公开(公告)号：US11911964B2

公开(公告)日：2024-02-27

申请号：US15337779

申请日：2016-10-28

Applicant: Seurat Technologies, Inc.

Inventor： James A. DeMuth ,  Erik Toomre ,  Francis L. Leard ,  Kourosh Kamshad ,  Heiner Fees ,  Eugene Berdichevsky

IPC: B29C64/264 ,  B29C64/153 ,  B33Y10/00 ,  B33Y40/00 ,  B33Y50/02 ,  B33Y70/00 ,  B33Y80/00 ,  B33Y99/00 ,  B23K26/12 ,  B23K26/142 ,  B23K26/144 ,  B23K26/70 ,  B29C64/386 ,  B29C64/268 ,  B22F3/24 ,  B23K15/00 ,  B23K15/06 ,  B23K26/03 ,  B23K26/08 ,  B23K26/16 ,  B23K26/36 ,  B23K37/04 ,  B25J11/00 ,  G02B7/14 ,  G02B7/16 ,  G02B7/182 ,  G02B15/04 ,  G02B15/10 ,  G02B19/00 ,  G02F1/01 ,  G02F1/1333 ,  G02F1/135 ,  G05B17/02 ,  H01S5/40 ,  B22F10/00 ,  H01S5/00 ,  B22F12/33 ,  B22F12/44 ,  B22F12/70 ,  B22F12/00 ,  G02B27/10 ,  B22F10/28 ,  B22F10/70 ,  B22F12/30 ,  B22F12/88 ,  B22F12/90 ,  B22F10/34 ,  B22F10/36 ,  G02B26/08 ,  B23K26/00 ,  B23K26/082 ,  B23K101/00 ,  B23K101/24 ,  B23K103/00 ,  B23K101/02 ,  B29K105/00 ,  G02B27/28 ,  G07C3/14 ,  B22F10/73 ,  B22F12/17 ,  B22F12/20 ,  B22F12/41 ,  B22F12/45 ,  B22F12/53 ,  B22F10/47 ,  B22F10/32 ,  B22F10/50 ,  B22F10/64 ,  B22F10/10 ,  B33Y30/00 ,  B23K26/342 ,  B28B1/00 ,  G02B27/09 ,  G02B27/14 ,  G02B27/00

CPC classification number: B29C64/264 ,  B22F3/24 ,  B22F10/00 ,  B22F10/28 ,  B22F10/34 ,  B22F10/36 ,  B22F10/70 ,  B22F12/00 ,  B22F12/226 ,  B22F12/30 ,  B22F12/33 ,  B22F12/38 ,  B22F12/44 ,  B22F12/70 ,  B22F12/88 ,  B22F12/90 ,  B23K15/002 ,  B23K15/0006 ,  B23K15/0013 ,  B23K15/0026 ,  B23K15/0093 ,  B23K15/06 ,  B23K26/03 ,  B23K26/032 ,  B23K26/083 ,  B23K26/0846 ,  B23K26/123 ,  B23K26/127 ,  B23K26/1224 ,  B23K26/142 ,  B23K26/144 ,  B23K26/16 ,  B23K26/36 ,  B23K26/702 ,  B23K26/703 ,  B23K26/704 ,  B23K37/0426 ,  B25J11/00 ,  B29C64/153 ,  B29C64/268 ,  B29C64/386 ,  B33Y10/00 ,  B33Y40/00 ,  B33Y50/02 ,  B33Y70/00 ,  B33Y80/00 ,  B33Y99/00 ,  G02B7/14 ,  G02B7/16 ,  G02B7/1827 ,  G02B15/04 ,  G02B15/10 ,  G02B19/0028 ,  G02B19/0047 ,  G02B26/0816 ,  G02B27/108 ,  G02F1/0136 ,  G02F1/135 ,  G02F1/133362 ,  G05B17/02 ,  H01S5/005 ,  H01S5/4012 ,  B22F10/10 ,  B22F10/32 ,  B22F10/47 ,  B22F10/50 ,  B22F10/64 ,  B22F10/73 ,  B22F12/17 ,  B22F12/20 ,  B22F12/222 ,  B22F12/41 ,  B22F12/45 ,  B22F12/53 ,  B22F2003/247 ,  B22F2003/248 ,  B22F2998/10 ,  B22F2999/00 ,  B23K15/0086 ,  B23K26/0006 ,  B23K26/082 ,  B23K26/342 ,  B23K37/0408 ,  B23K2101/001 ,  B23K2101/008 ,  B23K2101/02 ,  B23K2101/24 ,  B23K2103/00 ,  B23K2103/42 ,  B23K2103/50 ,  B28B1/001 ,  B29K2105/251 ,  B33Y30/00 ,  G02B27/0068 ,  G02B27/0905 ,  G02B27/141 ,  G02B27/283 ,  G02B27/286 ,  G05B2219/49023 ,  G07C3/146 ,  Y02P10/25 ,  Y02P80/40 ,  B22F2999/00 ,  B22F10/00 ,  B22F2203/03 ,  B22F2999/00 ,  B22F12/41 ,  B22F2203/03 ,  B22F2999/00 ,  B22F10/20 ,  B22F2203/03

