公开(公告)号：US08319107B2

公开(公告)日：2012-11-27

申请号：US12162740

申请日：2007-02-07

Applicant: Ki-Geon Lee

Inventor： Ki-Geon Lee

IPC: H05K7/20

CPC classification number: H05K1/0206 ,  H05K1/116 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/09609 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/10106 ,  H05K2201/10303 ,  H05K2201/10651

Abstract: A circuit board and a heat radiating system of the circuit board. In the circuit board, a plurality of conductive layer regions coated with a conductor are separately formed on both sides of an insulating substrate, the conductive layer region formed on either side of an insulating region on each of the both sides of the insulating substrate, the plurality of the conductive layer regions includes a plurality of through holes which penetrate through the insulating substrate and are coated with a conductor over an inner wall, the conductor in the through hole electrically conducts the coated conductor of the plurality of the conductive layer regions, one of the lead pins is connected to one of the separated conductive layer regions on the both sides based on the insulating region, and the other lead pin is connected to the other conductive layer region. Accordingly, the efficient heat radiation of the circuit board can prevent the component malfunction, the lifespan reduction, the power consumption increase, and the illuminance drop.

Abstract translation: 电路板的电路板和散热系统。 在电路基板中，在绝缘基板的两面分别形成涂布有导体的多个导电层区域，在绝缘基板的两侧的绝缘区域的两侧形成的导电层区域， 多个导电层区域包括穿过绝缘基板并在内壁上涂覆有导体的多个通孔，通孔中的导体导电多个导电层区域的涂覆导体，一个 基于绝缘区域将引线引脚连接到两侧的分离的导电层区域中的一个，另一个引脚与另一个导电层区域连接。 因此，电路板的高效散热可以防止元件故障，寿命降低，功率消耗增加和照度下降。

公开(公告)号：US08283790B2

公开(公告)日：2012-10-09

申请号：US12691716

申请日：2010-01-21

Applicant: Wen-Chieh Tsou

Inventor： Wen-Chieh Tsou

IPC: H01L33/00 ,  H01L23/495 ,  H01L23/498

CPC classification number: H05K1/111 ,  H01L23/49555 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3421 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/099 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10689 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic device includes a carrier, a surface mounting device, and solders. The carrier has a plurality of bonding pads, and at least one of the bonding pads has a notch, such that the bonding pad has a necking portion adjacent to the notch. The surface mounting device is disposed on the carrier. Besides, the surface mounting device has a plurality of leads, and each of the leads is connected to the necking portion of one of the bonding pads, respectively. The notch of each of the bonding pads is located under one of the leads. The solders connect the bonding pads and the leads.

Abstract translation: 电子设备包括载体，表面安装装置和焊料。 载体具有多个接合焊盘，并且至少一个接合焊盘具有凹口，使得焊盘具有与凹口相邻的颈缩部分。 表面安装装置设置在载体上。 此外，表面安装装置具有多个引线，并且每个引线分别连接到一个接合焊盘的颈缩部分。 每个接合焊盘的凹口位于一个引线下方。 焊料连接焊盘和引线。

公开(公告)号：US08031043B2

公开(公告)日：2011-10-04

申请号：US11970661

申请日：2008-01-08

Applicant: Martin Schultz ,  Peter Kanschat

Inventor： Martin Schultz ,  Peter Kanschat

IPC: H01C7/10

CPC classification number: H05K1/0203 ,  G01R1/203 ,  H01C1/014 ,  H01C1/08 ,  H01C1/14 ,  H01L2924/19107 ,  H05K1/0263 ,  H05K1/0268 ,  H05K3/328 ,  H05K2201/0209 ,  H05K2201/10022 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2203/0195 ,  H05K2203/0285 ,  H05K2203/049

Abstract: The invention relates to an arrangement comprising a shunt resistor with at least an electrically conductive first connecting leg and an electrically conductive second connecting leg. A resistance area of the shunt resistor is electrically connected to the first connecting leg and to the second connecting leg. The arrangement further comprises a circuit carrier with a first metallization and a second metallization. The first connecting leg is directly joined to the first metallization and the second connecting leg is directly joined to the second metallization. The resistance area of the shunt resistor is in thermal contact with the thermally conductive substrate by use of a thermal filler arranged between the resistance area and the substrate, and/or by directly contacting the resistance area with the substrate.The invention further relates to a method for producing an arrangement with a shunt resistor and a circuit carrier.

