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Patent Agency Ranking
公开(公告)号：US20170309534A1
公开(公告)日：2017-10-26
申请号：US15646695
申请日：2017-07-11
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Lu-Yi Chen , Chang-Lun Lu , Shih-Ching Chen
CPC classification number: H01L23/16 , H01L21/561 , H01L21/568 , H01L23/3114 , H01L23/562 , H01L24/19 , H01L24/20 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2924/18162
Abstract: An electronic module is provided, including an electronic element and a strengthening layer formed on a side surface of the electronic element but not formed on an active surface of the electronic element so as to strengthen the structure of the electronic module. Therefore, the electronic element is prevented from being damaged when the electronic module is picked and placed.
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公开(公告)号：US20170243834A1
公开(公告)日：2017-08-24
申请号：US15149576
申请日：2016-05-09
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chieh-Lung Lai , Mao-Hua Yeh , Hung-Yuan Li , Shih-Liang Peng , Chang-Lun Lu
IPC: H01L23/00 , H01L21/56 , H01L21/48 , H01L23/498 , H01L23/31
CPC classification number: H01L23/562 , H01L21/4853 , H01L21/486 , H01L21/565 , H01L23/147 , H01L23/3114 , H01L23/3128 , H01L23/49811 , H01L23/49827 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/92 , H01L24/97 , H01L2021/60022 , H01L2224/0401 , H01L2224/131 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/81815 , H01L2224/92125 , H01L2224/97 , H01L2924/15311 , H01L2924/3511 , H01L2924/37001 , H01L2224/81 , H01L2224/83 , H01L2924/014 , H01L2924/00014
Abstract: A semiconductor substrate is provided, including a substrate body, a plurality of conductive through holes penetrating the substrate body, and at least one pillar disposed in the substrate body with the at least one pillar being free from penetrating the substrate body. When the semiconductor substrate is heated, the at least one pillar adjusts the expansion of upper and lower sides of the substrate body. Therefore, the upper and lower sides of the substrate body have substantially the same thermal deformation, and the substrate body is prevented from warpage.
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公开(公告)号：US09601403B2
公开(公告)日：2017-03-21
申请号：US14982276
申请日：2015-12-29
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Lu-Yi Chen , Guang-Hwa Ma , Shih-Ching Chen , Chang-Lun Lu
IPC: H01L27/32 , H01L23/31 , H01L25/16 , H01L25/065 , H01L23/498 , H01L21/48 , H01L21/56 , H01L25/00
CPC classification number: H01L23/3128 , H01L21/4853 , H01L21/56 , H01L21/568 , H01L23/3135 , H01L23/49838 , H01L25/0652 , H01L25/16 , H01L25/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/131 , H01L2224/16227 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48464 , H01L2224/73204 , H01L2224/73265 , H01L2224/81005 , H01L2224/85005 , H01L2224/92125 , H01L2224/92247 , H01L2924/00014 , H01L2924/15192 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/37001 , H01L2924/014 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/32245 , H01L2224/48247 , H01L2224/45099
Abstract: An electronic package is provided, which includes: a first circuit structure; at least first electronic element disposed on a surface of the first circuit structure; at least a first conductive element formed on the surface of the first circuit structure; a first encapsulant encapsulating the first electronic element and the first conductive element; and a second circuit structure formed on the first encapsulant and electrically connected to the first conductive element. By directly disposing the electronic element having high I/O functionality on the circuit structure, the invention eliminates the need of a packaging substrate having a core layer and thus reduces the thickness of the electronic package. The invention further provides a method for fabricating the electronic package.
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公开(公告)号：US20160066406A1
公开(公告)日：2016-03-03
申请号：US14516010
申请日：2014-10-16
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Lu-Yi Chen , Chang-Lun Lu , Shih-Ching Chen
CPC classification number: H01L23/16 , H01L21/561 , H01L21/568 , H01L23/3114 , H01L23/562 , H01L24/19 , H01L24/20 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2924/18162
Abstract: An electronic module is provided, including an electronic element and a strengthening layer formed on a side surface of the electronic element but not formed on an active surface of the electronic element so as to strengthen the structure of the electronic module. Therefore, the electronic element is prevented from being damaged when the electronic module is picked and placed.
Abstract translation: 提供一种电子模块，包括电子元件和形成在电子元件的侧表面上但未形成在电子元件的有效表面上的加强层，以便加强电子模块的结构。 因此，当拾取和放置电子模块时，防止电子元件被损坏。
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公开(公告)号：US20150325545A1
公开(公告)日：2015-11-12
申请号：US14689140
申请日：2015-04-17
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Jyun-Ling Tsai , Chang-Lun Lu
IPC: H01L23/00 , H01L21/48 , H01L23/498
CPC classification number: H01L24/13 , H01L21/4846 , H01L23/498 , H01L23/49811 , H01L23/49816 , H01L24/05 , H01L24/11 , H01L24/14 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/1147 , H01L2224/11472 , H01L2224/11849 , H01L2224/13017 , H01L2224/1308 , H01L2224/13084 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/1405 , H01L2224/14051 , H01L2224/145 , H01L2224/16058 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81 , H01L2224/81193 , H01L2224/81359 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/15311 , H01L2924/00 , H01L2924/00014
Abstract: A chip structure is provided, which includes: a substrate having a plurality of conductive pads formed on a surface thereof; a first copper layer formed on each of the conductive pads; a nickel layer formed on the first copper layer; a second copper layer formed on the nickel layer; and a tin layer formed on the second copper layer, thereby effectively reducing stresses.
Abstract translation: 提供了一种芯片结构，其包括：在其表面上形成有多个导电焊盘的基板; 形成在每个导电焊盘上的第一铜层; 形成在所述第一铜层上的镍层; 形成在镍层上的第二铜层; 和形成在第二铜层上的锡层，从而有效地减少应力。
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