Abstract: A method and an apparatus for collecting a powdered material after a print job in powder bed fusion additive manufacturing may involve a build platform supporting a powder bed capable of tilting, inverting, and shaking to separate the powder bed substantially from the build platform in a hopper. The powdered material may be collected in a hopper for reuse in later print jobs. The powder collecting process may be automated to increase efficiency of powder bed fusion additive manufacturing.

公开(公告)号：US11911849B2

公开(公告)日：2024-02-27

申请号：US16513467

申请日：2019-07-16

Applicant: SUBARU CORPORATION

Inventor： Mayu Nakano

IPC: B23K26/356 ,  B23K26/146 ,  B23K26/14 ,  C21D10/00 ,  B23K26/00

CPC classification number: B23K26/356 ,  B23K26/146 ,  B23K26/1476 ,  C21D10/005 ,  B23K26/0006

Abstract: According to one implementation, a laser peening processing apparatus includes: a laser oscillator; and a nozzle. The laser oscillator oscillates a laser light. The nozzle focuses the laser light and irradiates a surface to be processed of a workpiece with the focused laser light while flowing a liquid toward the surface to be processed. A straightening part that straightens a flow of the liquid is disposed on the nozzle. Furthermore, according to one implementation, a laser peening processing method includes: oscillating a laser light; manufacturing a product or a semi-product by focusing the laser light and irradiating a surface to be processed of a workpiece with the focused laser light toward while flowing a liquid on the surface; and straightening the liquid using a straightening structure.

公开(公告)号：US11904405B2

公开(公告)日：2024-02-20

申请号：US17665788

申请日：2022-02-07

Applicant: Raytheon Technologies Corporation

Inventor： Vijay Narayan Jagdale ,  Jesse R. Boyer ,  Om P. Sharma ,  Evan J. Butcher ,  Lawrence Binek ,  Bryan G. Dods

IPC: F01D25/24 ,  B23K26/00 ,  B22F10/25 ,  B22F10/38 ,  B33Y10/00 ,  B33Y80/00 ,  B22F10/366

CPC classification number: B23K26/0006 ,  B22F10/25 ,  B22F10/38 ,  F01D25/24 ,  B22F10/366 ,  B33Y10/00 ,  B33Y80/00 ,  F05D2230/22 ,  F05D2230/30 ,  F05D2250/181 ,  F05D2250/63

Abstract: A process for additively controlled surface features of a gas turbine engine casing. The process comprises forming the casing having an inner surface and an outer surface opposite the inner surface; forming a surface feature on the casing proximate the inner surface, wherein the surface feature comprises a structure on the inner surface configured to align or misalign with respect to a flow direction of a working fluid in a flow path of the casing.

