Method for producing a group III nitride compound semiconductor laser
    32.
    发明授权
    Method for producing a group III nitride compound semiconductor laser 有权
    III族氮化物半导体激光器的制造方法

    公开(公告)号:US07186579B2

    公开(公告)日:2007-03-06

    申请号:US10924999

    申请日:2004-08-25

    IPC分类号: H01L21/00

    摘要: A semiconductor laser comprises a sapphire substrate, an AlN buffer layer, Si-doped GaN n-layer, Si-doped Al0.1Ga0.9N n-cladding layer, Si-doped GaN n-guide layer, an active layer having multiple quantum well (MQW) structure in which about 35 Å in thickness of GaN barrier layer 62 and about 35 Å in thickness of Ga0.95In0.05N well layer 61 are laminated alternately, Mg-doped GaN p-guide layer, Mg-doped Al0.25Ga0.75N p-layer, Mg-doped Al0.1Ga0.9N p-cladding layer, and Mg-doped GaN p-contact layer are formed successively thereon. A ridged hole injection part B which contacts to a ridged laser cavity part A is formed to have the same width as the width w of an Ni electrode. Because the p-layer has a larger aluminum composition, etching rate becomes smaller and that can prevent from damaging the p-guide layer in this etching process.

    摘要翻译: 半导体激光器包括蓝宝石衬底,AlN缓冲层,Si掺杂的GaN n层,Si掺杂的Al 0.1 Ga 0.9 N n包层,Si- 掺杂GaN n引导层,具有多个量子阱(MQW)结构的有源层,其中GaN阻挡层62的厚度约为35,Ga Ga 2 O 3的厚度为约35。 0.05N的N阱层61交替层叠,Mg掺杂的GaN p导向层,掺杂了Mg的Al 0.25 N Ga 0.75 N p层,Mg- 掺杂的Al 0.1 Ga 0.9 N p包覆层和Mg掺杂的GaN p接触层。 与脊状激光腔部A接触的脊状空穴注入部B形成为与Ni电极的宽度w相同的宽度。 因为p层具有较大的铝组成,所以蚀刻速率变小,并且可以防止在该蚀刻工艺中损坏p导向层。

    Nitride semiconductor light-emitting device and process for producing the same
    35.
    发明申请
    Nitride semiconductor light-emitting device and process for producing the same 失效
    氮化物半导体发光器件及其制造方法

    公开(公告)号:US20050218416A1

    公开(公告)日:2005-10-06

    申请号:US10898204

    申请日:2004-07-26

    摘要: Provided are a nitride semiconductor light-emitting device comprising a polycrystalline or amorphous substrate made of AlN; a plurality of dielectric patterns formed on the AlN substrate and having a stripe or lattice structure; a lateral epitaxially overgrown-nitride semiconductor layer formed on the AlN substrate having the dielectric patterns by Lateral Epitaxial Overgrowth; a first conductive nitride semiconductor layer formed on the nitride semiconductor layer; an active layer formed on the first conductive nitride semiconductor layer; and a second conductive nitride semiconductor layer formed on the active layer; and a process for producing the same.

    摘要翻译: 提供一种氮化物半导体发光器件,其包括由AlN制成的多晶或非晶衬底; 形成在所述AlN基板上并具有条纹或格子结构的多个电介质图案; 通过横向外延生长形成在具有电介质图案的AlN衬底上的侧向外延氮化半导体层; 形成在所述氮化物半导体层上的第一导电氮化物半导体层; 形成在所述第一导电氮化物半导体层上的有源层; 以及形成在所述有源层上的第二导电氮化物半导体层; 及其制造方法。

    Method and apparatus for producing group III nitride compound semiconductor
    36.
    发明授权
    Method and apparatus for producing group III nitride compound semiconductor 失效
    制备III族氮化物半导体的方法和装置

    公开(公告)号:US06897138B2

    公开(公告)日:2005-05-24

    申请号:US10178853

    申请日:2002-06-25

    摘要: The method of the invention for producing a Group III nitride compound semiconductor, employing an etchable substrate which is produced from a material other than the Group III nitride compound semiconductor, includes stacking one or more layers of the Group III nitride compound semiconductor on one face of the substrate and etching the other face of the substrate while stacking one or more semiconductor layers or after completion of stacking one or more semiconductor layers, to thereby reduce the thickness of most of the substrate. The apparatus of present invention for producing a semiconductor through vapor phase growth, contains a substrate for vapor-phase-growing the semiconductor; a source-supplying system for supplying a source for vapor phase growth of the semiconductor; and an etchant-supplying system, wherein the source-supplying system and the etchant-supplying system are isolated through placement of the substrate.

    摘要翻译: 本发明的用于制造III族氮化物化合物半导体的方法,采用由除III族氮化物半导体之外的材料制成的可蚀刻衬底,包括在一个面上堆叠一层或多层III族氮化物化合物半导体 并且在堆叠一个或多个半导体层之后或者在堆叠一个或多个半导体层之后蚀刻衬底的另一个面,从而减小了大部分衬底的厚度。 用于通过气相生长生产半导体的本发明的装置包含用于使半导体气相生长的衬底; 用于提供半导体气相生长源的源供应系统; 以及蚀刻剂供应系统,其中通过放置基板来隔离源供应系统和蚀刻剂供应系统。

    Method for manufacturing group III nitride compound semiconductor laser diodes
    37.
    发明授权
    Method for manufacturing group III nitride compound semiconductor laser diodes 失效
    制造III族氮化物半导体激光二极管的方法

    公开(公告)号:US06486068B2

    公开(公告)日:2002-11-26

    申请号:US09004608

    申请日:1998-01-08

    IPC分类号: H01L21302

    摘要: A method for manufacturing a laser diode using Group III nitride compound semiconductor comprising a buffer layer 2, an n+ layer 3, a cladding layer 4, an active layer 5, a p-type cladding layer 61, a contact layer 62, an SiO2 layer 9, an electrode 7 which is formed on the window formed in a portion of the SiO2 layer 9, and an electrode 8 which is formed on a portion of the n+ layer 3 by etching a portion of 4 layers from the contact layer 62 down to the cladding layer 4. One pair of opposite facets S of a cavity is formed by RIBE, and then the facets are etched by gas cluster ion beam etching using Ar gas. As a result, the facets S are flatted and the mirror reflection of the facets S is improved.

    摘要翻译: 一种使用III族氮化物化合物半导体制造激光二极管的方法,包括缓冲层2,n +层3,包覆层4,有源层5,p型覆层61,接触层62,SiO 2层 如图9所示,形成在形成在SiO 2层9的一部分上的窗口上的电极7和通过从接触层62蚀刻4层的一部分而形成在n +层3的一部分上的电极8, 通过RIBE形成空腔的一对相对面S,然后通过使用Ar气体的气体簇离子束蚀刻蚀刻该刻面。 结果,小面S变平,并且小面S的镜面反射得到改善。