公开(公告)号：US4964408A

公开(公告)日：1990-10-23

申请号：US188217

申请日：1988-04-29

Applicant: Karl M. Hink ,  Mark H. Polczynski

Inventor： Karl M. Hink ,  Mark H. Polczynski

IPC: A61B5/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34

CPC classification number: A61B5/14552 ,  H05K1/189 ,  A61B2562/227 ,  H05K1/118 ,  H05K2201/0715 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10651 ,  H05K3/3421

Abstract: An oximeter sensor assembly (40) includes a thin elongated flexible sheet-like strip (42) having an integral end portion (44) flexibly wrapping at least partially around a human body part (26), a plurality of electrical conductors (46-50) on the strip, and light emitting and receiving electrical components (28a, 30a) mounted on the strip on the end portion and electrically connected to the conductors. Flexible conductive encompassing shielding layers (62, 66) are also provided, together with outer insulating layers (61, 67). Connection adapter structure (94) is also provided.

Abstract translation: 血氧饱和度传感器组件（40）包括细长的柔性片状条带（42），其具有至少部分地围绕人体部分（26）柔性包裹的整体端部（44），多个电导体（46-50 ），以及发光和接收安装在端部上的条上的电气部件（28a，30a）并且电连接到导体。 柔性导电围绕屏蔽层（62,66）也与外部绝缘层（61,67）一起提供。 还提供了连接适配器结构（94）。

公开(公告)号：US4902237A

公开(公告)日：1990-02-20

申请号：US331214

申请日：1989-03-30

Applicant: Curtis L. Huetson

Inventor： Curtis L. Huetson

IPC: H01R12/57 ,  H05K3/30 ,  H05K3/34 ,  H05K13/04

CPC classification number: H05K13/046 ,  H05K3/301 ,  H05K3/308 ,  H05K3/3426 ,  H05K2201/09954 ,  H05K2201/10295 ,  H05K2201/1031 ,  H05K2201/10325 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10962 ,  H05K3/3447 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49149

Abstract: An adaptor for interfacing a surface mount or through-hole electrical component to a printed circuit board. In one orientation of the adaptor relative to the printed circuit board, the adaptor receives a through-hole component and interfaces this component to a printed circuit board position designed for a surface mount component. In another orientation of the adaptor relative to the printed circuit board, the adaptor receives a surface mount component and interfaces this component to a printed circuit board position designed for a through-hole component. Advantageously, the adaptor is compatible with high-volume assembly techniques, such as wave soldering and machine insertion.

Abstract translation: 用于将表面安装或通孔电气部件连接到印刷电路板的适配器。 在适配器相对于印刷电路板的一个方向上，适配器接收通孔部件并将该部件接合到为表面安装部件设计的印刷电路板位置。 在适配器相对于印刷电路板的另一方向，适配器接收表面安装部件并将该部件接合到为通孔部件设计的印刷电路板位置。 有利的是，适配器与诸如波峰焊接和机器插入之类的大容量装配技术兼容。

公开(公告)号：US4897051A

公开(公告)日：1990-01-30

申请号：US167050

申请日：1988-03-11

Applicant: Donald J. Kasprzyk

Inventor： Donald J. Kasprzyk

IPC: H01H1/58 ,  H01H71/16 ,  H01H73/30 ,  H05K1/02 ,  H05K1/11 ,  H05K3/30

CPC classification number: H01H1/5822 ,  H05K3/308 ,  H01H71/164 ,  H01H73/30 ,  H05K1/0271 ,  H05K1/115 ,  H05K2201/068 ,  H05K2201/10295 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10962

Abstract: A flexible electrical connection for use in mounting electrical components to provide three dimensional flexiblity without allowing short circuiting or adverse temperature response which comprises thin and flat conductor leads shaped and bent to form relatively long flat extension portions which are bendable and twistable to permit flexibility in each of the desired directions.

Abstract translation: 用于安装电气部件以提供三维柔性的柔性电连接，以提供短路或不利的温度响应，其包括成形和弯曲的扁平和扁平的导体引线，以形成相对较长的扁平延伸部分，该扁平延伸部分可弯曲和可扭曲，以允许每个 的所需方向。

公开(公告)号：US4785990A

公开(公告)日：1988-11-22

申请号：US891557

申请日：1986-07-29

Applicant: Kunikazu Nakahara ,  Kazuhiro Yasuda

Inventor： Kunikazu Nakahara ,  Kazuhiro Yasuda

IPC: H01G4/228 ,  H05K3/30 ,  B23K31/02

CPC classification number: H01G4/228 ,  H05K3/308 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10871 ,  Y10T29/49121

Abstract: An electronic component with lead terminals, includes an electronic component element, electrodes respectively formed on opposite end faces of the electronic component element, and lead terminals respectively connected to the electrodes for electrical conduction, and each of the lead terminals having a large width portion formed at one end of its small width tip portion, and the large width portions of the lead terminals being conductively connected to the electrodes of the electronic component element. The disclosure is also directed to a method of manufacturing such electronic component.

