Magnetic tunnel junction structure having an oxidized buffer layer and method of fabricating the same
    33.
    发明授权
    Magnetic tunnel junction structure having an oxidized buffer layer and method of fabricating the same 有权
    具有氧化缓冲层的磁隧道结结构及其制造方法

    公开(公告)号:US07141438B2

    公开(公告)日:2006-11-28

    申请号:US10915872

    申请日:2004-08-10

    CPC classification number: H01L43/12 H01L43/08

    Abstract: There are provided a magnetic tunnel junction structure and a method of fabricating the same. The magnetic tunnel junction structure includes a lower electrode, a lower magnetic layer pattern and a tunnel layer pattern, which are sequentially formed on the lower electrode. The magnetic tunnel junction structure further includes an upper magnetic layer pattern, a buffer layer pattern, and an upper electrode, which are sequentially formed on a portion of the tunnel layer pattern. The sidewall of the upper magnetic layer pattern is surrounded by an oxidized upper magnetic layer, and the sidewall of the buffer layer pattern is surrounded by an oxidized buffer layer. The depletion of the upper magnetic layer pattern and the lower magnetic layer pattern in the magnetic tunnel junction region can be prevented by the oxidized buffer layer.

    Abstract translation: 提供了一种磁性隧道结结构及其制造方法。 磁性隧道结结构包括依次形成在下电极上的下电极,下磁层图案和隧道层图案。 磁隧道结结构还包括依次形成在隧道层图案的一部分上的上磁层图案,缓冲层图案和上电极。 上部磁性层图案的侧壁由氧化的上部磁性层包围,缓冲层图案的侧壁由氧化的缓冲层包围。 可以通过氧化缓冲层来防止磁性隧道结区域中上部磁性层图案和下部磁性层图案的消耗。

    Cross-point nonvolatile memory devices using binary metal oxide layer as data storage material layer and methods of fabricating the same
    34.
    发明申请
    Cross-point nonvolatile memory devices using binary metal oxide layer as data storage material layer and methods of fabricating the same 有权
    使用二元金属氧化物层作为数据存储材料层的交叉点非易失性存储器件及其制造方法

    公开(公告)号:US20060097288A1

    公开(公告)日:2006-05-11

    申请号:US11241604

    申请日:2005-09-30

    Abstract: A cross-point nonvolatile memory device using a binary metal oxide layer as a data storage material layer includes spaced apart doped lines disposed in a substrate. Spaced apart upper electrodes cross over the doped lines such that cross points are formed where the upper electrodes overlap the doped lines. Lower electrodes are disposed at the cross points between the doped lines and the upper electrodes. A binary metal oxide layer is provided between the upper electrodes and the lower electrodes and provided as a data storage material layer. Doped regions are provided between the lower electrodes and the doped lines and form diodes together with the doped lines. The doped regions have an opposite polarity to the doped lines

    Abstract translation: 使用二元金属氧化物层作为数据存储材料层的交叉点非易失性存储器件包括设置在衬底中的间隔开的掺杂线。 间隔开的上电极在掺杂线上交叉,使得形成交叉点,其中上电极与掺杂线重叠。 下电极设置在掺杂线和上电极之间的交叉点处。 在上部电极和下部电极之间设置二元金属氧化物层,作为数据存储材料层。 掺杂区域设置在下电极和掺杂线之间,并与掺杂线一起形成二极管。 掺杂区域具有与掺杂线相反的极性

    Nonvolatile memory cells having oxygen diffusion barrier layers therein
    40.
    发明授权
    Nonvolatile memory cells having oxygen diffusion barrier layers therein 有权
    其中具有氧扩散阻挡层的非易失性存储单元

    公开(公告)号:US08456891B2

    公开(公告)日:2013-06-04

    申请号:US13150596

    申请日:2011-06-01

    Abstract: A nonvolatile memory cell includes first and second electrodes and a data storage layer extending between the first and second electrodes. An oxygen diffusion barrier layer is provided, which extends between the data storage layer and the first electrode. An oxygen gettering layer is also provided, which extends between the oxygen diffusion barrier layer and the data storage layer. The oxygen diffusion barrier layer includes aluminum oxide, the oxygen gettering layer includes titanium, the data storage layer includes a metal oxide, such as magnesium oxide, and at least one of the first and second electrodes includes a material selected from a group consisting of tungsten, polysilicon, aluminum, titanium nitride silicide and conductive nitrides.

    Abstract translation: 非易失性存储单元包括第一和第二电极以及在第一和第二电极之间延伸的数据存储层。 提供氧扩散阻挡层,其在数据存储层和第一电极之间延伸。 还提供了氧吸气层,其在氧扩散阻挡层和数据存储层之间延伸。 氧扩散阻挡层包括氧化铝,氧吸气层包括钛,数据存储层包括诸如氧化镁的金属氧化物,并且第一和第二电极中的至少一个包括选自钨 ,多晶硅,铝,氮化钛硅化物和导电氮化物。

Patent Agency Ranking