公开(公告)号：US20110140185A1

公开(公告)日：2011-06-16

申请号：US13032009

申请日：2011-02-22

申请人： Asao Nishimura ,  Syouji Syukuri ,  Gorou Kitsukawa ,  Toshio Miyamoto

发明人： Asao Nishimura ,  Syouji Syukuri ,  Gorou Kitsukawa ,  Toshio Miyamoto

IPC分类号： H01L27/06 ,  H01L27/108

CPC分类号： H01L22/32 ,  G01R31/2884 ,  G01R31/31713 ,  H01L2224/02379 ,  H01L2224/0392 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a semiconductor integrated circuit device, testing pads (209b) using a conductive layer, such as relocation wiring layers (205) are provided just above or in the neighborhood of terminals like bonding pads (202b) used only for probe inspection at which bump electrodes (208) are not provided. Similar testing pads may be provided even with respect to terminals like bonding pads provided with bump electrodes. A probe test is executed by using these testing pads or under the combined use of under bump metallurgies antecedent to the formation of the bump electrodes together with the testing pads. According to the above, bump electrodes for pads dedicated for probe testing may not be added owing to the use of the testing pads. Further, the use of testing pads provided in the neighborhood of the terminals like the bonding pads and smaller in size than the under bump metallurgies enables a probe test to be executed after a relocation wiring process.

摘要翻译： 在半导体集成电路器件中，使用诸如重定位布线层（205）的导电层的测试焊盘（209b）位于仅用于探针检查的接合焊盘（202b）的正上方或附近，在这些端子处，凸起电极 （208）。 甚至可以提供类似的测试焊盘相对于诸如具有凸起电极的焊盘的端子。 通过使用这些测试垫或者在与测试垫一起形成凸块电极的组合使用底部凸点冶金来执行探针测试。 根据上述，由于使用了测试垫，因此可能不会添加专用于探针测试的焊盘的凸起电极。 此外，使用设置在诸如接合焊盘的端子附近的测试焊盘并且尺寸小于凸块下的金属，使得能够在重新定位布线处理之后执行探针测试。

公开(公告)号：US20070241330A1

公开(公告)日：2007-10-18

申请号：US11808808

申请日：2007-06-13

申请人： Asao Nishimura ,  Syouji Syukuri ,  Gorou Kitsukawa ,  Toshio Miyamoto

发明人： Asao Nishimura ,  Syouji Syukuri ,  Gorou Kitsukawa ,  Toshio Miyamoto

IPC分类号： H01L23/48

CPC分类号： H01L22/32 ,  G01R31/2884 ,  G01R31/31713 ,  H01L2224/02379 ,  H01L2224/0392 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a semiconductor integrated circuit device, testing pads (209b) using a conductive layer, such as relocation wiring layers (205) are provided just above or in the neighborhood of terminals like bonding pads (202b) used only for probe inspection at which bump electrodes (208) are not provided. Similar testing pads may be provided even with respect to terminals like bonding pads provided with bump electrodes. A probe test is executed by using these testing pads or under the combined use of under bump metallurgies antecedent to the formation of the bump electrodes together with the testing pads. According to the above, bump electrodes for pads dedicated for probe testing may not be added owing to the use of the testing pads. Further, the use of testing pads provided in the neighborhood of the terminals like the bonding pads and smaller in size than the under bump metallurgies enables a probe test to be executed after a relocation wiring process.

摘要翻译： 在半导体集成电路器件中，使用诸如重定位布线层（205）之类的导电层的测试焊盘（209b）位于仅用于探针检查的接合焊盘（202b）的正上方或附近， 凸起电极（208）不被设置。 甚至可以提供类似的测试焊盘相对于诸如具有凸起电极的焊盘的端子。 通过使用这些测试垫或者在与测试垫一起形成凸块电极的组合使用底部凸点冶金来执行探针测试。 根据上述，由于使用了测试垫，因此可能不会添加专用于探针测试的焊盘的凸起电极。 此外，使用设置在诸如接合焊盘的端子附近的测试焊盘并且尺寸小于凸块下的金属，使得能够在重新定位布线处理之后执行探针测试。