Abstract translation: 本发明涉及一种包括具有至少导电的第一连接腿和导电的第二连接腿的分流电阻器的装置。 分流电阻器的电阻区域电连接到第一连接腿部和第二连接腿部。 该装置还包括具有第一金属化和第二金属化的电路载体。 第一连接腿直接连接到第一金属化，第二连接腿直接连接到第二金属化。 分流电阻器的电阻区域通过使用布置在电阻区域和衬底之间的热填料和/或通过使电阻区域与衬底直接接触而与导热衬底热接触。 本发明还涉及一种用于产生具有分流电阻器和电路载体的装置的方法。

公开(公告)号：US07839621B2

公开(公告)日：2010-11-23

申请号：US12039284

申请日：2008-02-28

Applicant: Yukihiko Shirakawa ,  Iwao Miura

Inventor： Yukihiko Shirakawa ,  Iwao Miura

IPC: H01G4/228 ,  H01G4/248 ,  H01G4/06

CPC classification number: H01G2/06 ,  H01C1/14 ,  H01G4/228 ,  H01G9/008 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10462 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/611 ,  Y02P70/613

Abstract: A surface mount type electronic component has a dielectric element body, electrodes, lead conductors, and lead wires. The dielectric element body has principal faces and side faces. One electrode is formed on one principal face, the other electrode is formed on the other principal face, and the electrodes face each other. A first portion of one lead conductor is laid on one side face. A first portion of the other lead conductor is laid on another side face. First portions of the lead wires are connected to the corresponding first portions of the lead conductors.

Abstract translation: 表面安装型电子部件具有电介质元件主体，电极，引线导体和引线。 电介质元件主体具有主面和侧面。 一个电极形成在一个主面上，另一个电极形成在另一个主面上，电极彼此面对。 一个引线导体的第一部分放置在一个侧面上。 另一个引线导体的第一部分被放置在另一侧面上。 引线的第一部分连接到引线导体的对应的第一部分。

公开(公告)号：US20100232179A1

公开(公告)日：2010-09-16

申请号：US12713178

申请日：2010-02-26

Applicant: JIAN-SHIHN TSANG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN

Inventor： JIAN-SHIHN TSANG ,  LUNG-HSIN CHEN ,  CHIH-YUNG LIN

IPC: F21V7/04 ,  H05K1/00 ,  H05K1/16 ,  F21V19/00

CPC classification number: H05K1/111 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H05K3/3421 ,  H05K2201/09381 ,  H05K2201/10106 ,  H05K2201/10462 ,  H05K2201/10651 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A back light module includes a printed circuit board and a plurality of surface mounting elements mounted on the printed circuit board. Each surface mounting element is an LED lighting element. The printed circuit board has a plurality of pads. Each of the pads includes a first bar and two second bars extending respectively from two ends of the first bar. The surface mounting element includes a plurality of pins. The pins are placed on two sides of the surface mounting element. The pins are soldered on the pads.

Abstract translation: 背光模块包括印刷电路板和安装在印刷电路板上的多个表面安装元件。 每个表面安装元件是LED照明元件。 印刷电路板具有多个焊盘。 每个垫包括分别从第一杆的两端延伸的第一杆和两个第二杆。 表面安装元件包括多个销。 销被放置在表面安装元件的两侧。 引脚焊接在焊盘上。

公开(公告)号：US07755911B2

公开(公告)日：2010-07-13

申请号：US12081503

申请日：2008-04-16

Applicant: Masaoki Yoshida ,  Takuya Nakayama ,  Koji Ueyama

Inventor： Masaoki Yoshida ,  Takuya Nakayama ,  Koji Ueyama

IPC: H01R9/00

CPC classification number: H05K1/116 ,  H05K1/0256 ,  H05K3/3447 ,  H05K2201/09363 ,  H05K2201/09463 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2201/10651 ,  H05K2203/1446

Abstract: A printed wiring board which can certainly prevent damage of conductive pattern caused by the terminal. The printed wiring board has a board, a conductive pattern, a through-hole and a non-conductive area. A lead wire of resistance mounted on the printed wiring board is inserted into the through-hole 4. The lead wire projects from a surface of the board, and is bent close to the surface. The non-conductive area is formed into a fan-shaped shape enlarging toward a tip of the lead wire from a center of the through-hole. Because the bent lead wire is arranged on the non-conductive area, the non-conductive area can prevent damage of the conductive pattern which is caused by touching the lead wire to the conductive pattern.

Abstract translation: 可以防止端子引起的导电图案的损坏的印刷电路板。 印刷电路板具有基板，导电图案，通孔和非导电区域。 安装在印刷线路板上的电阻引线插入到通孔4中。引线从板的表面突出并且靠近表面弯曲。 非导电区域形成为从通孔的中心向引线的尖端扩大的扇形形状。 由于弯曲的引线布置在非导电区域上，所以非导电区域可以防止由引线接触导电图案而导致的导电图案的损坏。

公开(公告)号：US07746660B1

公开(公告)日：2010-06-29

申请号：US11546037

申请日：2006-10-10

Applicant: Anthony T. Duong

Inventor： Anthony T. Duong

IPC: H05K7/10

CPC classification number: H05K1/0231 ,  H05K1/114 ,  H05K2201/09381 ,  H05K2201/0979 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611

Abstract: Reduced mounting inductance and/or an increased self-resonant frequency range of operation for capacitor circuits of a circuit board is described. The circuit board has a mounting pad for coupling a capacitor to at least three vias arranged in a pattern and coupled to the mounting pad at least three discrete locations to reduce mounting pad inductance. Alternatively or additionally, top and bottom mounted capacitors to the circuit board have a physically and electrically common through via to provide a self-resonant frequency range of operation.

