公开(公告)号：US6093972A

公开(公告)日：2000-07-25

申请号：US304152

申请日：1999-05-03

Applicant: Francis J. Carney ,  George Amos Carson ,  Phillip C. Celaya ,  Harry Fuerhaupter ,  Frank Tim Jones ,  Donald H. Klosterman ,  Cynthia M. Melton ,  James Howard Knapp ,  Keith E. Nelson

Inventor： Francis J. Carney ,  George Amos Carson ,  Phillip C. Celaya ,  Harry Fuerhaupter ,  Frank Tim Jones ,  Donald H. Klosterman ,  Cynthia M. Melton ,  James Howard Knapp ,  Keith E. Nelson

IPC: H01L21/56 ,  H01L23/31

CPC classification number: H01L21/565 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311

Abstract: A microelectronic package (10) is formed and includes an integrated circuit die (12) attached to a substrate (14) by a plurality of solder bump interconnections (16) to form a preassembly (18). The integrated circuit die (12) has an active face (20) that faces the substrate (14) and is spaced apart therefrom by a gap (22). The integrated circuit die (12) also includes a back face (24) opposite the active face (20). The substrate (14) includes a die attach region (26) and a surrounding region (28) about the integrated circuit die (12). The solder bump interconnections (16) extend across the gap (22) and connect the integrated circuit die (12) and the substrate (14). A mold (30) is disposed about the preassembly (18) such that the mold (30) cooperates with the substrate (14) to define a mold cavity (32) that encloses the integrated circuit die (12). The mold (30) has a molding surface (34) that includes the surrounding region (28) and a mold surface (34) that faces the back face (24) and is spaced apart therefrom. A polymeric precursor (36) is dispensed into the mold cavity (32) and is formed against the molding surface (34) and the back face (24). The polymeric precursor (36) is then cured to form a polymeric encapsulant (38) that encapsulates the integrated circuit die (12).

Abstract translation: 形成微电子封装（10）并且包括通过多个焊料凸块互连（16）附接到衬底（14）以形成预组件（18）的集成电路管芯（12）。 集成电路管芯（12）具有面向衬底（14）并与间隔开的间隙（22）的有效面（20）。 集成电路管芯（12）还包括与有源面（20）相对的背面（24）。 衬底（14）包括管芯附接区域（26）和围绕集成电路管芯（12）的周围区域（28）。 焊料凸点互连（16）跨越间隙（22）延伸并连接集成电路管芯（12）和衬底（14）。 模具（30）围绕预组件（18）设置，使得模具（30）与衬底（14）配合以限定围绕集成电路管芯（12）的模腔（32）。 模具（30）具有包括周围区域（28）的模制表面（34）和面向背面（24）并与其间隔开的模具表面（34）。 聚合物前体（36）被分配到模腔（32）中并且抵靠模制表面（34）和背面（24）形成。 聚合物前体（36）然后被固化以形成封装集成电路管芯（12）的聚合密封剂（38）。

公开(公告)号：US5966510A

公开(公告)日：1999-10-12

申请号：US998585

申请日：1997-12-29

Applicant: Guy A. Carbonneau ,  Bernie Wu ,  Tim Jones

Inventor： Guy A. Carbonneau ,  Bernie Wu ,  Tim Jones

IPC: G06F1/26 ,  G06F3/06 ,  G06F11/267 ,  G06F11/30 ,  G06F11/34 ,  G06F13/00 ,  G06F21/00 ,  G06F11/00

CPC classification number: G06F3/0614 ,  G06F11/3034 ,  G06F11/3048 ,  G06F11/3058 ,  G06F21/86 ,  G06F3/0607 ,  G06F3/0653 ,  G06F3/0689 ,  G06F11/221 ,  G06F11/3485 ,  G06F11/349

Abstract: An intelligent status monitoring, reporting and control module is coupled to a SCSI bus that interconnects a cluster of SCSI-compatible data storage modules (e.g., magnetic disk drives). The status monitoring, reporting and control module is otherwise coupled to the cluster of SCSI-compatible data storage modules and to power maintenance and/or other maintenance subsystems of the cluster for monitoring and controlling states of the data storage modules and power maintenance and/or other maintenance subsystems that are not readily monitored or controlled directly by way of the SCSI bus. The status monitoring, reporting and control module sends status reports to a local or remote system supervisor and executes control commands supplied by the local or remote system supervisor. The status reports include reports about system temperature and power conditions. The executable commands include commands for regulating system temperature and power conditions.