公开(公告)号：US07247879B2

公开(公告)日：2007-07-24

申请号：US10873360

申请日：2004-06-23

申请人： Asao Nishimura ,  Syouji Syukuri ,  Gorou Kitsukawa ,  Toshio Miyamoto

发明人： Asao Nishimura ,  Syouji Syukuri ,  Gorou Kitsukawa ,  Toshio Miyamoto

IPC分类号： H01L29/04

CPC分类号： H01L22/32 ,  G01R31/2884 ,  G01R31/31713 ,  H01L2224/02379 ,  H01L2224/0392 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a semiconductor integrated circuit device, testing pads (209b) using a conductive layer, such as relocation wiring layers (205) are provided just above or in the neighborhood of terminals like bonding pads (202b) used only for probe inspection at which bump electrodes (208) are not provided. Similar testing pads may be provided even with respect to terminals like bonding pads provided with bump electrodes. A probe test is executed by using these testing pads or under the combined use of under bump metallurgies antecedent to the formation of the bump electrodes together with the testing pads. According to the above, bump electrodes for pads dedicated for probe testing may not be added owing to the use of the testing pads. Further, the use of testing pads provided in the neighborhood of the terminals like the bonding pads and smaller in size than the under bump metallurgies enables a probe test to be executed after a relocation wiring process.

摘要翻译： 在半导体集成电路器件中，使用诸如重定位布线层（205）之类的导电层的测试焊盘（209b）位于仅用于探针检查的接合焊盘（202b）的正上方或附近， 凸起电极（208）不被设置。 甚至可以提供类似的测试焊盘相对于诸如具有凸起电极的焊盘的端子。 通过使用这些测试垫或者在与测试垫一起形成凸块电极的组合使用底部凸点冶金来执行探针测试。 根据上述，由于使用了测试垫，因此可能不会添加专用于探针测试的焊盘的凸起电极。 此外，使用设置在诸如接合焊盘的端子附近的测试焊盘并且尺寸小于凸块下的金属，使得能够在重新定位布线处理之后执行探针测试。

公开(公告)号：US07138722B2

公开(公告)日：2006-11-21

申请号：US11057495

申请日：2005-02-15

申请人： Toshio Miyamoto ,  Asao Nishimura ,  Koki Noguchi ,  Satoshi Michishita ,  Masashi Horiguchi ,  Masaharu Kubo ,  Kazuyoshi Shiba

发明人： Toshio Miyamoto ,  Asao Nishimura ,  Koki Noguchi ,  Satoshi Michishita ,  Masashi Horiguchi ,  Masaharu Kubo ,  Kazuyoshi Shiba

IPC分类号： H01L23/48

CPC分类号： H01L24/50 ,  H01L23/49572 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L27/10897 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/16245 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12033 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.

公开(公告)号：US07125059B2

公开(公告)日：2006-10-24

申请号：US10798952

申请日：2004-03-12

申请人： Toshio Miyamoto

发明人： Toshio Miyamoto

IPC分类号： B66C1/00

CPC分类号： B25J15/0206

摘要： A hand device for working robot which can be downsized is provided. The device consists of a robot hand 10, a link means 40 and a workpiece drop prevention means. The robot hand 10 includes a hand base 20, a pair of fingers 21, 21 protruding from the hand base 20 and a movable core 25 provided with a cylinder 24. The link means 40 includes a lever and a connecting pad 43 for connecting the lever and the movable core 25. A workpiece drop prevention means 60 includes a protrusion stick 50 which is supported by a supporting rail 51, a coil spring and an air cylinder for recess 53.

摘要翻译： 提供了一种可以减小尺寸的工作机器人的手动装置。 该装置由机械手10，连杆装置40和工件落下预防装置组成。 机械手10包括手基座20，从手基座20突出的一对手指21,21和设置有气缸24的可动铁芯25。 连杆装置40包括杠杆和连接杆43，用于连接杠杆和可动芯25。 工件脱落装置60包括由支撑轨51支撑的突起杆50，螺旋弹簧和用于凹部53的气缸。

公开(公告)号：US06949416B2

公开(公告)日：2005-09-27

申请号：US10765916

申请日：2004-01-29

申请人： Toshio Miyamoto ,  Ichiro Anjo ,  Asao Nishimura ,  Yoshihide Yamaguchi

发明人： Toshio Miyamoto ,  Ichiro Anjo ,  Asao Nishimura ,  Yoshihide Yamaguchi

IPC分类号： H01L23/52 ,  H01L21/3205 ,  H01L21/82 ,  H01L21/822 ,  H01L21/8242 ,  H01L23/12 ,  H01L23/31 ,  H01L23/525 ,  H01L27/04 ,  H01L27/108 ,  H01L27/10

CPC分类号： H01L23/5258 ,  H01L23/3114 ,  H01L27/10814 ,  H01L27/10897 ,  H01L2224/0392 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/04941 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05147 ,  H01L2224/05171

摘要： Disclosed is a technique capable of enhancing the degree of freedom in the layout of a rerouting layer in a wafer level CSP in which defect repairing is performed by cutting a fuse. More specifically, after the defect repairing is performed by irradiating a laser beam to a fuse, an organic passivation layer (photo-sensitive polyimide layer) is filled in a fuse opening. Thereafter, a rerouting layer, a bump land, an uppermost wiring layer, and a solder bump are formed on the organic passivation layer. In the following steps of the defect repairing, the baking process to cure an elastomer layer and the uppermost protection layer is conducted at a temperature below 260° C. in order to prevent the variance of the refresh times of memory cells.

