 , H01G2/065 , H01G4/12 , H01L23/13 , H01L23/49805 , H01L28/40 , H01L2924/0002 , H05K1/181 , H05K3/3442 , H05K2201/049 , H05K2201/09181 , H05K2201/099 , H05K2201/10015 , Y02P70/613 , H01L2924/00
摘要： In a chip-component structure, a monolithic ceramic capacitor is a structure including a predetermined number of substantially flat internal electrodes stacked on each other. An interposer includes a substrate larger than the outer shape of the monolithic ceramic capacitor. The substrate includes a first major surface on which first front electrodes for use in mounting the monolithic ceramic capacitor are disposed and a second major surface on which first back electrodes for use in connecting to an external circuit board are disposed. The interposer includes a depression in its side surface. The depression includes a wall surface on which a connection conductor is disposed. The front surface of the substrate is overlaid with resist films extending along its edges.
摘要翻译： 在芯片部件结构中，单片陶瓷电容器是包括彼此堆叠的预定数量的基本平坦的内部电极的结构。 插入器包括比单片陶瓷电容器的外形大的衬底。 基板包括第一主表面，第一主表面设置有用于安装单片陶瓷电容器的第一前电极，并且第二主表面设置有用于连接到外部电路板的第一背电极。 插入件包括其侧表面上的凹陷。 凹陷包括壁表面，连接导体设置在该壁表面上。 衬底的前表面与沿其边缘延伸的抗蚀剂膜重叠。
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公开(公告)号：US08876414B2
公开(公告)日：2014-11-04
申请号：US13673225
申请日：2012-11-09
CPC分类号： G02B6/42 , G02B6/4204 , G02B6/422 , G02B6/428 , H05K1/141 , H05K1/18 , H05K3/30 , H05K2201/049 , H05K2201/09181 , H05K2201/10121 , H05K2201/1034 , Y10T29/4913
摘要： An optical device board 2 is set to be a printed circuit board in which an optical device 6 is bonded into a predetermined position of a printed wiring board 5. The optical device board 2 is bonded to a base board 3 provided with a plurality of wiring terminals 7. A lens barrel 4 is bonded to the optical device board 2. The optical device 6 is bonded into a position calculated from an actual measured dimension of the printed wiring board 5, and the calculated position is held and positioning is carried out in such a manner that a central axis of the lens barrel 4 is coincident with the calculated position when the lens barrel 4 is to be bonded to the optical device board 2.
摘要翻译： 光学器件基板2被设置为印刷电路板，其中将光学器件6接合到印刷线路板5的预定位置。光学器件基板2接合到设置有多个布线的基板3 端子7.镜筒4接合到光学装置基板2上。光学装置6被结合到根据印刷电路板5的实际测量尺寸计算的位置，并且保持所计算的位置并定位在 使透镜筒4的中心轴与透镜镜筒4要结合到光学装置基板2时的计算位置一致。
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