ANALYSIS OF VIRAL PARTICLES BY DIGITAL ASSAY
    32.
    发明公开

    公开(公告)号:US20230340627A1

    公开(公告)日:2023-10-26

    申请号:US18296357

    申请日:2023-04-05

    CPC classification number: C12Q1/701 G01N33/56983 C12Q1/6851

    Abstract: Methods, compositions, and kits for analyzing viral particles. In an exemplary method of analyzing viral particles, capsids of the viral particles may be tagged with a tag. Subsamples of a sample containing the viral particles may be formed. Each subsample of only a subset of the subsamples may include at least one of the viral particles. One or more targets may be amplified from a genome of the viral particles. Tag-related data, and amplification data for the one or more targets, may be collected from the subsamples. In some examples, a capsid occupancy of the viral particles may be determined in a calibration-free approach using the collected data without quantification of the viral particles or capsids thereof.

    METHODS AND COMPOSITIONS FOR MAXIMUM RELEASE OF OLIGONUCLEOTIDES

    公开(公告)号:US20230323435A1

    公开(公告)日:2023-10-12

    申请号:US18185220

    申请日:2023-03-16

    CPC classification number: C12Q1/6837 C12N15/1065

    Abstract: The methods allow for provision of a mixture of a plurality of beads, each bead linked to oligonucleotides, wherein the mixture can be treated as a bulk solution (prior to partitioning) to cleave a covalent bond linking the oligonucleotides to the beads while retaining a non-covalent linkage (via hybridization) between the beads and the oligonucleotides, allowing for distribution of the oligonucleotides and beads to partitions or 2D arrays prior to separation of the oligonucleotides from the beads, which occurs for example in the partitions.

    HEAT PUMP DEVICE AND ASSEMBLY
    39.
    发明公开

    公开(公告)号:US20230152011A1

    公开(公告)日:2023-05-18

    申请号:US17989938

    申请日:2022-11-18

    Abstract: A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.

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