Abstract translation: 智能状态监视，报告和控制模块耦合到SCSI总线，其将SCSI兼容的数据存储模块（例如，磁盘驱动器）集群连接起来。 状态监视，报告和控制模块另外耦合到SCSI兼容数据存储模块集群，并为集群的维护和/或其他维护子系统供电，用于监视和控制数据存储模块的状态以及电源维护和/或 不能通过SCSI总线直接监视或控制的其他维护子系统。 状态监控，报告和控制模块向本地或远程系统主管发送状态报告，并执行由本地或远程系统主管提供的控制命令。 状态报告包括有关系统温度和功率状况的报告。 可执行命令包括用于调节系统温度和功率条件的命令。

公开(公告)号：US5639695A

公开(公告)日：1997-06-17

申请号：US552710

申请日：1995-11-03

Applicant: Tim Jones ,  Denise Ommen ,  John Baird

Inventor： Tim Jones ,  Denise Ommen ,  John Baird

IPC: H01L23/12 ,  H01L23/31 ,  H01L23/498 ,  H05K1/02 ,  H05K3/30 ,  H01L21/60

CPC classification number: H01L23/3128 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/49 ,  H05K3/303 ,  H01L2224/16225 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/18161 ,  H05K1/0203 ,  H05K2201/10568 ,  H05K2201/10734 ,  Y02P70/613

Abstract: A ball-grid array (BGA) semiconductor package (10,60,90) includes a substrate (31,61,91) attached to a support substrate (32,62,92). The substrate (31,61,91) has an opening (33) extending from an upper surface to a lower surface. An integrated circuit chip (18) is attached to the support substrate (32,62,92) within the opening (33). Bond pads (22) on the integrated circuit chip (18) are electrically connected to ball pads (42,73,106,108) on the lower surface of the substrate (31,61,91). Conductive solder balls (26) are attached to the ball pads (42,73,106,108). The support substrate (32,62,92) provides a low profile and functions as a standoff that limits the collapse of the conductive solder balls (26) when the BGA semiconductor package (10,60,90) is attached to an application board (46).

Abstract translation: 球栅阵列（BGA）半导体封装（10,60,90）包括附接到支撑衬底（32,62,92）的衬底（31,61,91）。 基板（31,61,91）具有从上表面延伸到下表面的开口（33）。 集成电路芯片（18）附接到开口（33）内的支撑基板（32,62,92）。 集成电路芯片（18）上的接合焊盘（22）电连接到衬底（31,61,91）的下表面上的球垫（42,43,106,108）。 导电焊球（26）附接到球垫（42,73,106,108）。 当BGA半导体封装（10,60,90）附接到应用板（10,60,90）时，支撑衬底（32,62,92）提供低轮廓并用作限制导电焊球（26）的塌缩的间隙， 46）。

公开(公告)号：US08614298B2

公开(公告)日：2013-12-24

申请号：US13052597

申请日：2011-03-21

Applicant: Lisa Lynn Shafer ,  Francis Joseph Carr ,  James Peter Gregson ,  Dawn Ann Bembridge ,  Tim Jones

Inventor： Lisa Lynn Shafer ,  Francis Joseph Carr ,  James Peter Gregson ,  Dawn Ann Bembridge ,  Tim Jones

IPC: C07K16/46 ,  C07K16/18 ,  A61K39/395 ,  A61M5/14 ,  A61K9/08

CPC classification number: C07K16/18 ,  A61K2039/505 ,  A61K2039/54 ,  A61K2039/545 ,  C07K2317/24 ,  C07K2317/56

Abstract: Humanized anti-Aβ antibodies derived from a murine antibody directed to a N-terminal epitope of Aβ are described. The humanized antibodies have reduced or no human T cell epitopes and bind Aβ with an affinity similar to that of the murine antibody.

Abstract translation: 描述了源自针对Abeta的N末端表位的鼠抗体的人源化抗Aβ抗体。 人源化抗体具有减少或没有人T细胞表位并以与鼠抗体相似的亲和性结合Aβ。

公开(公告)号：US08555969B2

公开(公告)日：2013-10-15

申请号：US12682289

申请日：2008-09-22

Applicant: Anthony Robert Holmes Goodwin ,  Tim Jones ,  Keith James Massie ,  John Nighswander ,  Gary Tustin

Inventor： Anthony Robert Holmes Goodwin ,  Tim Jones ,  Keith James Massie ,  John Nighswander ,  Gary Tustin

IPC: E21B47/00 ,  E21B49/08 ,  E21B36/00

CPC classification number: E21B43/255 ,  E21B43/24

Abstract: Methods and apparatus that change the mobility of formation fluids using thermal and non-thermal stimulation including, an example apparatus to simultaneously provide thermal and non-thermal stimulation to change a mobility of a fluid in a subsurface formation includes one or more containers to hold one or more reactants. Additionally, the example apparatus includes a reactor to initiate a chemical reaction with at least one of the reactants. Further, the example apparatus includes an injector to inject a product of the chemical reaction into a formation. The product of the chemical reaction includes heat and a gaseous diluent to change a mobility of a fluid in a subsurface formation.

