公开(公告)号：US09887196B2

公开(公告)日：2018-02-06

申请号：US14583842

申请日：2014-12-29

Applicant: International Business Machines Corporation ,  GlobalFoundries, Inc. ,  STMicroelectronics, Inc.

Inventor： Xiuyu Cai ,  Qing Liu ,  Ruilong Xie ,  Chun-chen Yeh

IPC: H01L27/092 ,  H01L29/10 ,  H01L27/12 ,  H01L21/84 ,  H01L29/165 ,  H01L21/308 ,  H01L21/8238 ,  H01L29/16 ,  H01L29/06 ,  H01L21/033 ,  H01L29/78

CPC classification number: H01L27/0924 ,  H01L21/0338 ,  H01L21/3086 ,  H01L21/3088 ,  H01L21/823807 ,  H01L21/823821 ,  H01L21/845 ,  H01L27/0922 ,  H01L27/1211 ,  H01L29/0684 ,  H01L29/1054 ,  H01L29/16 ,  H01L29/165 ,  H01L29/7849

Abstract: A semiconductor substrate includes a bulk substrate layer that extends along a first axis to define a width and a second axis perpendicular to the first axis to define a height. A plurality of hetero semiconductor fins includes an epitaxial material formed on a first region of the bulk substrate layer. A plurality of non-hetero semiconductor fins is formed on a second region of the bulk substrate layer different from the first region. The non-hetero semiconductor fins are integrally formed from the bulk substrate layer such that the material of the non-hetero semiconductor fins is different from the epitaxial material.

公开(公告)号：US09871669B2

公开(公告)日：2018-01-16

申请号：US14559779

申请日：2014-12-03

Applicant: STMicroelectronics, Inc.

Inventor： Oleg Logvinov ,  Bo Zhang ,  Huijuan Liu ,  Michael John Macaluso ,  James D. Allen

IPC: H04L12/18 ,  H04L12/40 ,  H04L29/08 ,  H04B3/54 ,  B60R16/023

CPC classification number: H04L12/1886 ,  B60R16/023 ,  H04B3/542 ,  H04L12/1863 ,  H04L12/1881 ,  H04L12/40 ,  H04L12/40032 ,  H04L67/12 ,  H04L2012/40215 ,  H04L2012/40273

Abstract: An embodiment is a powerline communications (PLC) apparatus including a communications interface that implements a first communication protocol including of a transceiver that communicates over an electrical power distribution wiring of a vehicle. The first communication protocol includes a powerline communications automotive network (PLCAN) delimiter type (DT) (PLCAN-DT), and a PLCAN variant length field in a frame control comprising payload length, a number of symbols used, a PHY block size, and a number of repetitions used, wherein broadcast addressing is used in the network to transmit messages.

公开(公告)号：US09870535B2

公开(公告)日：2018-01-16

申请号：US15074188

申请日：2016-03-18

Applicant: STMicroelectronics, Inc. ,  STMicroelectronics International N.V.

Inventor： Mahesh Chowdhary ,  Arun Kumar ,  Ghanapriya Singh ,  Kashif R. J. Meer ,  Indra Narayan Kar ,  Rajendar Bahl

IPC: G01D1/00 ,  G06F15/00 ,  G06M11/04 ,  G06N7/00 ,  G06F17/30

CPC classification number: G06N7/005 ,  G06F17/30477

Abstract: An electronic device described herein includes a sensing unit having at least one sensor to acquire sensing data. An associated computing device extracts sensor specific features from the sensing data, and generates a motion activity vector, a voice activity vector, and a spatial environment vector as a function of the sensor specific features. The motion activity vector, voice activity vector, and spatial environment vector are processed to determine a base level context of the electronic device relative to its surroundings, with the base level context having aspects each based on the motion activity vector, voice activity vector, and spatial environment vector. Meta level context of the electronic device relative to its surroundings is determined as a function of the base level context, with the meta level context being at least one inference made from at least two aspects of the plurality of aspects of the base level context.

公开(公告)号：US20170351336A1

公开(公告)日：2017-12-07

申请号：US15616602

申请日：2017-06-07

Applicant: STMicroelectronics, Inc.

