公开(公告)号：US20090155949A1

公开(公告)日：2009-06-18

申请号：US12390195

申请日：2009-02-20

申请人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

发明人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

IPC分类号： H01L31/0232

CPC分类号： H01L27/00 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/00014

摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

摘要翻译： 微电子成像器组件包括包括衬底的工件和在衬底上和/或衬底中的多个成像管芯。 基板包括前侧和后侧，并且成像管芯包括在基板的前侧的成像传感器和可操作地耦合到图像传感器的外部触点。 微电子成像器组件还包括相对于成像管芯叠加的光学支架。 光学支撑件可以直接在基板上或衬底上的盖上。 单个光学支撑件可以具有（a）与图像传感器中的一个对准的开口，以及（b）与图像传感器相距一定距离处的轴承元件。 微电子成像器组件还可以包括由光学器件支撑件安装或以其它方式承载的光学器件。

公开(公告)号：US20080138973A1

公开(公告)日：2008-06-12

申请号：US12027106

申请日：2008-02-06

申请人： Kyle K. Kirby ,  Salman Akram ,  David R. Hembree ,  Sidney B. Rigg ,  Warren M. Farnworth ,  William M. Hiatt

发明人： Kyle K. Kirby ,  Salman Akram ,  David R. Hembree ,  Sidney B. Rigg ,  Warren M. Farnworth ,  William M. Hiatt

IPC分类号： H01L21/44 ,  H01L21/768

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0306 ,  H05K3/4038 ,  H05K3/422 ,  H05K3/423 ,  H05K2201/0305 ,  H05K2201/09827 ,  H05K2203/072 ,  H05K2203/1147 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In one embodiment, a method comprises providing a microelectronic substrate having a front side and a backside. The substrate has a microelectronic die including an integrated circuit and a terminal operatively coupled to the integrated circuit. The method also includes forming a passage at least partially through the substrate and having an opening at the front side and/or backside of the substrate. The method further includes sealing the opening with a conductive cap that closes one end of the passage while another end of the passage remains open. The method then includes filling the passage with a conductive material.

摘要翻译： 本文公开了微电子器件，用于封装微电子器件的方法，以及用于在微电子器件中形成互连的方法。 在一个实施例中，一种方法包括提供具有正面和背面的微电子衬底。 衬底具有包括集成电路的微电子管芯和可操作地耦合到集成电路的端子。 该方法还包括至少部分地形成通过基底并且在基底的前侧和/或后侧具有开口的通道。 该方法还包括用封闭通道一端的导电盖密封开口，同时通道的另一端保持打开。 该方法然后包括用导电材料填充通道。

公开(公告)号：US07341881B2

公开(公告)日：2008-03-11

申请号：US11409058

申请日：2006-04-24

申请人： Charles M. Watkins ,  David R. Hembree ,  Peter A. Benson ,  Salman Akram

发明人： Charles M. Watkins ,  David R. Hembree ,  Peter A. Benson ,  Salman Akram

IPC分类号： H01L21/00

CPC分类号： H01L27/14625 ,  H01L24/94 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/1469 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： Microelectronic imaging devices and methods of packaging microelectronic imaging devices are disclosed herein. In one embodiment, a microelectronic imaging device includes a microelectronic die having an integrated circuit, an image sensor electrically coupled to the integrated circuit, and a plurality of bond-pads electrically coupled to the integrated circuit. The imaging device further includes a cover over the image sensor and a plurality of interconnects in and/or on the cover that are electrically coupled to corresponding bond-pads of the die. The interconnects provide external electrical contacts for the bond-pads of the die. The interconnects can extend through the cover or along a surface of the cover.

摘要翻译： 本文公开了微电子成像装置和包装微电子成像装置的方法。 在一个实施例中，微电子成像装置包括具有集成电路的微电子管芯，电耦合到集成电路的图像传感器，以及电耦合到集成电路的多个接合焊盘。 所述成像装置还包括覆盖在所述图像传感器上的盖和在所述盖中和/或盖上的多个互连件，其电耦合到所述管芯的相应接合焊盘。 互连件为模具的焊盘提供外部电触头。 互连可以延伸穿过盖或沿着盖的表面。

公开(公告)号：US07250780B2

公开(公告)日：2007-07-31

申请号：US10742729

申请日：2003-12-19

申请人： David R. Hembree ,  Warren M. Farnworth ,  Salman Akram ,  Alan G. Wood ,  C. Patrick Doherty ,  Andrew J. Krivy

发明人： David R. Hembree ,  Warren M. Farnworth ,  Salman Akram ,  Alan G. Wood ,  C. Patrick Doherty ,  Andrew J. Krivy

IPC分类号： G01R1/073 ,  G01R31/28

CPC分类号： G01R31/2886

摘要： A probe card for testing semiconductor wafers, and a method and system for testing wafers using the probe card are provided. The probe card is configured for use with a conventional testing apparatus, such as a wafer probe handler, in electrical communication with test circuitry. The probe card includes an interconnect substrate having contact members for establishing electrical communication with contact locations on the wafer. The probe card also includes a membrane for physically and electrically connecting the interconnect substrate to the testing apparatus, and a compressible member for cushioning the pressure exerted on the interconnect substrate by the testing apparatus. The interconnect substrate can be formed of silicon with raised contact members having penetrating projections. Alternately the contact members can be formed as indentations for testing bumped wafers. The membrane can be similar to multi layered TAB tape including metal foil conductors attached to a flexible, electrically-insulating, elastomeric tape. The probe card can be configured to contact all of the dice on the wafer at the same time, so that test signals can be electronically applied to selected dice as required.

