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    DEVICES AND METHODS FOR PATTERN GENERATION BY INK LITHOGRAPHY
    35.
    发明申请
    DEVICES AND METHODS FOR PATTERN GENERATION BY INK LITHOGRAPHY 审中-公开
    用于图形生成的设备和方法

    公开(公告)号：US20080055581A1

    公开(公告)日：2008-03-06

    申请号：US11675659

    申请日：2007-02-16

    申请人： John Rogers ,  Etienne Menard

    发明人： John Rogers ,  Etienne Menard

    IPC分类号： G03B27/04 ,  G03C5/00

    CPC分类号： G03F7/0002 ,  B82Y10/00 ,  B82Y40/00 ,  G03F1/50 ,  H01L51/0017

    摘要： The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions and including relief and recess features with variable height, depth or height and depth. Composite patterning devices comprising a plurality of polymer layers each having selected mechanical and thermal properties and physical dimensions provide high resolution patterning on a variety of substrate surfaces and surface morphologies. Gray-scale ink lithography photomasks for gray-scale pattern generation or molds for generating embossed relief features on a substrate surface are provided. The particular shape of the fabricated patterned can be manipulated by varying the three-dimensional recess pattern on an elastomeric patterning device which is brought into conformal contact with a substrate to localize patterning agent to the recess portion of the pattern.

    摘要翻译： 本发明提供了用于在衬底表面上制造图案的方法，装置和器件部件，特别是包括具有一维，两维或三维中选定长度的微尺寸和/或纳米尺寸特征的结构的图案，并且包括具有可变高度，深度的浮雕和凹陷特征 高度和深度。 包括多个具有选择的机械和热性质和物理尺寸的聚合物层的复合图案形成装置在各种基底表面和表面形态上提供高分辨率图案。 提供用于灰度图案生成的灰度级油墨光刻光掩模或用于在基板表面上产生浮雕浮雕特征的模具。 所制造的图案的特定形状可以通过改变弹性体图案形成装置上的三维凹陷图案来进行操作，所述弹性图案形成装置与衬底形成保形接触以将图案化剂定位到图案的凹部。

    Composite patterning devices for soft lithography
    36.
    发明申请
    Composite patterning devices for soft lithography 有权
    用于软光刻的复合图案形成装置

    公开(公告)号：US20050238967A1

    公开(公告)日：2005-10-27

    申请号：US11115954

    申请日：2005-04-27

    申请人： John Rogers ,  Etienne Menard

    发明人： John Rogers ,  Etienne Menard

    IPC分类号： C04B24/38 ,  C04B28/14 ,  G03F7/00 ,  G03F9/00

    CPC分类号： B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  C04B24/383 ,  C04B28/14 ,  C04B2111/00181 ,  G03F7/0002

    摘要： The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions. The present invention provides composite patterning devices comprising a plurality of polymer layers each having selected mechanical properties, such as Young's Modulus and flexural rigidity, selected physical dimensions, such as thickness, surface area and relief pattern dimensions, and selected thermal properties, such as coefficients of thermal expansion, to provide high resolution patterning on a variety of substrate surfaces and surface morphologies.

    摘要翻译： 本发明提供用于在衬底表面上制造图案的方法，装置和器件部件，特别是包括具有一维，二维或三维尺寸选定长度的微小尺寸和/或纳米尺寸特征的结构的图案。 本发明提供了复合图案形成装置，其包括多个聚合物层，每个聚合物层各自具有选择的机械性质，例如杨氏模量和弯曲刚度，所选择的物理尺寸，例如厚度，表面积和浮雕图案尺寸，以及选定的热性能，例如系数 的热膨胀，以在各种基底表面和表面形态上提供高分辨率图案。

    Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion
    37.
    发明授权
    Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion 有权
    使用具有压力调节的可逆粘合的微结构弹性体表面印刷可转印部件

    公开(公告)号：US09412727B2

    公开(公告)日：2016-08-09

    申请号：US13237375

    申请日：2011-09-20

    申请人： Etienne Menard ,  John A. Rogers ,  Seok Kim ,  Andrew Carlson

    发明人： Etienne Menard ,  John A. Rogers ,  Seok Kim ,  Andrew Carlson

    IPC分类号： B29C59/02 ,  H01L21/683 ,  H01L25/00 ,  H01L23/482

    CPC分类号： H01L21/67132 ,  B32B9/005 ,  B32B37/025 ,  B32B37/16 ,  B32B41/00 ,  B32B2313/00 ,  B32B2457/14 ,  B41F16/00 ,  H01L21/67144 ,  H01L21/6835 ,  H01L23/4821 ,  H01L25/50 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/32145 ,  H01L2224/83192

    摘要： In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.

    摘要翻译： 在印刷可转印部件的方法中，包括具有从其表面突出的三维浮雕特征的弹性体柱的印模被压制在供体基板上的部件上，该第一压力足以使浮雕特征机械地变形，并且 位于浮雕特征之间的柱的区域，以在第一接触区域上接触部件。 印模从供体基板缩回，使得该部件粘附到印模上。 包括附着在其上的部件的印模被压在接受基板上，第二压力小于在小于第一接触面积的第二接触面积上接触部件的第一压力。 然后将印模从接收基板缩回以从印模分离该部件并将该部件打印到接收基板上。 还讨论了相关装置和邮票。

    High-yield fabrication of large-format substrates with distributed, independent control elements
    38.
    发明授权
    High-yield fabrication of large-format substrates with distributed, independent control elements 有权
    具有分布式，独立控制元件的大幅面基板的高产量制造

