摘要:
A main package includes a plurality of stacked semiconductor chips and a plurality of first terminals associated with different ones of the semiconductor chips. An additional package includes an additional semiconductor chip and at least one second terminal electrically connected to the additional semiconductor chip. The additional semiconductor chip is to substitute for one of the plurality of semiconductor chips in the main package. The main package and the additional package are arranged in one of a plurality of relative positional relationships that is selected according to which one of the plurality of semiconductor chips in the main package is to be substituted with the additional semiconductor chip.
摘要:
A layered chip package includes a main body and wiring. The main body has a main part. The main part has a top surface and a bottom surface and includes a plurality of layer portions that are stacked. The wiring includes a plurality of lines passing through all the plurality of layer portions. Each layer portion includes a semiconductor chip and a plurality of electrodes. The semiconductor chip has a first surface, and a second surface opposite thereto. The plurality of electrodes are disposed on a side of the first surface of the semiconductor chip. The plurality of layer portions include two or more pairs of first and second layer portions in each of which the first and second layer portions are arranged so that the first or second surfaces of the respective semiconductor chips face each other. The plurality of electrodes include a plurality of first connection parts and a plurality of second connection parts. In the first layer portion, the plurality of first connection parts are in contact with the plurality of lines. In the second layer portion, the plurality of second connection parts are in contact with the plurality of lines.
摘要:
A memory device has a laminated chip package and a controller plate. In the laminated chip package, a plurality of memory chips are laminated. An interposed chip is laminated between the laminated chip package and the controller plate. A plurality of opposing wiring electrodes are formed at an opposing surface of the controller plate. A plurality of outside wiring electrodes are formed on the rear side of the opposing surface. Connection electrodes connecting the opposing wiring electrodes and the outside wiring electrodes are formed on the side surface of the controller plate. The interposed chip has a plurality of interposed wiring electrodes. The plurality of interposed wiring electrodes are formed with a common arrangement pattern common with an arrangement pattern of the plurality of opposing wiring electrodes. The controller plate is laid on the interposed chip.
摘要:
A thermally assisted magnetic head is formed by performing a head forming process, a mounting part forming process and a light source mounting process in that order. In the head forming process, a planned area is secured on a light source placing surface of a slider substrate, then a magnetic head part is formed on a head area other than the planned area and a spacer for securing a mounting space for the laser diode is formed on the planned area. In the mounting part forming process, a light source mounting part is formed by removing the spacer. In the light source mounting process, a laser diode is mounted on the light source mounting part formed by the mounting part forming step.
摘要:
A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including first and second layer portions; and a plurality of first and second terminals that are disposed on the top and bottom surfaces of the main part, respectively, and are electrically connected to the plurality of wires. The first and second terminals are formed by using electrodes of the first and second layer portions. The layered chip package is manufactured by fabricating a layered substructure by stacking two substructures each of which includes an array of a plurality of preliminary layer portions, and then cutting the layered substructure. The layered substructure includes a plurality of preliminary wires that are disposed between two adjacent pre-separation main bodies and are to become the plurality of wires.
摘要:
A magnetic head includes a coil, a main pole, a write shield, and a return path section. The coil includes a coil element located on the trailing side of the main pole. The coil element has a front end face facing toward the medium facing surface. The return path section includes a first portion, a second portion, and an intermediate film interposed between the first portion and the second portion. Part of the first portion is interposed between the medium facing surface and the front end face of the coil element. Part of the second portion is interposed between the first portion and the front end face of the coil element.
摘要:
A return path section includes first and second yoke portions and first, second and third columnar portions. The first and second yoke portions and the first columnar portion are located on the front side in the direction of travel of a recording medium relative to a waveguide core. The second and third columnar portions are located on opposite sides of a plasmon generator and connected to a shield. The first yoke portion connects a main pole to the first columnar portion. The second yoke portion connects the first columnar portion to the second and third columnar portions. A coil is wound around the first columnar portion. A heater and an expansion layer are located on the rear side in the direction of travel of the recording medium relative to the core.
摘要:
A magnetic head includes a medium facing surface, a read head unit, a write head unit, and a protrusion device. The protrusion device causes part of the medium facing surface to protrude toward a recording medium. The read head unit has a first end face located in the medium facing surface and includes a first contact sensor for detecting contact of the first end face with the recording medium. The write head unit has a second end face located in the medium facing surface and includes a second contact sensor for detecting contact of the second end face with the recording medium. The first end face and the second end face are located at positions different from each other in a direction of travel of the recording medium.
摘要:
A method of manufacturing a magnetic head includes the step of forming an accommodation part and the step of forming a return path section. The return path section lies between a main pole and a top surface of a substrate, and connects a shield and part of the main pole away from a medium facing surface to each other so that a space through which part of a coil passes is defined. The accommodation part accommodates at least part of the return path section. The step of forming the return path section forms first to third portions simultaneously. The first portion is located closer to the top surface of the substrate than is the space. The second portion is located closer to the medium facing surface than is the space. The third portion is located farther from the medium facing surface than is the space.
摘要:
A magnetic head includes a coil, a main pole, a write shield, a first insulating film, and a second insulating film. The coil includes a specific coil element. The main pole has a top surface including an inclined surface portion and a flat surface portion. The write shield includes an inclined portion. The inclined portion includes a first portion opposed to the inclined surface portion, and a second portion located farther from a medium facing surface than the first portion. The specific coil element includes an interposition part interposed between the flat surface portion and the second portion. The first insulating film is interposed between the inclined surface portion and the first portion of the inclined portion, and between the interposition part and the second portion of the inclined portion. The second insulating film is interposed between the first insulating film and the second portion of the inclined portion.