摘要翻译： 提供了用于测试半导体晶片的探针卡，以及使用探针卡测试晶片的方法和系统。 探针卡被配置用于与测试电路电气通信的常规测试装置，例如晶片探测器处理器。 探针卡包括具有用于与晶片上的接触位置建立电连通的接触构件的互连基板。 探针卡还包括用于将互连基板物理和电连接到测试装置的膜，以及用于缓冲由测试装置施加在互连基板上的压力的可压缩构件。 互连衬底可以由具有穿透突起的凸起接触构件的硅形成。 或者，接触构件可以形成为用于测试凸起的晶片的凹陷。 膜可以类似于多层TAB带，其包括附接到柔性，电绝缘的弹性体带的金属箔导体。 探针卡可以配置为同时接触晶片上的所有骰子，以便测试信号可以根据需要以电子方式应用于选定的骰子。

公开(公告)号：US07166915B2

公开(公告)日：2007-01-23

申请号：US10032734

申请日：2001-12-28

申请人： Salman Akram ,  David R. Hembree ,  James M. Wark

发明人： Salman Akram ,  David R. Hembree ,  James M. Wark

IPC分类号： H01L23/34

CPC分类号： H01L23/5382 ,  H01L2924/0002 ,  Y10S438/977 ,  H01L2924/00

摘要： Multi-chip module systems and method of fabrication thereof wherein the equivalent of a failed die of a multi-chip module (MCM) is added to the module in a vacancy position previously constructed with appropriate electrical connections. A variety of different dice may be attached to the same vacancy position of an MCM by means of adapters, wherein each adapter has the same footprint, but different adapters are capable of accommodating different numbers and types of dice.

摘要翻译： 多芯片模块系统及其制造方法，其中将多芯片模块（MCM）的故障芯片的等同物添加到先前用适当的电连接构造的空位中的模块中。 各种不同的骰子可以通过适配器连接到MCM的相同空位，其中每个适配器具有相同的占位面积，但是不同的适配器能够容纳不同数量和类型的骰子。

公开(公告)号：US06720652B2

公开(公告)日：2004-04-13

申请号：US10213185

申请日：2002-08-05

申请人： Salman Akram ,  James M. Wark ,  David R. Hembree

发明人： Salman Akram ,  James M. Wark ,  David R. Hembree

IPC分类号： H01L2334

CPC分类号： H01L23/5382 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/14 ,  H05K1/0292 ,  H05K1/0295 ,  H05K2201/0979 ,  H05K2201/10159 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method and apparatus for repair of a multi-chip module, such as a memory module, is provided, where at least one redundant or auxiliary chip attach location is provided on the substrate of the multi-chip module. The auxiliary chip attach location preferably provides contacts for attachment of more than one type of replacement semiconductor chip. Accordingly, when one or more chips on the multi-chip module are found to be completely or partially defective, at least one replacement chip can be selected and attached to the auxiliary location to provide additional memory to bring the module back to its design capacity.

摘要翻译： 提供了一种用于修复诸如存储器模块的多芯片模块的方法和装置，其中在多芯片模块的基板上提供至少一个冗余或辅助芯片连接位置。 辅助芯片安装位置优选地提供用于连接多于一种类型的替换半导体芯片的触点。 因此，当发现多芯片模块上的一个或多个芯片完全或部分缺陷时，可以选择至少一个替换芯片并附加到辅助位置，以提供额外的存储器以使模块回到其设计能力。

公开(公告)号：US06703640B1

公开(公告)日：2004-03-09

申请号：US09510828

申请日：2000-02-23

申请人： David R. Hembree ,  Salman Akram ,  Derek Gochnour

发明人： David R. Hembree ,  Salman Akram ,  Derek Gochnour

IPC分类号： H01L2329

CPC分类号： G01R1/0466

摘要： A spring element used in a temporary package for testing semiconductors is provided. The spring element is compressed so as to press the semiconductor, either in the form of a bare semiconductor die or as part of a package, against an interconnect structure. The spring element is configured so that it provides sufficient pressure to keep the contacts on the semiconductor in electrical contact with the interconnect structure. Material is added and/or removed from the spring element so that it has the desired modulus of elasticity. The shape of the spring element may also be varied to change the modulus of elasticity, the spring constant, and the force transfer capabilities of the spring element. The spring element also includes conductive material to increase the thermal and electrical conductivity of the spring element.