Abstract translation: 具有引线端子的电子部件包括电子部件元件，分别形成在电子元件的相对端面上的电极和分别与电极连接的导电端子，导电端子形成为宽度大的部分 在其小宽度尖端部分的一端处，并且引线端子的大宽度部分导电地连接到电子元件的电极。 本公开还涉及制造这种电子部件的方法。

公开(公告)号：US4777564A

公开(公告)日：1988-10-11

申请号：US122606

申请日：1987-11-17

Applicant: Dennis J. Derfiny ,  Joseph D. Ceccoli ,  Emery E. Baxter

Inventor： Dennis J. Derfiny ,  Joseph D. Ceccoli ,  Emery E. Baxter

IPC: H01L23/495 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01R9/00

CPC classification number: H05K3/3426 ,  H01L23/49555 ,  H01R12/57 ,  H05K1/0271 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10772 ,  H05K2201/2036 ,  H05K2203/0191 ,  H05K3/305 ,  Y02P70/611 ,  Y02P70/613

Abstract: An improved leadform for use with surface mount components is described. The improved leadform provides a connection to a printed circuit substrate which is highly resistant to stress related failures. The leadform is configured so that the connection utilizes a relatively greater area of the leadform for contact with a solder connection resulting in a more compliant connection. In addition, the present invention provides a preparation for the printed circuit media which allows the substrate media to absorb stresses which occur due to thermal cycling.

Abstract translation: 描述了一种用于表面安装部件的改进的引线形式。 改进的引线形式提供与印刷电路基板的连接，其高度抵抗与应力相关的故障。 引线形状被配置为使得连接利用引线形式的相对较大的区域与焊接连接接触，导致更顺从的连接。 此外，本发明提供了印刷电路介质的准备，其允许基板介质吸收由于热循环而发生的应力。

公开(公告)号：US4774634A

公开(公告)日：1988-09-27

申请号：US820239

申请日：1986-01-21

Applicant: Howard L. Tate ,  Gary L. Romeike ,  Vinai M. Tara ,  James L. Vocture

Inventor： Howard L. Tate ,  Gary L. Romeike ,  Vinai M. Tara ,  James L. Vocture

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/46

CPC classification number: H05K3/305 ,  H05K1/0263 ,  H05K3/321 ,  H05K1/095 ,  H05K1/181 ,  H05K1/189 ,  H05K2201/09472 ,  H05K2201/09772 ,  H05K2201/10272 ,  H05K2201/1028 ,  H05K2201/10515 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2203/1453 ,  H05K3/28 ,  H05K3/4664 ,  H05K3/4685 ,  Y02P70/613 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: A printed circuit assembly includes surface mounted circuit components held in place on a printed circuit board by a rigid connection. The outwardly extending leads of the circuit component are bonded to conductive areas of the board by an electrically conducting flexible adhesive. The combination of a rigid mechanical connection between the body portion of the circuit component and the board and a flexible, electrically conductive connection between each lead end and the board provides an arrangement capable of withstanding shock loading, as well as vibrational and bending forces to which the assembly might be subjected. The assembly lends itself to relatively inexpensive circuit boards produced by printing techniques, typically including applied metal buses that serve as low resistance shunts to the power connections of the circuit components.

Abstract translation: 印刷电路组件包括通过刚性连接保持在印刷电路板上的适当位置的表面安装电路部件。 电路部件的向外延伸的引线通过导电柔性粘合剂粘合到板的导电区域。 电路部件的本体部分与电路板之间的刚性机械连接与每个引线端与电路板之间的柔性导电连接的组合提供了能够承受冲击载荷以及振动和弯曲力的装置， 装配可能会受到影响。 该组件本身适用于通过印刷技术生产的相对便宜的电路板，通常包括用作电路部件的电源连接的低电阻分流器的应用金属总线。

公开(公告)号：US4658104A

公开(公告)日：1987-04-14

申请号：US724862

申请日：1985-04-19

Applicant: Haruyuki Koizumi ,  Koichi Omae

Inventor： Haruyuki Koizumi ,  Koichi Omae

IPC: H01H3/12 ,  H01H13/702 ,  H01R12/06 ,  H05K1/11 ,  H05K3/00 ,  H05K3/30 ,  H05K3/32 ,  H01R9/09

CPC classification number: H05K3/326 ,  H01H13/702 ,  H01H2219/014 ,  H01H2219/04 ,  H05K1/118 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K3/0058 ,  H05K3/306

Abstract: A printed wiring board comprising a supporting frame, a resilient sheet supported by the supporting frame and having a wiring pattern formed thereon, and a tongue member made of the resilient sheet and providing the wiring pattern formed thereon; the supporting frame having a escape space formed therein corresponding to the tongue member; the terminal of an electronic device being pressed against the wiring pattern of the tongue member in such a manner that the restoring force of the tongue member completes the electrical connection between the wiring pattern and the terminal of the electronic device.

