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公开(公告)号：US09615493B2
公开(公告)日：2017-04-04
申请号：US14478086
申请日：2014-09-05
Applicant: NICHIA CORPORATION
Inventor： Ryohei Yamashita , Tomohide Miki , Hiroto Tamaki
CPC classification number: H05K13/00 , H01L24/97 , H01L33/486 , H01L33/62 , H01L2224/48247 , H01L2224/48257 , H01L2224/49113 , H01L2924/181 , Y10T29/49124 , Y10T29/49126 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
Abstract: A method for manufacturing a circuit board constituted by a light emitting device and a mounting board includes the steps of: conveying the light emitting device onto the mounting board in a state in which a top face is chucked by a nozzle so that the nozzle and an exposed part of a first terminal part of the light emitting device are in contact; and placing the light emitting device onto the mounting board so that the first terminal part and a wiring component are in contact in a state in which the top face is chucked by the nozzle.
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32.发明授权Side-view light emitting device including base body having protruding component 有权侧视发光装置，其包括具有突出部件的基体公开(公告)号：US09502619B2
公开(公告)日：2016-11-22
申请号：US14710723
申请日：2015-05-13
Applicant: NICHIA CORPORATION
Inventor： Hiroto Tamaki , Takuya Nakabayashi
CPC classification number: H01L33/486 , H01L24/97 , H01L33/50 , H01L33/507 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/16225
Abstract: A light emitting device has a base body equipped with a base material and a pair of connection terminals disposed from a first main face to a second main face that is on the opposite side from the first main face; a light emitting element connected to the connection terminals on the first main face; and a light reflecting member that covers the side faces of the light emitting element, the base material having a protruding component on the second main face, and the connection terminals being disposed on the first main face from the second main face on both sides of the protruding component, and being partly exposed from the light reflecting member on both sides of the first main face.
Abstract translation: 发光装置具有配置有基材的基体和从第一主面到与第一主面相反的一侧的第二主面配置的一对连接端子， 连接到第一主面上的连接端子的发光元件; 以及覆盖发光元件的侧面的光反射部件，所述基材在所述第二主面上具有突出部，所述连接端子从所述第二主面的所述第二主面设置在所述第一主面上 并且在第一主面的两侧部分地从光反射部件露出。
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公开(公告)号：US09232655B2
公开(公告)日：2016-01-05
申请号：US14582282
申请日：2014-12-24
Applicant: NICHIA CORPORATION
Inventor： Takuya Nakabayashi , Hiroto Tamaki
CPC classification number: H01L33/62 , H01L25/167 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/647 , H01L2224/16225 , H01L2224/48091 , H01L2924/0002 , H01L2924/181 , H05K1/0274 , H05K1/0298 , H05K1/0306 , H05K1/09 , H05K1/115 , H05K1/181 , H05K1/185 , H05K3/282 , H05K2201/0209 , H05K2201/0326 , H05K2201/10106 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: Discoloration is suppressed in a wiring substrate including a conductive member including silver. A wiring substrate includes a ceramic layer and a conductive member including a conductive layer disposed on an upper surface of the ceramic layer. The conductive member includes silver and at least a portion of an upper surface of the conductive layer is covered with a covering layer. The covering layer includes an inorganic reflecting layer and a glass layer stacked on the inorganic reflecting layer.
Abstract translation: 在包括含有银的导电构件的布线基板中抑制了变色。 布线基板包括陶瓷层和包括设置在陶瓷层的上表面上的导电层的导电构件。 导电构件包括银，并且导电层的上表面的至少一部分被覆盖层覆盖。 覆盖层包括层叠在无机反射层上的无机反射层和玻璃层。
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公开(公告)号：US09190585B2
公开(公告)日：2015-11-17
申请号：US13739802
申请日：2013-01-11
Applicant: Nichia Corporation
Inventor： Hiroto Tamaki , Eiko Minato , Takahiro Tani
CPC classification number: H01L33/56 , H01L33/44 , H01L33/486 , H01L33/62 , H01L2224/16245 , H01L2924/01322 , H01L2924/00
Abstract: A light emitting device has a base comprising at least one pair of leads having a silver-containing layer on their surfaces and being secured by a resin molded body, a light emitting element mounted on said leads, a protective film made of an inorganic material that covers the upper surface of said base, and a sealing resin disposed on the base surface via said protective film. The sealing resin has a first resin that covers said light emitting element, and a second resin having a higher hardness than said first resin that covers the boundaries between said resin molded body and said leads.
