摘要:
A multiple parallel digital signal processor having a large number of bit processing processor elements arranged in one-dimensional array is treated as a processor block, and a plurality of the processor blocks are connected in sequence, while removing redundancy, to form a processor block column. A plurality of processor blocks are connected in sequence such that a processor block at a subsequent stage is supplied either with output of a processor block at a previous stage or with input data, and an output of any of the processor blocks is delivered as a final output, thereby making it possible to realize a signal processing apparatus which has high performance, versatility, and simple configuration.
摘要:
A parallel processor for processing a plurality of pieces of data includes a number of unitary processing units provided in parallel equal to the number of pieces of data. Each of the unitary processing units includes a memory circuit connected to a processing element which exchanges data with two adjoining unitary processing units. Each of the processing elements includes a full adder, a logical operation circuit for performing a logical operation on two inputs connected to a first input of the full adder and a plurality of selector circuits. A first selector circuit selects first data from memory circuits of the unitary processing unit and an adjoining unitary processing unit. A second selector circuit selects second data from memory circuits of the unitary processing unit and an adjoining unitary processing unit. A third selector circuit selects the second data selected by the second selector circuit as a first input to the logical operation circuit. A fourth selector circuit selects the first data selected by the first selector circuit as a second input to the logical operation circuit. A fifth selector circuit selects the second data selected by the second selector circuit as a second input to the full adder. A sixth selector circuit selects the carrier output of the full adder as a third input to the full adder.
摘要:
To provide a parallel processor apparatus which can perform processing with a good efficiency on signals comprised of data of different lengths. A parallel processor configured by a serial connection of a first parallel processor and a second parallel processor having n number of individual processors and (m-n) number of individual processors. For signals comprised of data of a length, serving as the unit of processing, of m or less and n or more, these parallel processors are connected and used as a single parallel processor apparatus which performs processing equivalent to that by a conventional parallel processor apparatus. For signals comprised of data of a length of n or less, these parallel processors are independently used to perform pipeline processing and thereby perform two times the amount of processing of that performed by a conventional parallel processor apparatus.
摘要:
A digital multiplying circuit in a parallel multiplying circuit which can multiply an input which changes at a high data rate by the pipeline processing. A multiplicand is inputted to this circuit. Partial product signal generating circuits of the number corresponding to only the number of partial product signals which are needed are provided. The partial product signal generating circuits produce the partial product signals in accordance with the state of predetermined bits of a multiplier. Each partial product signal is added, thereby obtaining a multiplication output of the multiplicand. The pipeline processing is performed in the adding operation of each partial product signal. The multiplier and multiplicand are delayed. The predetermined partial product signal generating circuits are arranged immediately before the adders which need the partial product signals, thereby obtaining the partial product. With this digital multiplying circuit, the total number of bits of registers is reduced and the circuit scale is made small.
摘要:
There is provided a digital time base corrector in which a digital input signal of one block consisting of a continuous data time sequence is converted to a digital signal including data lack intervals or vice versa by a variable delay circuit. A signal selecting circuit is divided into N first unit selecting circuits and a second unit selecting circuit. M of the output signals of a shift register are inputted to the first unit selecting circuits, by which one of them is selected. The outputs of the N first unit selecting circuits are supplied to the second unit selecting circuit, by which one of them is selected. A pipeline process is performed by inserting a delay circuit to delay the signal for the time of one clock period into the input/output line of the second unit selecting circuit. Further, the selecting signal can be made variable for every one clock and a delay circuit is inserted on the output side of a selecting signal forming circuit. With this corrector, the influence of the gate delay of the selectors can be reduced and the high speed data process can be performed.
摘要:
A mounting structure comprises at least one semiconductor device having solder bumps on a lower surface thereof as outer terminals and a flexible wiring board with wiring formed thereon. The semiconductor device is wrapped in a flexible wiring board; the mounting structure is provided with outer electrodes on both of a side on which the outer terminals of the semiconductor device are formed and an opposite side thereto; at least one wiring layer is formed on the flexible wiring board; and a supporting member is affixed between a lower surface of the semiconductor device on which the outer terminals are formed and the flexible wiring board.
摘要:
A device having electronic components mounted therein has a first electronic component having an external terminal on a first surface and a heat spreader on a second surface, at least one second electronic component that is placed in the direction of a second surface of the first electronic component, a flexible circuit board that is electrically connected to the first electronic component and at least one second electronic component, and at least the part to which at least one second electronic component is connected is located on the second surface side of the first electronic component, and a spacer that is located between at least part of the flexible circuit board and the second surface of the first electronic component. The spacer can prevent heat from the first electronic component from being directly transferred to the second electronic component.
摘要:
There is provided a low-cost semiconductor device that commercial and quality-assured (inspected) chip size packages can be stacked and has a small co-planarity value and a high mounting reliability. A semiconductor device in which a flexible circuit substrate is adhered to at least a part of a lateral side of a semiconductor package, and the flexible circuit substrate, which is on a side facing solder balls of the semiconductor package, is folded at a region inside of an edge of the semiconductor package (FIG. 1).
摘要:
Provided is a semiconductor device including a flexible circuit board which includes a first external electrode provided on a first face and second and third external electrodes provided on a second face; a plurality of memory devices and passive components; a supporter which is provided with a groove on one face; and a computing processor device. The memory devices and the passive components are connected to the first external electrode, the one face of the supporter is bonded on the first face of the flexible circuit board so that the groove houses the memory devices and the passive components. The flexible circuit board is bent along a perimeter of the supporter to be wrapped around a side face and another face of the supporter. On the flexible circuit board, the second external electrode is provided on the second face which is opposite to the first external electrode, and the third external electrode is provided on the second face which is bent to the another face of the supporter. The computing processor device is connected to the second external electrode, and a bump is formed on the third external electrode.
摘要:
A mounting structure comprises at least one semiconductor device having solder bumps on a lower surface thereof as outer terminals and a flexible wiring board with wiring formed thereon. The semiconductor device is wrapped in a flexible wiring board; the mounting structure is provided with outer electrodes on both of a side on which the outer terminals of the semiconductor device are formed and an opposite side thereto; at least one wiring layer is formed on the flexible wiring board; and a supporting member is affixed between a lower surface of the semiconductor device on which the outer terminals are formed and the flexible wiring board.