    公开(公告)号：US09165989B2

    公开(公告)日：2015-10-20

    申请号：US13395813

    申请日：2010-09-16

    申请人： Christopher Bower ,  Etienne Menard ,  John Hamer ,  Ronald S. Cok

    发明人： Christopher Bower ,  Etienne Menard ,  John Hamer ,  Ronald S. Cok

    IPC分类号： H01L27/32

    CPC分类号： H01L27/3255 ,  G01R31/28 ,  H01L27/3225 ,  H01L27/3248 ,  H01L27/3276 ,  H01L2227/323

    摘要： A large-format substrate with distributed control elements is formed by providing a substrate and a wafer, the wafer having a plurality of separate, independent chiplets formed thereon; imaging the wafer and analyzing the wafer image to determine which of the chiplets are defective; removing the defective chiplet(s) from the wafer leaving remaining chiplets in place on the wafer; printing the remaining chiplet(s) onto the substrate forming empty chiplet location(s); and printing additional chiplet(s) from the same or a different wafer into the empty chiplet location(s).

    摘要翻译： 具有分布式控制元件的大格式基板通过提供基板和晶片形成，晶片具有形成在其上的多个独立的独立小芯片; 对晶片成像并分析晶片图像以确定哪些小芯片是有缺陷的; 从晶片上除去有缺陷的小芯片，剩下的小芯片就位于晶片上; 将剩余的小瓶印刷到形成空的小瓶位置的基底上; 以及从相同或不同的晶片将另外的一个或多个微芯片打印到空的小瓶位置。

    HIGH-YIELD FABRICATION OF LARGE-FORMAT SUBSTRATES WITH DISTRIBUTED, INDEPENDENT CONTROL ELEMENTS
    39.
    发明申请
    HIGH-YIELD FABRICATION OF LARGE-FORMAT SUBSTRATES WITH DISTRIBUTED, INDEPENDENT CONTROL ELEMENTS 有权
    具有分布式独立控制元件的大型基板的高效制造

    公开(公告)号：US20120228669A1

    公开(公告)日：2012-09-13

    申请号：US13395813

    申请日：2010-09-16

    申请人： Christopher Bower ,  Etienne Menard ,  John Hamer ,  Ronald S. Cok

    发明人： Christopher Bower ,  Etienne Menard ,  John Hamer ,  Ronald S. Cok

    IPC分类号： H01L33/00 ,  H01L21/66

    CPC分类号： H01L27/3255 ,  G01R31/28 ,  H01L27/3225 ,  H01L27/3248 ,  H01L27/3276 ,  H01L2227/323

    摘要： A large-format substrate with distributed control elements is formed by providing a substrate and a wafer, the wafer having a plurality of separate, independent chiplets formed thereon; imaging the wafer and analyzing the wafer image to determine which of the chiplets are defective; removing the defective chiplet(s) from the wafer leaving remaining chiplets in place on the wafer; printing the remaining chiplet(s) onto the substrate forming empty chiplet location(s); and printing additional chiplet(s) from the same or a different wafer into the empty chiplet location(s).

    摘要翻译： 具有分布式控制元件的大格式基板通过提供基板和晶片形成，晶片具有形成在其上的多个独立的独立小芯片; 对晶片成像并分析晶片图像以确定哪些小芯片是有缺陷的; 从晶片上除去有缺陷的小芯片，剩下的小芯片就位于晶片上; 将剩余的小瓶印刷到形成空的小瓶位置的基底上; 以及从相同或不同的晶片将另外的一个或多个微芯片打印到空的小瓶位置。

    Reinforced composite stamp for dry transfer printing of semiconductor elements
    40.
    发明授权
    Reinforced composite stamp for dry transfer printing of semiconductor elements 有权
    用于半导体元件的干式转印印刷的强化复合印模

    公开(公告)号：US07927976B2

    公开(公告)日：2011-04-19

    申请号：US12177963

    申请日：2008-07-23

    申请人： Etienne Menard

    发明人： Etienne Menard

    IPC分类号： H01L21/00 ,  B41L47/04 ,  B29C33/40 ,  B29C39/22 ,  B29C65/70

    CPC分类号： G03F7/0002 ,  B82Y10/00 ,  B82Y40/00

    摘要： Provided are reinforced composite stamps, devices and methods of making the reinforced composite stamps disclosed herein. Reinforced composite stamps of certain aspects of the present invention have a composition and architecture optimized for use in printing systems for dry transfer printing of semiconductor structures, and impart excellent control over relative spatial placement accuracy of the semiconductor structures being transferred. In some embodiments, for example, reinforced composite stamps of the present invention allow for precise and repeatable vertical motion of the patterned surface of the printing apparatus with self-leveling of the stamp to the surface of a contacted substrate. Reinforced composite stamps of certain aspect of the present invention achieve a uniform distribution of contact forces between the printing apparatus patterned surface and the top surface of a substrate being contacted by the reinforced composite stamp of the printing apparatus.

    摘要翻译： 提供了制造本文公开的增强复合印模的增强复合印模，装置和方法。 本发明的某些方面的加强复合印模具有优化用于半导体结构的干转移印刷的印刷系统中的组成和结构，并且对被转印的半导体结构的相对空间放置精度赋予优异的控制。 在一些实施例中，例如，本发明的增强复合印模允许印刷设备的图案化表面的精确和可重复的垂直运动，其中印模自动调平到接触的基底的表面。 本发明某一方面的加强复合印模实现了打印设备图案化表面与基片顶表面之间的接触力的均匀分布，该印刷设备的表面与印刷设备的增强复合印模接触。