公开(公告)号：US11791448B2

公开(公告)日：2023-10-17

申请号：US17736764

申请日：2022-05-04

Applicant: NICHIA CORPORATION

Inventor： Atsushi Kojima ,  Kenji Ozeki ,  Chinami Nakai

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/56 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L33/0093 ,  H01L33/486 ,  H01L33/56 ,  H01L33/60 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light-emitting device includes: a light-emitting element; a wiring board that includes: a substrate, and a wiring pattern including: a plating base layer disposed on the substrate so as to have a gap portion that surrounds a first region in which the light-emitting element is mounted, and a plating layer having a groove that surrounds the first region; a first covering member, at least a portion of which is located in the groove and includes: a reflective material containing layer that contains a first reflective material, and a light-transmissive layer formed above the reflective material containing layer; and a light-transmissive member disposed on the first covering member and the light-emitting element.

公开(公告)号：US11309467B2

公开(公告)日：2022-04-19

申请号：US16940392

申请日：2020-07-28

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Shimpei Maeda

IPC: H01L33/00 ,  H01L33/60 ,  H01L33/54 ,  H01L25/075 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

Abstract: A method for manufacturing a light emitting device includes preparing a light transmissive member block including a first light transmissive member block having a plate like shape and including a resin containing at least one phosphor and a second light transmissive member block including a material harder than a material of the first light transmissive member block. Grooves are formed on an upper face of the second light transmissive member block. The light transmissive member block is divided at the grooves to obtain a plurality of light transmissive members each having a first light transmissive member and a second light transmissive member. A lower face of the first light transmissive member and an upper face of a light emitting element are bonded together such that a lower face perimeter of the first light transmissive member is located outside of an upper face perimeter of the light emitting element.

公开(公告)号：US11189765B2

公开(公告)日：2021-11-30

申请号：US16726394

申请日：2019-12-24

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Atsushi Kojima ,  Chinami Nakai

IPC: H01L33/60 ,  H01L25/16 ,  H01L29/866 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

Abstract: A light emitting device includes: a substrate including a grooved part surrounding a first region; a light emitting element mounted in the first region; a first cover member comprising: a reflecting material-containing layer that is disposed in the groove of the grooved part and that contains a first reflecting material, and a light transmitting layer that covers at least a portion of lateral surfaces of the light emitting element; and a light transmitting member disposed on the first cover member and the light emitting element.

公开(公告)号：US11079094B2

公开(公告)日：2021-08-03

申请号：US16930773

申请日：2020-07-16

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Masami Nishi

IPC: F21V9/32 ,  H01L33/58 ,  F21S41/00 ,  H01L33/54 ,  H01L25/075 ,  H01L33/50

Abstract: A light emitting device includes a light emitting element, a light-transmissive member, a covering member, and a base member. The light-transmissive member has a flange on a lateral surface thereof in such a manner as to continue from a periphery of an upper surface to a periphery of a lower surface of the light-transmissive member and to be positioned outside the upper surface of the light-transmissive member and an upper surface of the light emitting element in plan view. The flange has a thin portion at an inner side than the outer edge side of the flange. The thin portion has a thickness smaller than a thickness of the outer edge side of the flange.

公开(公告)号：US11024771B2

公开(公告)日：2021-06-01

申请号：US16803589

申请日：2020-02-27

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Akira Goto

IPC: H01L33/38 ,  H01L33/48 ,  H01L33/50 ,  H01L23/00 ,  H01L33/00 ,  H01L33/60 ,  H01L33/36 ,  H01L33/52 ,  H01L33/62

Abstract: A method for manufacturing a light emitting device includes: providing a substrate defining a mounting region having a wiring pattern on an upper face thereof; forming a plurality of bumps arranged in a plurality of columns extending parallel to each other with a distance between adjacent ones of the bumps in one of the columns arranged closest to an outer edge of the mounting region is larger than a distance between adjacent ones of the bumps arranged on an inner side in a plan view, and the bumps include first bumps and second bumps with the first bumps including first large bumps and first small bumps, with all the bumps in the one of the columns arranged closest to the outer edge are the same size; mounting the light emitting element onto the bumps in a flip-chip manner; and forming a cover member.

公开(公告)号：US20210028339A1

公开(公告)日：2021-01-28

申请号：US16928233

申请日：2020-07-14

Applicant: NICHIA CORPORATION

Inventor： Atsushi Kojima ,  Kenji Ozeki ,  Chinami Nakai

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/56 ,  H01L33/60 ,  H01L33/48

Abstract: A method of manufacturing a light-emitting device includes: providing a wiring board that includes: a substrate, and a wiring pattern comprising: a plating base layer disposed on the substrate so as to have a gap portion that surrounds a first region in which a light-emitting element is to be mounted, and a plating layer having a groove that surrounds the first region; mounting the light-emitting element in the first region; supplying a first resin that contains a first reflective material into the groove; forming a first covering member, at least a portion of which is located in the groove and comprises: a reflective material containing layer containing the first reflective material, and a light-transmissive layer formed above the reflective material containing layer; and forming a light-transmissive member on the first covering member and the light-emitting element.