摘要翻译： 公开了一种能够提高晶片级CSP中的重新布线层的布局自由度的技术，其中通过切割熔丝进行缺陷修复。 更具体地，在通过将激光束照射到熔丝进行缺陷修复之后，将有机钝化层（光敏聚酰亚胺层）填充在保险丝开口中。 此后，在有机钝化层上形成重路由层，凸起焊盘，最上布线层和焊料凸块。 在缺陷修复的以下步骤中，在低于260℃的温度下进行固化弹性体层和最上层保护层的烘烤过程，以防止存储单元的更新时间的变化。

公开(公告)号：US06656829B2

公开(公告)日：2003-12-02

申请号：US10331874

申请日：2002-12-31

申请人： Toshio Miyamoto

发明人： Toshio Miyamoto

IPC分类号： H01L2144

CPC分类号： H01L21/2885 ,  H01L21/288 ,  H01L21/76802 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02166 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13016 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/1369 ,  H01L2224/16105 ,  H01L2224/45124 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48

摘要： A laser beam is irradiated onto a photocurable resin layer formed on an electrode part before rearrangement. By scanning the resin on the periphery of a metal wiring formation area extending from the electrode part before rearrangement to a bump electrode contact area, is cured. As a result, a cured resin part is formed which works as a guide layer and a protection film for protecting the metal wire in which the metal wiring formation area has a hollow shape. Thereafter, the metal wire is formed inside the cured resin part.

公开(公告)号：US06611012B2

公开(公告)日：2003-08-26

申请号：US10050950

申请日：2002-01-22

申请人： Toshio Miyamoto ,  Asao Nishimura ,  Koki Noguchi ,  Satoshi Michishita ,  Masashi Horiguchi ,  Masaharu Kubo ,  Kazuyoshi Shiba

发明人： Toshio Miyamoto ,  Asao Nishimura ,  Koki Noguchi ,  Satoshi Michishita ,  Masashi Horiguchi ,  Masaharu Kubo ,  Kazuyoshi Shiba

IPC分类号： H01L25065

CPC分类号： H01L24/50 ,  H01L23/49572 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L27/10897 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/16245 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12033 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.

公开(公告)号：US06531768B2

公开(公告)日：2003-03-11

申请号：US09951981

申请日：2001-09-14

申请人： Toshio Miyamoto

发明人： Toshio Miyamoto

IPC分类号： H01L2324

CPC分类号： H01L21/2885 ,  H01L21/288 ,  H01L21/76802 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02166 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13016 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/1369 ,  H01L2224/16105 ,  H01L2224/45124 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48

摘要： A laser beam is irradiated onto a photocurable resin layer formed on an electrode part before rearrangement. By scanning the resin on the periphery of a metal wiring formation area extending from the electrode part before rearrangement to a bump electrode contact area, is cured. As a result, a cured resin part is formed which works as a guide layer and a protection film for protecting the metal wire in which the metal wiring formation area has a hollow shape. Thereafter, the metal wire is formed inside the cured resin part.

摘要翻译： 在重排之前，将激光束照射到形成在电极部上的光固化树脂层上。 通过扫描在重排之前从电极部分延伸到凸块电极接触区域的金属布线形成区域的周边上的树脂被固化。 结果，形成了用作引导层的固化树脂部分和用于保护金属布线形成区域具有中空形状的金属线的保护膜。 此后，金属线形成在固化树脂部分的内部。

公开(公告)号：US5707002A

公开(公告)日：1998-01-13

申请号：US669984

申请日：1996-06-21

申请人： Toshio Miyamoto ,  Takahiro Inoue ,  Masahiro Goto ,  Koichi Suwa

发明人： Toshio Miyamoto ,  Takahiro Inoue ,  Masahiro Goto ,  Koichi Suwa

IPC分类号： B65D27/00

CPC分类号： B65D27/00

摘要： The present invention provides an envelope comprising an envelope body including a pair of sheet-shaped constructural pieces which provide a front surface and a back surface, respectively, and are connected to each other to form an opening at at least one side, and a fixing portion for preventing relative movement between the pair of sheet-shaped constructural pieces in a facial direction.

摘要翻译： 本发明提供一种封套，其包括一个包封体，该封套主体包括一对片状结构件，它们分别提供一个前表面和一个后表面，并且彼此连接以在至少一个侧面形成开口，并且固定 部分，用于防止一对片状结构件在面部方向上的相对运动。