公开(公告)号：US10232415B2

公开(公告)日：2019-03-19

申请号：US14725515

申请日：2015-05-29

Applicant: Semes Co., Ltd.

Inventor： Gil Hun Song ,  Ki Ryong Choi ,  Young Chol Choi ,  Giu Su Park ,  Sun Yong Park

IPC: H01L21/67 ,  B08B13/00

Abstract: A substrate-treating apparatus is disclosed. The substrate-treating apparatus may include a vessel configured to provide a treatment space therein, a substrate-supporting unit provided in the vessel to support a substrate, and a spraying member configured to spray treatment solution on the substrate loaded on the substrate-supporting unit. The vessel may have an inner side surface, on which at least one texture pattern is formed.

公开(公告)号：US20190057884A1

公开(公告)日：2019-02-21

申请号：US16102812

申请日：2018-08-14

Applicant: SEMES CO., LTD.

Inventor： MINHEE CHO ,  JAEHYEOK YU ,  SEHOON OH ,  TAE-KEUN KIM ,  YERIM YEON ,  HAE RIM OH ,  JI SOO JEONG

IPC: H01L21/67 ,  H01L21/02

Abstract: Disclosed are relate to an apparatus for supplying a cleaning liquid to a substrate. The cleaning liquid supply unit includes a mixing container having a liquid mixing space in the interior thereof, a first supply member configured to supply a first liquid into the liquid mixing space, a second supply member configured to supply a second liquid that is different from the first liquid into the liquid mixing space, and a mixing member configured to mix the first liquid and the second liquid supplied into the liquid mixing space, and the mixing member may include a circulation line, through which the liquids in the liquid mixing space circulate, and a pressure adjusting member configured to provide a pressure to the liquids such that the liquids in the liquid mixing space flows into the circulation line and adjust the pressure.

公开(公告)号：US20180373154A1

公开(公告)日：2018-12-27

申请号：US15995588

申请日：2018-06-01

Applicant: SEMES CO., LTD.

Inventor： Hae-Won Choi ,  Kihoon Choi ,  Ki-Moon Kang ,  Chan Young Heo ,  Anton Koriakin ,  Jaeseong Lee

IPC: G03F7/42 ,  H01L21/67 ,  H01L21/677 ,  H01L21/027 ,  H01L21/02 ,  G03F7/038 ,  G03F7/039 ,  G03F7/32 ,  G03F7/40 ,  G03F7/20

Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes a first process chamber configured to supply a development liquid to a substrate that is carried into the first process chamber after an exposure process is performed on the substrate, a second process chamber configured to treat the substrate through a supercritical fluid, a feeding robot configured to transfer the substrate from the first process chamber to the second process chamber, and a controller configured to control the feeding robot such that the substrate is transferred to the second process chamber in a state in which the development liquid supplied by the first process chamber resides in the substrate.

公开(公告)号：US10160001B2

公开(公告)日：2018-12-25

申请号：US15332184

申请日：2016-10-24

Applicant: SEMES CO., LTD.

Inventor： Gilsoo Park

IPC: B05C1/00 ,  H01L21/67 ,  H01L21/677

Abstract: An apparatus for treating a substrate is provided having a treating module, a buffer module, and an index module arranged in sequentially along a first direction. The index module includes a load port where a substrate receiving container places an index module configured to transfer the substrate between the load port and the buffer module. The buffer module includes a first and second buffer unit arranged along a second direction perpendicular to the first direction. The treating module includes a first treating unit, a second treating unit, a first transfer chamber, and a second transfer chamber, wherein the first transfer chamber includes a first transfer robot configured to transfer the substrate between the first buffer unit and the first treating unit, and wherein the second transfer chamber includes a second transfer robot configured to transfer the substrate between the second buffer unit and the second treating unit.

公开(公告)号：US10133264B2

公开(公告)日：2018-11-20

申请号：US14921605

申请日：2015-10-23

Applicant: Semes Co., Ltd.

Inventor： Sung Min Lim

IPC: G05B19/418 ,  H01L21/67

Abstract: A method of aging a substrate-processing apparatus according to the inventive concepts may include receiving advance information of a scheduled substrate-receiving container to be loaded on a load port of the substrate-processing apparatus from a host computer, and loading a test substrate into a process chamber to perform an inspection process by means of the advance information.

公开(公告)号：US10109506B2

公开(公告)日：2018-10-23

申请号：US15604141

申请日：2017-05-24

Applicant: SEMES CO., LTD.