Abstract translation: 一种发光器件具有包括在其表面上具有含银层的至少一对引线并由树脂成型体固定的基体，安装在所述引线上的发光元件，由无机材料制成的保护膜， 覆盖所述基座的上表面，以及通过所述保护膜设置在基底表面上的密封树脂。 密封树脂具有覆盖所述发光元件的第一树脂和具有比覆盖所述树脂成型体和所述引线之间的边界的所述第一树脂更高的硬度的第二树脂。
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公开(公告)号：US11338393B2
公开(公告)日：2022-05-24
申请号：US15337513
申请日：2016-10-28
Applicant: Laser Systems Inc. , NICHIA CORPORATION
Inventor： Kock Khuen Seet , Masayuki Hayashida , Masakazu Sakamoto , Hiroto Tamaki
IPC: B23K26/382 , H05K3/00 , B23K26/0622 , B23K26/082 , B23K103/00 , B23K26/18 , B23K26/402 , B23K103/10 , B23K103/12
Abstract: A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more.
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Patent Agency Ranking
公开(公告)号：US11063192B2
公开(公告)日：2021-07-13
申请号：US15220681
申请日：2016-07-27
Applicant: NICHIA CORPORATION
Inventor： Hiroto Tamaki , Yoshiki Sato , Yoichi Bando
Abstract: A light emitting device is provided. The light emitting device includes a light emitting element, a wavelength converting member, a light transmissive member, an adhesive member, and a light reflective member. The wavelength converting member has an upper surface and lateral surfaces, contains a fluorescent substance, and is placed on the light emitting element. The light transmissive member covers the upper surface of the wavelength converting member. The adhesive member is interposed between the light emitting element and the wavelength converting member, and covers the lateral surfaces of the wavelength converting member. The light reflective member covers the lateral surfaces of the wavelength converting member via the adhesive member.
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公开(公告)号：US11056627B2
公开(公告)日：2021-07-06
申请号：US16784387
申请日：2020-02-07
Applicant: NICHIA CORPORATION
Inventor： Suguru Beppu , Yoichi Bando , Hiroto Tamaki , Takuya Nakabayashi
IPC: H01L33/60 , H01L33/50 , H01L21/3213
Abstract: A light emitting device includes: a light emitting element; a wavelength conversion member disposed on or above an upper surface of the light emitting element; a light-transmissive member disposed on an upper surface of the wavelength conversion member; and a light reflective member disposed on each side surface of the light emitting element, the wavelength conversion member, and the light-transmissive member, wherein an upper surface of the light reflective member is coplanar with an upper surface of the light-transmissive member, and wherein each of the upper surface of the light reflective member and the upper surface of the light-transmissive member is a cut surface.
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公开(公告)号：US10290607B2
公开(公告)日：2019-05-14
申请号：US15784639
申请日：2017-10-16
Applicant: NICHIA CORPORATION
Inventor： Hiroto Tamaki , Takuya Nakabayashi
Abstract: A method of manufacturing a light emitting device includes: preparing a light-transmissive member including a light reflective sheet that has a through-hole, and a color conversion material layer that is composed of a light-transmissive resin containing a color conversion material and disposed in the through-hole, preparing a light emitting element, fixing the color conversion material layer to the light emitting element, covering a side surface of the light emitting element with a light-reflective member, and cutting the light-reflective member and light-reflective sheet.
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公开(公告)号：US10121946B2
公开(公告)日：2018-11-06
申请号：US15214934
申请日：2016-07-20
Applicant: NICHIA CORPORATION
Inventor： Ryoma Suenaga , Hiroto Tamaki
Abstract: A light emitting device includes a light emitting element, a terminal substrate and a fixing member. The light emitting element is a semiconductor laminate having a first semiconductor layer, a light emitting layer, and a second semiconductor layer that are laminated in that order, a first electrode connected to the first semiconductor layer, and a second electrode connected to the second semiconductor layer. The terminal substrate includes a pair of terminals connected to the first electrode and the second electrode, and an insulator layer that fixes the terminals. At least a part of the outer edges of the terminal substrate is disposed more to a center of the light emitting device than the outer edges of the semiconductor laminate. The fixing member fixes the light emitting element and the terminal substrate.
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公开(公告)号：US10083943B2
公开(公告)日：2018-09-25
申请号：US15623211
申请日：2017-06-14
Applicant: NICHIA CORPORATION
Inventor： Yukitoshi Marutani , Hiroto Tamaki , Tadaaki Miyata
IPC: H01L33/50 , H01L25/075 , H01L33/62 , H01L33/60 , F21Y103/10 , F21K9/27 , F21Y115/10
CPC classification number: H01L25/0753 , F21K9/27 , F21Y2103/10 , F21Y2115/10 , H01L33/50 , H01L33/60 , H01L33/62 , H01L2224/16
Abstract: A method of manufacturing a light-emitting device includes steps of: preparing at least one substrate having a plurality of through holes; providing an electric wire on a rear surface side of the substrate so that a plurality of portions of the electric wire communicates with a front surface side of the substrate at the plurality of through holes of the substrate; and respectively mounting a plurality of light-emitting diodes to the respective portions of the electric wire that communicate with the front surface side of the substrate.
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