Abstract translation: 一种印刷线路板，包括支撑框架，由所述支撑框架支撑并且具有形成在其上的布线图案的弹性片以及由所述弹性片制成并设置在其上的布线图案的舌构件; 所述支撑框架具有形成在其中的与所述舌部件对应的逸出空间; 电子装置的端子以舌状构件的恢复力完成电气装置的布线图形和端子之间的电连接的方式被按压在舌构件的布线图案上。

公开(公告)号：US4641222A

公开(公告)日：1987-02-03

申请号：US614366

申请日：1984-05-29

Applicant: Dennis J. Derfiny ,  Anthony P. van den Heuvel ,  Nihat S. Edguer

Inventor： Dennis J. Derfiny ,  Anthony P. van den Heuvel ,  Nihat S. Edguer

IPC: H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H05K3/303 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/2036 ,  H05K3/305 ,  H05K3/3442 ,  Y02P70/611 ,  Y02P70/613

Abstract: An improved mounting system for surface mounted components is described. The mounting system of the present invention provides preparations for surface mounted components and the printed circuit substrate which render the resultant assembly highly resistant to stresses which occur due to thermal cycling. The printed circuit substrate is conditioned by removing selected areas of media surrounding the points of attachment between the surface mounted component and the printed circuit media. In addition, a spacing element is disposed between the surface mounted component and the printed circuit media to promote the formation of a virtual lead during assembly.

Abstract translation: 描述了用于表面安装部件的改进的安装系统。 本发明的安装系统提供了用于表面安装部件和印刷电路基板的制备，其使所得组件高度抵抗由于热循环而发生的应力。 印刷电路基板通过移除围绕表面安装部件和印刷电路介质之间的连接点周围的选定区域进行调节。 此外，间隔元件设置在表面安装部件和印刷电路介质之间，以促进在组装期间形成虚拟引线。

公开(公告)号：US4385213A

公开(公告)日：1983-05-24

申请号：US211826

申请日：1980-12-01

Applicant: Willis A. Larson

Inventor： Willis A. Larson

IPC: H01H13/702 ,  H01H13/83 ,  H05K1/18 ,  H05K3/32 ,  H01H13/70 ,  H05K1/00

CPC classification number: H05K3/326 ,  H01H13/702 ,  H01H13/83 ,  H01H2219/04 ,  H01H2229/038 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10106 ,  H05K2201/10393 ,  H05K2201/10651 ,  H05K2201/10977

Abstract: An electrical component attachment for securing discrete components to a rigid circuit board without the use of plated-through holes. A unitary sheet member has a membrane portion and a flap portion. The membrane portion lies on one side of the circuit board. The flap portion wraps around an edge of the circuit board and is adhesively secured to the other side of the board. An electrical component is disposed between the flap portion and the board so as to be secured thereto by the flap portion. The sheet has conductive traces which contact the leads of the electrical component, providing electrical connection thereto. The sheet may have a tail onto which the traces extend for connection to external circuitry.

Abstract translation: 电气部件附件，用于将分立部件固定到刚性电路板上，而不使用电镀通孔。 整体片材具有膜部分和折片部分。 膜部分位于电路板的一侧。 翼片部分围绕电路板的边缘缠绕并且粘合地固定到板的另一侧。 电气部件设置在翼片部分和板之间，以通过翼片部分固定到其上。 片材具有与电气部件的引线接触的导电迹线，提供与其电连接。 片材可以具有尾部，迹线延伸到其上用于连接到外部电路。

公开(公告)号：US4040121A

公开(公告)日：1977-08-02

申请号：US581223

申请日：1975-05-27

Applicant: Reed H. Grundy

Inventor： Reed H. Grundy

IPC: H05K1/02 ,  H05K3/22 ,  H05K3/30 ,  H05K3/34 ,  H05K3/40 ,  H05K5/00

CPC classification number: H05K3/3447 ,  H05K3/308 ,  H05K2201/09418 ,  H05K2201/0979 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2201/10363 ,  H05K2201/10651 ,  H05K2201/10939 ,  H05K3/222 ,  H05K3/4046

Abstract: The external lead from a critical circuit element in a circuit component of a larger apparatus is connected to a first terminal or connector pad on a printed circuit board and at a more distant point on the lead to a second connector pad. The connection to the next element of that component is made from the second pad. Any component output to the next circuit component is connected to the first pad. Thus, any high resistance in a poor solder joint appears on the safe side of the first pad connections, that is, in the circuit connections to the next element or in the output circuit.