Inventor： Heehwan Kim ,  Young Hun Lee

IPC: H01L21/67 ,  H01L21/02

Abstract: Provided is an apparatus and method for supplying a fluid. The substrate treating apparatus comprises a treating unit for treating a substrate and a fluid supply unit for supplying fluid to the treating unit, wherein the fluid supply unit comprises a supply tank in which the fluid is stored, a supply line connecting the supply tank and the treating unit to supply the fluid from the supply tank to the treating unit, a filter installed on the supply line, and an exhaust line branching from the supply line, wherein a branch point of the exhaust line in the supply line is located upstream of the filter.

公开(公告)号：US20180246163A1

公开(公告)日：2018-08-30

申请号：US15896399

申请日：2018-02-14

Applicant: SEMES CO., LTD.

Inventor： Soo Man KWAK ,  Hyun Chai JUNG ,  Jin Gook KIM

IPC: G01R31/28 ,  G01R31/36 ,  H01L21/66

CPC classification number: G01R31/2875 ,  G01R31/2891 ,  G01R31/382 ,  H01L22/34

Abstract: A method of testing semiconductor packages, which performs an electrical test on the semiconductor packages after receiving the semiconductor packages into insert pockets of a test tray and connecting with sockets of a tester by using pusher units each including a heater, includes receiving temperature information of the semiconductor packages from the tester while testing the semiconductor packages, calculating an overall average temperature of the semiconductor packages from the received temperature information, and individually controlling operations of heaters of the pusher units based on difference values between the overall average temperature and individual temperatures of the semiconductor packages.

公开(公告)号：US20180147834A1

公开(公告)日：2018-05-31

申请号：US15819229

申请日：2017-11-21

Applicant: Semes Co., Ltd.

Inventor： Suk-Won Jang

IPC: B41J2/045

CPC classification number: B41J2/0456 ,  B41J2/04586 ,  B41J2/2139 ,  B41J2/2146 ,  B41J25/001

Abstract: In a printing method using an ink jet head unit including a plurality of ink jet heads disposed in a horizontal direction over an object in which each of adjacent end portions of the plurality of ink jet heads has more than one overlapped nozzle, a supply of droplets from each of the nozzles of the plurality of ink jet heads may be identified. A combination of supplies of the droplets from the nozzles of the plurality of ink jet heads may be determined to form a desired pattern on the object. The desired pattern may be formed on the object using the plurality of ink jet heads including the nozzles arranged in accordance with the determined combination of the supplies of the droplets.

公开(公告)号：US09978567B2

公开(公告)日：2018-05-22

申请号：US14607816

申请日：2015-01-28

Applicant: SEMES CO., LTD.

Inventor： Yong-Hyun Ham ,  Hyung Je Woo ,  Hyun Joong Kim ,  Wan-Jae Park ,  Kyu Young Han

IPC: H01J37/32 ,  C23C16/44 ,  H01L21/00

CPC classification number: H01J37/32862 ,  C23C16/4401 ,  C23C16/4405 ,  H01J37/32935 ,  H01J37/32972 ,  H01L21/00

Abstract: Provided are an apparatus and a method of treating a substrate using process gas. The apparatus may include a chamber configured to provide a treatment space, in which a process of treating a substrate is performed, a detection unit configured to detect an amount of reaction by-products attached on an inner surface of the chamber. The detection unit may include a window member provided on the inner surface of the chamber, and a light source member configured to emit and receive light through the window member.

公开(公告)号：US20180114707A1

公开(公告)日：2018-04-26

申请号：US15793263

申请日：2017-10-25

Applicant: SEMES CO., LTD.

Inventor： Do-Youn Lim ,  Joonho Won ,  Kisang Eum ,  Boong Kim ,  Joo Jib Park

IPC: H01L21/67 ,  F26B5/04 ,  H01L21/02

CPC classification number: H01L21/67034 ,  F26B5/04 ,  H01L21/02052 ,  H01L21/02101 ,  H01L21/6704 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67109 ,  H01L21/67126 ,  H01L21/6715 ,  H01L21/6719 ,  H01L21/68742

Abstract: Embodiments of the inventive concept relate to an apparatus for treating a substrate in a high-pressure atmosphere. The apparatus includes a process chamber having an upper body and a lower body that are combined with each other to provide a treatment space therein, an elevation member configured to elevate any one of the upper body and the lower body to an opening location at which the upper body and the lower body is spaced apart or a closing location at which the upper body and the lower body is attached, a clamping member configured to clamp the upper body and the lower body located at the closing location, and a movable member configured to move the clamping member to a locking location at which the clamping member clamps the process chamber or to the release location at which the clamping member is spaced apart from the process chamber.