公开(公告)号：US11883903B2

公开(公告)日：2024-01-30

申请号：US16320585

申请日：2017-07-25

Applicant: AMPLITUDE SYSTEMES ,  CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE ,  UNIVERSITE DE BORDEAUX ,  ALPHANOV INSTITUT D'OPTIQUE D'AQUITAINE

Inventor： Konstantin Mishchik ,  John Lopez ,  Rainer Kling ,  Clémentine Javaux-Leger ,  Guillaume Duchateau ,  Ophélie Dematteo-Caulier

IPC: B23K26/0622 ,  B33Y10/00 ,  B33Y30/00 ,  B23K26/359 ,  B23K26/53 ,  B23K26/00 ,  B23K26/06 ,  B23K26/067 ,  G02B5/00 ,  G02B19/00 ,  G02B27/09 ,  G02B27/14 ,  B23K26/38 ,  B23K103/00

CPC classification number: B23K26/0624 ,  B23K26/0006 ,  B23K26/0643 ,  B23K26/0652 ,  B23K26/0676 ,  B23K26/359 ,  B23K26/38 ,  B23K26/53 ,  B33Y10/00 ,  B33Y30/00 ,  G02B5/001 ,  G02B19/0047 ,  G02B27/0927 ,  G02B27/14 ,  B23K2103/50

Abstract: Disclosed is a method for cutting dielectric or semiconducting material with a laser. The method includes the following steps: emission of a laser beam including at least one burst of N femtoseconds laser pulses; spatial separation of the laser beam into a first split beam having a first energy, and respectively, a second split beam having a second energy; spatial concentration of energy of the first split beam in a first zone of the material, respectively, of the second split beam in a second zone of the material, the first zone and the second zone being separate and staggered by a distance dx; and adjustment of the distance between the first zone and the second zone in such a way as to initiate a straight micro-fracture oriented between the first zone and the second zone.

公开(公告)号：US20240018031A1

公开(公告)日：2024-01-18

申请号：US18254369

申请日：2021-11-25

Applicant: HOYA CORPORATION

Inventor： Shuhei AZUMA

IPC: C03B33/08 ,  C03C17/00 ,  B23K26/00 ,  B23K26/354 ,  B24B7/24 ,  G11B5/84

CPC classification number: C03B33/082 ,  C03C17/002 ,  B23K26/0006 ,  B23K26/354 ,  B24B7/241 ,  G11B5/84 ,  C03C2218/31

Abstract: In a method for manufacturing a glass plate that includes chamfering processing for chamfering an edge surface of a glass plate, the chamfering processing includes a step of forming a chamfered surface by irradiating the edge surface of the glass plate with a laser beam, and a step of heating the glass plate before the chamfered surface is formed. When a temperature of the glass blank at which the glass blank is heated is Tp [° C.], a glass transition point of the glass blank is Tg [° C.], and an average coefficient of linear thermal expansion of the glass blank is α [1/° C.], (Tg−Tp)≤−5.67×107·α+840 is satisfied.

公开(公告)号：US20240009759A1

公开(公告)日：2024-01-11

申请号：US18369892

申请日：2023-09-19

Applicant: RENDYR, INC.

Inventor： Kaelum HASLER ,  Martin ANGST ,  Reid HOLBERT ,  Bradley TURNER

IPC: B23K26/00 ,  B23K26/08 ,  B23K26/38

CPC classification number: B23K26/0096 ,  B23K26/0876 ,  B23K26/38

Abstract: A CNC machine includes a lower body; an upper body that extends from the lower body and is movably attached to the lower body; a tool that is movably attached to the upper body; and a flexible mat that is attached to the lower body. The tool may be a laser generator with the flexible mat resistant to the laser beam. The flexible mat has at least one orientation such that an outer periphery of the flexible mat is greater than the full extent of range of motion of the tool. The upper body may be connected to the lower body by a pivot mechanism configured to allow the upper body to pivot from a first position to a second position and to rotationally fix the upper body relative to the lower body in the second position, with the first and second positions being ninety degrees apart.