Abstract translation: 使用热和非热刺激改变地层流体的流动性的方法和装置包括同时提供热和非热刺激以改变地下地层中的流体的流动性的示例性装置包括一个或多个容器以容纳一个 或更多的反应物。 另外，该示例性装置包括用于启动与至少一种反应物的化学反应的反应器。 此外，示例性装置包括将化学反应的产物注入地层的注射器。 化学反应的产物包括热和气态稀释剂以改变地下地层中的流体的迁移率。

公开(公告)号：US07935575B2

公开(公告)日：2011-05-03

申请号：US12098813

申请日：2008-04-07

Applicant: Stephen St. Germain ,  Roger M. Arbuthnot ,  Frank Tim Jones

Inventor： Stephen St. Germain ,  Roger M. Arbuthnot ,  Frank Tim Jones

IPC: H01L21/00 ,  H01L21/58

CPC classification number: H01L23/49562 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/34 ,  H01L2224/26175 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/37099

Abstract: In one embodiment, a semiconductor package is formed to include a leadframe that includes a plurality of die attach areas for attaching a semiconductor die to the leadframe. The leadframe is positioned to overlie another leadframe that forms some of the external terminals or leads of the package.

Abstract translation: 在一个实施例中，半导体封装被形成为包括引线框架，该引线框架包括用于将半导体管芯附接到引线框架的多个管芯附着区域。 引线框定位成覆盖形成封装的一些外部端子或引线的另一引线框架。

公开(公告)号：US20110094734A1

公开(公告)日：2011-04-28

申请号：US12990356

申请日：2009-05-01

Applicant: Eric Atherton ,  Tim Jones

Inventor： Eric Atherton ,  Tim Jones

IPC: E21B47/09 ,  E21B43/00

CPC classification number: E21B43/11 ,  E21B43/119 ,  E21B47/08 ,  E21B47/09 ,  E21B49/00 ,  G01B5/18

Abstract: A means of investigating the quality and/or nature of perforations in a downhole environment is disclosed. A ‘pecking’ finger and depth measuring probe that can be axially and radially displaced enables the perforation to be located and its depth determined, through sequentially pecking around the wall lining in patterns such as radial, axial, and spiral sequences. By swinging a pecking finger that supports a depth measuring probe or cable with a bullet or conically shaped tip and measuring the displacement of the finger, the edge and centre of the hole can be determined with the largest displacement being when the tip is fully in the hole. When this position has been determined, the depth measuring cable is deployed and the depth of the perforation can be established by both an increase in the force required to push the cable and by the displacement of the pecking finger as it is pushed back by the reaction forces on the cable. Thus, a downhole tool comprises a elongate housing for insertion into a downhole environment, from which a probe extends radially by a variable amount, means for driving the probe in a radial direction, and means for sensing resistance to outward radial movement of the probe. One or more radially extendable clamps can be provided for fixing the tool within a surrounding bore. These can be at the upper and/or lower ends of the tool. Ideally, they are moveable between an extended and a retracted position by interengagement with a member moveable relative to a remainder of the tool in a direction that is longitudinal relative to the tool. The member can be, for example, a sleeve extending longitudinally around the tool, the sleeve being moveable longitudinally along the tool. These clamps could be used to fix other types of tool in place in a downhole environment, or one similar to a downhole environment.

Abstract translation: 公开了一种调查井下环境中穿孔质量和/或性质的方法。 可以轴向和径向移位的“啄食”手指和深度测量探头能够穿孔，并通过依次以径向，轴向和螺旋序列的图案啄围墙壁衬垫来确定其深度。 通过摆动支撑深度测量探头或电缆的啄食手指，其具有子弹或锥形尖端并测量手指的位移，可以确定孔的边缘和中心，其中最大的位移是当尖端完全在 孔。 当确定了该位置时，部署深度测量电缆，并且可以通过增加推动电缆所需的力和通过反作用力推动啄食指的位移来建立穿孔的深度 力量在电缆上。 因此，井下工具包括用于插入到井下环境中的细长壳体，探针从其径向径向延伸可变量，用于沿径向驱动探针的装置，以及用于感测抵抗探针向外径向运动的阻力的装置。 可以提供一个或多个可径向延伸的夹具用于将工具固定在周围的孔内。 这些可以在工具的上端和/或下端。 理想地，它们可以通过与相对于工具的纵向方向相对于工具的其余部分可移动的构件相互接合而在伸展和缩回位置之间移动。 构件可以是例如围绕工具纵向延伸的套筒，套筒可以沿着工具纵向移动。 这些夹具可用于将其他类型的工具固定在井下环境中，或者类似于井下环境中。