摘要翻译： 提供了用于测试半导体的临时封装中的弹簧元件。 弹簧元件被压缩以将半导体以裸半导体管芯的形式或作为封装的一部分压在互连结构上。 弹簧元件构造成使得其提供足够的压力以保持半导体上的触点与互连结构电接触。 向弹簧元件添加和/或移除材料，使其具有所需的弹性模量。 弹簧元件的形状也可以改变以改变弹性元件的弹性模量，弹簧常数和力传递能力。 弹簧元件还包括导电材料以增加弹簧元件的导热性和导电性。

公开(公告)号：US06598290B2

公开(公告)日：2003-07-29

申请号：US10124848

申请日：2002-04-18

申请人： David R. Hembree ,  Salman Akram ,  Derek Gochnour

发明人： David R. Hembree ,  Salman Akram ,  Derek Gochnour

IPC分类号： H01R900

CPC分类号： G01R1/0466 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49153 ,  Y10T29/53209 ,  Y10T29/5323

摘要： A spring element used in a temporary package for testing semiconductors is provided. The spring element is compressed so as to press the semiconductor, either in the form of a bare semiconductor die or as part of a package, against an interconnect structure. The spring element is configured so that it provides sufficient pressure to keep the contacts on the semiconductor in electrical contact with the interconnect structure. Material is added and/or removed from the spring element so that it has the desired modulus of elasticity. The shape of the spring element may also be varied to change the modulus of elasticity, the spring constant, and the force transfer capabilities of the spring element.

摘要翻译： 提供了用于测试半导体的临时封装中的弹簧元件。 弹簧元件被压缩以将半导体以裸半导体管芯的形式或作为封装的一部分压在互连结构上。 弹簧元件构造成使得其提供足够的压力以保持半导体上的触点与互连结构电接触。 向弹簧元件添加和/或移除材料，使其具有所需的弹性模量。 弹簧元件的形状也可以改变以改变弹性元件的弹性模量，弹簧常数和力传递能力。

公开(公告)号：US06531772B2

公开(公告)日：2003-03-11

申请号：US09832053

申请日：2001-04-10

申请人： Salman Akram ,  James M. Wark ,  David R. Hembree

发明人： Salman Akram ,  James M. Wark ,  David R. Hembree

IPC分类号： H01L2334

CPC分类号： H01L23/5382 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/14 ,  H05K1/0292 ,  H05K1/0295 ,  H05K2201/0979 ,  H05K2201/10159 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method and apparatus for repair of a multi-chip module, such as a memory module, is provided, where at least one redundant or auxiliary chip attach location is provided on the substrate of the multi-chip module. The auxiliary chip attach location preferably provides contacts for attachment of more than one type of replacement semiconductor chip. Accordingly, when one or more chips on the multi-chip module are found to be completely or partially defective, at least one replacement chip can be selected and attached to the auxiliary location to provide additional memory to bring the module back to its design capacity.

摘要翻译： 提供了一种用于修复诸如存储器模块的多芯片模块的方法和装置，其中在多芯片模块的基板上提供至少一个冗余或辅助芯片连接位置。 辅助芯片安装位置优选地提供用于连接多于一种类型的替换半导体芯片的触点。 因此，当发现多芯片模块上的一个或多个芯片完全或部分缺陷时，可以选择至少一个替换芯片并附加到辅助位置，以提供额外的存储器以使模块回到其设计能力。

公开(公告)号：US06392429B1

公开(公告)日：2002-05-21

申请号：US09594748

申请日：2000-06-14

申请人： David R. Hembree ,  Warren M. Farnworth ,  Alan G. Wood ,  Salman Akram

发明人： David R. Hembree ,  Warren M. Farnworth ,  Alan G. Wood ,  Salman Akram

IPC分类号： G01R3102

CPC分类号： H01L23/49838 ,  G01R1/0433 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2863 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/80 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15174 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723 ,  H01L2224/05599

摘要： A temporary package for a semiconductor die is provided. The temporary package has an outline and external contact configuration that are the same as a conventional plastic or ceramic semiconductor package. The temporary package can be used for burn-in testing of the die using standard equipment. The die can then be removed from the package and certified as a known good die. The package includes a base, an interconnect and a force applying mechanism. The package base includes external contacts formed in a dense array, such as a land grid array (LGA), a pin grid array (PGA), a bumped grid array (BGA) or a perimeter array. The package base can be formed of ceramic or plastic with internal conductive lines using a ceramic lamination process, a 3-D molding process or a Cerdip formation process.

摘要翻译： 提供了一种用于半导体管芯的临时封装。 临时包装具有与常规塑料或陶瓷半导体封装相同的轮廓和外部接触构造。 临时包装可用于使用标准设备对模具进行老化测试。 然后可以将模具从包装中取出并被认证为已知的好的模具。 该包装包括底座，互连和力施加机构。 封装基座包括形成在密集阵列中的外部触头，例如焊盘格栅阵列（LGA），引脚格栅阵列（PGA），凸起栅格阵列（BGA）或周边阵列。 封装基底可以由具有内部导电线的陶瓷或塑料形成，使用陶瓷层压工艺，3-D成型工艺或Cerdip形成工艺。