公开(公告)号：US20240001483A1

公开(公告)日：2024-01-04

申请号：US18252481

申请日：2021-11-26

Applicant: AGC GLASS EUROPE ,  AGC INC. ,  AGC FLAT GLASS NORTH AMERICA, INC. ,  AGC VIDROS DO BRASIL LTDA

Inventor： Eric MORGANTE

IPC: B23K26/00 ,  B23K26/352 ,  B23K26/362 ,  B23K26/402 ,  B23K26/70

CPC classification number: B23K26/0096 ,  B23K26/352 ,  B23K26/362 ,  B23K26/402 ,  B23K26/706 ,  B23K2103/172

Abstract: An improved laser apparatus, inscribed in a parallelepiped rectangle R defined by a longitudinal axis, X, a vertical axis, Y defining a plane P and a lateral axis, Z, including a mounting means to mount the laser apparatus on a window, preferably a multi-glazed window, mounted in situ. The laser apparatus also includes a laser device generating a laser beam to treat a surface of the window, an orientation means able to orientate the laser beam defining a maximum decoatable surface WSm on the coated surface and a housing including an aperture to let the laser beam going out of the housing. The laser apparatus includes a skirt at least partially surrounding the aperture where the skirt is opaque to the laser beam. A related method is also described.

公开(公告)号：US11854889B2

公开(公告)日：2023-12-26

申请号：US16929542

申请日：2020-07-15

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Michael J. Seddon

IPC: H01L21/78 ,  H01L21/268 ,  H01L21/02 ,  H01L21/304 ,  H01L21/683 ,  H01L23/544 ,  B23K26/53 ,  B23K26/00 ,  B23K101/40

CPC classification number: H01L21/78 ,  H01L21/02076 ,  H01L21/268 ,  H01L21/3043 ,  H01L21/6836 ,  H01L23/544 ,  B23K26/0006 ,  B23K26/53 ,  B23K2101/40 ,  H01L2223/5446

Abstract: Implementations of methods of forming a plurality of semiconductor die may include forming a damage layer beneath a surface of a die street in a semiconductor substrate, singulating the semiconductor substrate along the die street into a plurality of semiconductor die, and removing one or more particulates in the die street after singulating through applying sonic energy to the plurality of semiconductor die.

公开(公告)号：US20230409855A1

公开(公告)日：2023-12-21

申请号：US18240104

申请日：2023-08-30

Applicant: EllansaLabs Inc.

Inventor： Omar Besim HAKIM

IPC: G06K7/14 ,  B23K26/00 ,  A44C17/00 ,  B23K26/362

CPC classification number: G06K7/1417 ,  B23K26/0006 ,  G06K7/1413 ,  A44C17/00 ,  B23K26/362 ,  G01N21/87

Abstract: A gemstone including: a table defining a first area; a culet defining a second area with a size equal to a size of the first area; and a scanable indicia positioned in the gemstone between the table and the culet.

公开(公告)号：US20230405723A1

公开(公告)日：2023-12-21

申请号：US18197759

申请日：2023-05-16

Applicant: SINTOKOGIO, LTD.

Inventor： Yuta SAITO ,  Yuji KOBAYASHI

IPC: B23K26/356 ,  B23K26/00 ,  B23K26/073

CPC classification number: B23K26/356 ,  B23K26/0732 ,  B23K26/0006

Abstract: A method for machining a tool includes applying compressive residual stress to the tool by laser peening using a pulsed laser. The tool includes a base material and a coating layer that covers at least a portion of a surface of the base material. In the applying, the compressive residual stress is applied to the tool such that a difference in compressive residual stress at an interface between the base material and the coating layer is at most 100 MPa.