公开(公告)号：US20090250794A1

公开(公告)日：2009-10-08

申请号：US12098813

申请日：2008-04-07

Applicant: STEPHEN ST. GERMAIN ,  Roger M. Arbuthnot ,  Frank Tim Jones

Inventor： STEPHEN ST. GERMAIN ,  Roger M. Arbuthnot ,  Frank Tim Jones

IPC: H01L23/495 ,  H01L21/56

CPC classification number: H01L23/49562 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/34 ,  H01L2224/26175 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/37099

Abstract: In one embodiment, a semiconductor package is formed to include a leadframe that includes a plurality of die attach areas for attaching a semiconductor die to the leadframe. The leadframe is positioned to overlie another leadframe that forms some of the external terminals or leads of the package.

Abstract translation: 在一个实施例中，半导体封装被形成为包括引线框架，该引线框架包括用于将半导体管芯附接到引线框架的多个管芯附着区域。 引线框定位成覆盖形成封装的一些外部端子或引线的另一引线框架。

公开(公告)号：US20090175923A1

公开(公告)日：2009-07-09

申请号：US12323682

申请日：2008-11-26

Applicant: Lisa Lynn Shafer ,  Francis Joseph Carr ,  James Peter Gregson ,  Dawn Ann Bembridge ,  Tim Jones

Inventor： Lisa Lynn Shafer ,  Francis Joseph Carr ,  James Peter Gregson ,  Dawn Ann Bembridge ,  Tim Jones

IPC: A61F2/00 ,  C07K16/00 ,  A61K39/395 ,  C07H21/04 ,  C12N15/63 ,  C12N5/10

CPC classification number: C07K16/18 ,  A61K2039/505 ,  A61K2039/54 ,  A61K2039/545 ,  C07K2317/24 ,  C07K2317/56

Abstract: Humanized anti-Aβ antibodies derived from a murine antibody directed to a N-terminal epitope of Aβ are described. The humanized antibodies have reduced or no human T cell epitopes and bind Aβ with an affinity similar to that of the murine antibody.

Abstract translation: 描述了源自针对Abeta的N末端表位的鼠抗体的人源化抗Aβ抗体。 人源化抗体具有减少或没有人T细胞表位并以与鼠抗体相似的亲和性结合Aβ。

公开(公告)号：US07430476B2

公开(公告)日：2008-09-30

申请号：US10468496

申请日：2002-02-18

Applicant: Francis J. Carr ,  Graham Carter ,  Tim Jones ,  Stephen Williams ,  Anita Hamilton

Inventor： Francis J. Carr ,  Graham Carter ,  Tim Jones ,  Stephen Williams ,  Anita Hamilton

IPC: G01N33/48 ,  G01N33/50 ,  G06F19/00 ,  A61K31/385

CPC classification number: G06F19/16 ,  A61K9/7015 ,  A61K38/00 ,  A61K47/02 ,  A61K47/12 ,  C07K14/54 ,  C07K16/18 ,  C07K16/2866 ,  C07K16/2896 ,  C07K16/30 ,  C07K16/3046 ,  C07K16/464 ,  C07K16/465 ,  C07K2319/00 ,  G06F19/18

Abstract: This invention relates to a novel approach for identification of T-cell epitopes, that give rise to an immune reaction in a living host. By means of this novel method biological compounds can be generated which have a no or at least a reduced immunogenicity when exposed to the immune system of a given species and compared with the relevant non-modified entity. Thus the invention relates also to novel biological molecules, especially proteins and antibodies, obtained by the method according to the invention.

Abstract translation: 本发明涉及用于鉴定在宿主中产生免疫反应的T细胞表位的新方法。 通过这种新方法，可以产生当暴露于给定物种的免疫系统且与相关未修饰实体相比较时具有或至少具有降低的免疫原性的生物化合物。 因此，本发明还涉及通过根据本发明的方法获得的新型生物分子，特别是蛋白质和抗体。