Light-emitting semiconductor device using group III nitride compound

    公开(公告)号:US06288416B1

    公开(公告)日:2001-09-11

    申请号:US09346935

    申请日:1999-07-02

    IPC分类号: H01L3300

    摘要: An emission layer (5) for a light source device is formed to have a multi-layer structure, doped with an acceptor and a donor impurity. The multi-layer structure may include a quantum well (QW) structure or a multi quantum well (MQW) structure (50). With such a structure, a peak wavelength of the light source can be controlled, because the distances between atoms of the acceptor and the donor impurities are widened. Several arrangements can be made by, e.g., altering the thickness of each composite layer of the multi-layer structure, altering their composition ratio, forming undoped layer 5 between the impurity doped layers, and so forth. Further, luminous intensity of ultra violet color can be improved, because doping the donor impurity and the acceptor impurity realizes a donor-acceptor emission mechanism and abundant carriers. Several arrangements can be made by, e.g., optimizing the materials of the composite layers, optimizing their composition ratios, optimizing their lattice constants, and so forth to further enhance the luminous intensity of the light source.

    LED package
    35.
    发明授权
    LED package 有权
    LED封装

    公开(公告)号:US08546834B2

    公开(公告)日:2013-10-01

    申请号:US11783788

    申请日:2007-04-12

    IPC分类号: H01L33/00

    摘要: An LED package improved in efficiency and brightness. In the package, a body has a mounting part thereon. A plurality of light emitting diode chips are mounted on the mounting part. The mounting part has a cross-section upwardly convexed with a non-planar top portion so that at least two adjacent ones of the light emitting diode chips have opposing side surfaces facing a different direction from each other.

    摘要翻译: LED封装提高了效率和亮度。 在包装中,主体在其上具有安装部分。 多个发光二极管芯片安装在安装部分上。 安装部分具有向上凸起的非平面顶部部分的横截面,使得至少两个相邻的发光二极管芯片具有面向彼此不同方向的相对侧表面。

    Method of forming nitride film and nitride structure
    36.
    发明授权
    Method of forming nitride film and nitride structure 有权
    形成氮化物膜和氮化物结构的方法

    公开(公告)号:US07943492B2

    公开(公告)日:2011-05-17

    申请号:US11790125

    申请日:2007-04-24

    IPC分类号: H01L21/20

    摘要: A method of forming a nitride film by hydride vapor phase epitaxy, the method including: sequentially disposing at least one group III metal source including impurities and a substrate in an external reaction chamber and an internal reaction chamber sequentially located in the direction of gas supply and heating each of the external reaction chamber and the internal reaction chamber at a growth temperature; forming a metal chloride by supplying hydrogen chloride gas and carrier gas into the external reaction chamber to react with the group III metal source and transferring the metal chloride to the substrate; and forming the nitride film doped with the impurities on the substrate by reacting the transferred metal chloride with nitrogen source gas supplied to the internal reaction chamber.

    摘要翻译: 一种通过氢化物气相外延形成氮化物膜的方法,所述方法包括:在外部反应室和依次位于气体供给方向上的内部反应室中依次配置至少一种包括杂质的III族金属源和基板, 在生长温度下加热外部反应室和内部反应室; 通过向外部反应室中供应氯化氢气体和载气而与III族金属源反应并将金属氯化物转移到基底上形成金属氯化物; 以及通过使转移的金属氯化物与供应到内部反应室的氮源气体反应,在衬底上形成掺杂有杂质的氮化物膜。

    Method for producing a group III nitride compound semiconductor laser
    39.
    发明授权
    Method for producing a group III nitride compound semiconductor laser 有权
    III族氮化物半导体激光器的制造方法

    公开(公告)号:US07186579B2

    公开(公告)日:2007-03-06

    申请号:US10924999

    申请日:2004-08-25

    IPC分类号: H01L21/00

    摘要: A semiconductor laser comprises a sapphire substrate, an AlN buffer layer, Si-doped GaN n-layer, Si-doped Al0.1Ga0.9N n-cladding layer, Si-doped GaN n-guide layer, an active layer having multiple quantum well (MQW) structure in which about 35 Å in thickness of GaN barrier layer 62 and about 35 Å in thickness of Ga0.95In0.05N well layer 61 are laminated alternately, Mg-doped GaN p-guide layer, Mg-doped Al0.25Ga0.75N p-layer, Mg-doped Al0.1Ga0.9N p-cladding layer, and Mg-doped GaN p-contact layer are formed successively thereon. A ridged hole injection part B which contacts to a ridged laser cavity part A is formed to have the same width as the width w of an Ni electrode. Because the p-layer has a larger aluminum composition, etching rate becomes smaller and that can prevent from damaging the p-guide layer in this etching process.

    摘要翻译: 半导体激光器包括蓝宝石衬底,AlN缓冲层,Si掺杂的GaN n层,Si掺杂的Al 0.1 Ga 0.9 N n包层,Si- 掺杂GaN n引导层,具有多个量子阱(MQW)结构的有源层,其中GaN阻挡层62的厚度约为35,Ga Ga 2 O 3的厚度为约35。 0.05N的N阱层61交替层叠,Mg掺杂的GaN p导向层,掺杂了Mg的Al 0.25 N Ga 0.75 N p层,Mg- 掺杂的Al 0.1 Ga 0.9 N p包覆层和Mg掺杂的GaN p接触层。 与脊状激光腔部A接触的脊状空穴注入部B形成为与Ni电极的宽度w相同的宽度。 因为p层具有较大的铝组成,所以蚀刻速率变小,并且可以防止在该蚀刻工艺中损坏p导向层。