Abstract translation: 描述了电路板的电容器电路的安装电感和/或增加的自谐振频率范围的降低。 电路板具有用于将电容器耦合到以图案布置的至少三个通孔的安装焊盘，并且至少三个离散的位置耦合到安装焊盘以减少安装焊盘电感。 或者或另外，电路板的顶部和底部安装的电容器具有物理和电学上通用的通孔，以提供自谐振频率范围的操作。

公开(公告)号：US07667976B2

公开(公告)日：2010-02-23

申请号：US12243243

申请日：2008-10-01

Applicant: Keiichi Sugimoto ,  Mitsuru Nakagawa

Inventor： Keiichi Sugimoto ,  Mitsuru Nakagawa

IPC: H05K13/04

CPC classification number: H05K3/303 ,  G07C9/00944 ,  H01L2924/1815 ,  H05K1/182 ,  H05K3/284 ,  H05K2201/10037 ,  H05K2201/10568 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/2036 ,  Y02P70/613 ,  Y10T29/49146

Abstract: A method of making an electronic circuit device includes preparing an electronic element having at least one projection, mounting the electronic element on only a first side of a circuit board in such a manner that the projection is substantially held in point contact with the first side of the circuit board to form a gap between the circuit board and the electronic element, placing the circuit board in a mold cavity in such a manner that a second side of the circuit board is held in close contact with an inner surface of the cavity. The method further includes encapsulating the circuit board in a casing by filling the cavity with a resin material so that the gap is filled with the resin material.

Abstract translation: 一种制造电子电路装置的方法包括制备具有至少一个突起的电子元件，将电子元件仅安装在电路板的第一侧上，使得突出部基本上保持与第一侧点接触 所述电路板在所述电路板和所述电子元件之间形成间隙，将所述电路板放置在模腔中，使得所述电路板的第二面与所述腔的内表面紧密接触。 该方法还包括通过用树脂材料填充空腔将电路板封装在壳体中，使得间隙填充有树脂材料。

公开(公告)号：US07661996B2

公开(公告)日：2010-02-16

申请号：US12118125

申请日：2008-05-09

Applicant: Shinji Takahashi ,  Yoshiaki Kato ,  Harehide Sasaki ,  Hiroshi Kobayashi

Inventor： Shinji Takahashi ,  Yoshiaki Kato ,  Harehide Sasaki ,  Hiroshi Kobayashi

IPC: H01R13/428

CPC classification number: H05K3/308 ,  H05K2201/10015 ,  H05K2201/10651 ,  H05K2201/10787 ,  H05K2201/10878

Abstract: An electrical connection terminal for a connection hole includes: a base-side end portion (310) having a predetermined width; a retaining portion (313) having an increasing width wider than the predetermined width of the base-side end portion (310), the retaining portion (313) being formed integrally with the base-side end portion (310); and an insertion taper portion (315) having a taper width narrower than the increasing width of the retaining portion (313) to reach a leading end portion, the insertion taper portion (315) being formed integrally with the retaining portion (313); in which the insertion taper portion (315) is composed of a plurality of taper portions taper angles of which change so as to increase along an insertion direction.

Abstract translation: 用于连接孔的电连接端子包括：具有预定宽度的底侧端部（310）; 保持部（313）与基底侧端部（310）一体形成，该保持部（313）具有比基部侧端部（310）的规定宽度大的宽度的宽度。 以及插入锥形部（315），其具有比所述保持部（313）的增加宽度窄的锥形宽度，以到达前端部，所述插入锥形部（315）与所述保持部（313）一体形成。 其中所述插入锥形部分（315）由多个锥形部分组成，所述多个锥形部分锥形角度沿着插入方向变化。

公开(公告)号：US20090218586A1

公开(公告)日：2009-09-03

申请号：US12160836

申请日：2007-01-10

Applicant: Jae Ho Cho ,  Jung Yun Kim ,  Kang Hyun Cho

Inventor： Jae Ho Cho ,  Jung Yun Kim ,  Kang Hyun Cho

IPC: H01L33/00

CPC classification number: F21V29/004 ,  F21S41/19 ,  F21S45/47 ,  F21V19/04 ,  F21V29/2212 ,  F21V29/767 ,  F21Y2115/10 ,  H05K3/325 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2203/167

Abstract: The present invention relates to a light emitting diode (LED) lamp, and an object of the present invention is to provide an LED lamp in which an LED can be easily exchanged and external vibration can be absorbed to prevent the play thereof. To this end, an LED lamp according to the present invention comprises an LED package having a lead frame; a printed circuit board separated from the LED package and having a conductive pattern formed on a surface thereof facing the lead frame; and a pressing means for pressing the LED package toward the PCB so that the lead frame is in contact with the conductive pattern.

Abstract translation: 发光二极管（LED）灯技术领域本发明涉及一种发光二极管（LED）灯，其目的在于提供一种能够容易地进行LED交换的LED灯，能够吸收外部振动，防止其发挥。 为此，根据本发明的LED灯包括具有引线框架的LED封装; 印刷电路板，与LED封装分离并且具有形成在其面向引线框架的表面上的导电图案; 以及用于将LED封装朝向PCB按压使得引线框架与导电图案接触的按压装置。