公开(公告)号：US20170236787A1

公开(公告)日：2017-08-17

申请号：US15584281

申请日：2017-05-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hao-Ju Fang ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Tsung-Hsien Tsai ,  Chia-Yang Chen ,  Chun-Chi Ke

IPC: H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  H01L25/065 ,  H01L21/78 ,  H01L23/16 ,  H01L23/31 ,  H01L21/56 ,  H01L21/54

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/54 ,  H01L21/561 ,  H01L21/563 ,  H01L21/78 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.

公开(公告)号：US20170231095A1

公开(公告)日：2017-08-10

申请号：US15163045

申请日：2016-05-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Ying-Wei Lu ,  Jyun-Yuan Jhang ,  Ming-Fan Tsai

IPC: H05K1/18

CPC classification number: H05K1/185 ,  G06K19/07777 ,  H01L25/00 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/1815 ,  H05K1/165 ,  H05K1/186 ,  H05K3/0014 ,  H05K3/107 ,  H05K3/207 ,  H05K3/4602 ,  H05K3/465 ,  H05K2201/09118 ,  H05K2201/10098 ,  H05K2203/1327 ,  H01L2924/00014

Abstract: An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the openings from one another, and the support portion supporting the base portion over the substrate. Therefore, no additional area is required to be defined on a surface of the substrate, and the miniaturization requirement of the electronic package is thus met.

公开(公告)号：US09673151B2

公开(公告)日：2017-06-06

申请号：US14837604

申请日：2015-08-27

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hao-Ju Fang ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Tsung-Hsien Tsai ,  Chia-Yang Chen ,  Chun-Chi Ke

IPC: H01L23/552 ,  H01L21/48 ,  H01L21/54 ,  H01L21/56 ,  H01L21/78 ,  H01L23/16 ,  H01L23/31 ,  H01L25/065 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/54 ,  H01L21/561 ,  H01L21/563 ,  H01L21/78 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.

公开(公告)号：US12100641B2

公开(公告)日：2024-09-24

申请号：US18223221

申请日：2023-07-18

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Siang-Yu Lin ,  Wen-Jung Tsai ,  Chia-Yang Chen ,  Chien-Cheng Lin

IPC: H01L23/42 ,  H01L21/56 ,  H01L23/16 ,  H01L23/31 ,  H01L23/367

CPC classification number: H01L23/42 ,  H01L21/561 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/367

Abstract: An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer. A spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area. With the design of the thermal insulation area, the plurality of electronic components can be effectively thermally insulated from one another to prevent heat generated by one electronic component of high power from being conducted to another electronic component of low power that would thermally affect the operation of the low-power electronic component. A method for manufacturing the electronic package is also provided.

公开(公告)号：US20230360997A1

公开(公告)日：2023-11-09

申请号：US18223221

申请日：2023-07-18

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Siang-Yu Lin ,  Wen-Jung Tsai ,  Chia-Yang Chen ,  Chien-Cheng Lin

IPC: H01L23/42 ,  H01L23/31 ,  H01L21/56 ,  H01L23/16 ,  H01L23/367

CPC classification number: H01L23/42 ,  H01L23/3128 ,  H01L21/561 ,  H01L23/16 ,  H01L23/367

Abstract: An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer. A spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area. With the design of the thermal insulation area, the plurality of electronic components can be effectively thermally insulated from one another to prevent heat generated by one electronic component of high power from being conducted to another electronic component of low power that would thermally affect the operation of the low-power electronic component. A method for manufacturing the electronic package is also provided.

公开(公告)号：US11764162B2

公开(公告)日：2023-09-19

申请号：US16997173

申请日：2020-08-19

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ming-Fan Tsai ,  Chih-Wei Chen ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2924/3025

Abstract: An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.

公开(公告)号：US20230223322A1

公开(公告)日：2023-07-13

申请号：US17574944

申请日：2022-01-13

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Ko-Wei Chang ,  Wen-Jung Tsai ,  Che-Wei Yu ,  Chia-Yang Chen

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L23/49816 ,  H01L23/3121 ,  H01L24/16 ,  H01L21/4853 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16227 ,  H01L2924/3511 ,  H01L24/73 ,  H01L2224/73204 ,  H01L24/32 ,  H01L2224/32225 ,  H01L25/0652 ,  H01L2225/06517

Abstract: Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.

公开(公告)号：US20230163082A1

公开(公告)日：2023-05-25

申请号：US17571901

申请日：2022-01-10

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Wen-Jung Tsai ,  Chien-Cheng Lin ,  Ko-Wei Chang ,  Yu-Wei Yeh ,  Shun-Yu Chien ,  Chia-Yang Chen

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L23/562 ,  H01L23/49822 ,  H01L23/3121

Abstract: An electronic package is provided in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure is embedded in the packaging layer. Therefore, thermal stress is dispersed through the frame body to avoid warpage of the electronic package, so as to facilitate the arrangement of other electronic components around the electronic component.

公开(公告)号：US11222852B2

公开(公告)日：2022-01-11

申请号：US16573276

申请日：2019-09-17

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/31 ,  H01L21/56 ,  H01Q23/00

Abstract: An electronic package and a method for fabricating the same are provided. The method includes disposing an electronic component on a lower side of a first carrier and forming an encapsulant on an upper side of the first carrier. A first conductor is disposed on the encapsulant and configured for generating radiation energy by an alternating voltage, an alternating current or radiation variation. As such, the electronic package has a reduced thickness and improved antenna efficiency.

公开(公告)号：US20210351097A1

公开(公告)日：2021-11-11

申请号：US17241199

申请日：2021-04-27

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Chiang He ,  Yu-Wei Yeh ,  Chia-Yang Chen ,  Chih-Yi Liao ,  Chih-Hsien Chiu ,  Chang-Chao Su

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L23/498 ,  H01L23/538 ,  H01L21/768

Abstract: An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulation layer encapsulates the electronic component and the conductive elements. The encapsulation layer has concave portions corresponding in position to the conductive elements. Each of the conductive elements is in no contact with corresponding one of the concave portions.