公开(公告)号：US10274140B1

公开(公告)日：2019-04-30

申请号：US16213255

申请日：2018-12-07

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki

IPC: F21K9/68 ,  F21V7/00 ,  H01L33/60 ,  F21V13/02 ,  F21V3/08 ,  F21K9/66 ,  H01L33/58 ,  F21Y115/10 ,  H01L33/50 ,  F21S41/141 ,  F21S41/36

Abstract: A method for manufacturing a light emitting device includes: providing a light emitting element; providing a light transmissive member having a first upper surface, a lower surface, first lateral surfaces, and second lateral surfaces each positioned on an outer side of a corresponding one of the first lateral surfaces; joining the lower surface of the light transmissive member and an upper surface of the light emitting element; applying a first light reflective member to cover the first lateral surfaces of the light transmissive member, and applying a second light reflective member to cover lateral surfaces of the first light reflective member, the second lateral surfaces of the light transmissive member, and a lateral surface of the light emitting element.

公开(公告)号：US10243106B2

公开(公告)日：2019-03-26

申请号：US15841769

申请日：2017-12-14

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Akira Goto

IPC: H01L33/38 ,  H01L33/48 ,  H01L33/50 ,  H01L23/00 ,  H01L33/00 ,  H01L33/60 ,  H01L33/36 ,  H01L33/62

Abstract: A light emitting device includes a substrate, a light emitting element, a plurality of bumps and a cover member. The bumps are disposed between the substrate and the light emitting element to mount the light emitting element on the substrate. The bumps include a plurality of first bumps bonded to a first electrode of the light emitting element, and a plurality of second bumps bonded to a second electrode of the light emitting element. The first bumps are spaced apart from exposed portions of a first semiconductor layer of the light emitting element. The first bumps include a plurality of large bumps and a plurality of small bumps each having a smaller surface area than each of the large bumps in a plan view. The cover member covers the light emitting element, the bumps, and the substrate.

公开(公告)号：US09972754B2

公开(公告)日：2018-05-15

申请号：US15251851

申请日：2016-08-30

Applicant: NICHIA CORPORATION

Inventor： Tomonori Miyoshi ,  Kenji Ozeki

IPC: H01L33/50 ,  H01L33/60 ,  H01L27/15 ,  H01L23/00 ,  H01L33/46 ,  H01L33/32 ,  H01L33/62 ,  H01L23/498 ,  H01L33/56

CPC classification number: H01L33/505 ,  H01L23/49805 ,  H01L24/16 ,  H01L24/32 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/32 ,  H01L33/46 ,  H01L33/502 ,  H01L33/507 ,  H01L33/508 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/29191 ,  H01L2224/32059 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

Abstract: A light emitting device includes a light emitting element; a light-transmissive member that has a lower surface positioned inside a peripheral edge of an upper surface of the light emitting element in plan view, a first lateral surface extending from the lower surface and having at least one inclined surface that is inclined with respect to the upper surface of the light emitting element, and a second lateral surface positioned above and outside the first lateral surface; a light-transmissive adhesive member positioned inside the second lateral surface in plan view, wherein the adhesive member adheres the upper surface of the light emitting element and the lower surface of the light-transmissive member to each other and covers the first lateral surface; and a light-reflective member covering the second lateral surface.

公开(公告)号：US09954153B2

公开(公告)日：2018-04-24

申请号：US15636550

申请日：2017-06-28

Applicant: NICHIA CORPORATION

Inventor： Tomonori Miyoshi ,  Kenji Ozeki

IPC: H01L33/00 ,  H01L33/58 ,  H01L33/60 ,  H01L33/50 ,  H01L33/54 ,  H01L27/15

CPC classification number: H01L33/54 ,  H01L27/15 ,  H01L27/156 ,  H01L33/502 ,  H01L33/505 ,  H01L33/507 ,  H01L33/52 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/73253 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00012

Abstract: A light-emitting device includes a substrate; a light-emitting element mounted on the substrate; a first light-transmissive member bonded to an upper surface of the light-emitting element via an adhesive; and a second light-transmissive member placed on an upper surface of the first light-transmissive member. In a plan view of the light-emitting device, a peripheral edge of a lower surface of the first light-transmissive member is positioned more inward than a peripheral edge of the upper surface of the light-emitting element. The adhesive extends from the upper surface of the light-emitting element to a lower surface of the second light-transmissive member, the adhesive covers a side surface of the first light-transmissive member, and the adhesive is separated from the substrate.