Inventor： Xiaoyong Yang ,  Darin K. Winterton

IPC: G06F3/01 ,  G06F3/041 ,  H04N5/232 ,  G06F3/03 ,  G06F3/0488 ,  H04N5/225 ,  H04N5/247 ,  H04W88/02

CPC classification number: G06F3/017 ,  G06F3/041 ,  G06F3/0416 ,  G06F2203/04108 ,  H04N5/232 ,  H04N5/23212 ,  H04N5/23216 ,  H04W88/02

Abstract: A device includes a time-of-flight sensor configured to transmit an optical pulse signal and to receive a return optical pulse signal corresponding to a portion of the transmitted optical pulse signal that has reflected off an object within a field of view of the time-of-flight sensor. The time-of-flight sensor generates a range estimation signal including a distance to the object and a signal amplitude indicating an amplitude of the return optical pulse signal. A controller is coupled to the time of flight sensor and is configured to process the range estimation signal over time to detect an input gesture based upon the signal amplitude and estimated distance.

公开(公告)号：US09838963B2

公开(公告)日：2017-12-05

申请号：US15365600

申请日：2016-11-30

Applicant: STMICROELECTRONICS, INC.

Inventor： Liwen Chu ,  George A. Vlantis

IPC: H04W52/02 ,  H04W8/22 ,  H04W84/12 ,  H04W88/08 ,  H04W88/02

CPC classification number: H04W52/0209 ,  H04W8/22 ,  H04W52/0206 ,  H04W52/0216 ,  H04W52/0222 ,  H04W52/0229 ,  H04W84/12 ,  H04W88/02 ,  H04W88/08 ,  Y02D70/00 ,  Y02D70/142

Abstract: A IEEE 802.11 Wireless Local Area Network (WLAN) system of an access point (AP) and one or more stations (STAs) reduces power consumption and increases battery life of power efficient low power STAs by decreasing the amount of time that a power efficient low power STA remains in an awake state. After indicating power efficient low power operation during association with an AP supporting such operation, the power efficient low power STA may enter the doze state from the time that the power efficient low power STA sends a PS-Poll until the power efficient low power STA receives the buffered DATA frame from the AP. While implementing the power efficient PS-Poll method, the AP can send the buffered DATA frame to the STA SIFS after the AP sends an ACK to the received PS-Poll from the STA.

公开(公告)号：US09825055B2

公开(公告)日：2017-11-21

申请号：US14802996

申请日：2015-07-17

Applicant: STMicroelectronics, Inc.

Inventor： John H. Zhang

IPC: H01L21/04 ,  H01L27/12 ,  H01L29/66 ,  H01L27/11 ,  H01L27/092 ,  H01L29/161 ,  H01L29/78 ,  H01L23/528 ,  H01L27/112 ,  H01L21/84

CPC classification number: H01L27/1211 ,  H01L21/266 ,  H01L21/823814 ,  H01L21/823821 ,  H01L21/823828 ,  H01L21/823871 ,  H01L21/845 ,  H01L23/528 ,  H01L27/0924 ,  H01L27/1104 ,  H01L27/1108 ,  H01L27/11213 ,  H01L29/0649 ,  H01L29/161 ,  H01L29/66795 ,  H01L29/7831 ,  H01L29/7838 ,  H01L29/7849 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Single gate and dual gate FinFET devices suitable for use in an SRAM memory array have respective fins, source regions, and drain regions that are formed from portions of a single, contiguous layer on the semiconductor substrate, so that STI is unnecessary. Pairs of FinFETs can be configured as dependent-gate devices wherein adjacent channels are controlled by a common gate, or as independent-gate devices wherein one channel is controlled by two gates. Metal interconnects coupling a plurality of the FinFET devices are made of a same material as the gate electrodes. Such structural and material commonalities help to reduce costs of manufacturing high-density memory arrays.

公开(公告)号：US09824979B2

公开(公告)日：2017-11-21

申请号：US14982018

申请日：2015-12-29

Applicant: STMICROELECTRONICS, INC.

Inventor： Godfrey Dimayuga ,  Frederick Arellano ,  Michael Tabiera

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/3128 ,  H01L24/43 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48249 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/32245 ,  H01L2224/48247

Abstract: An electronic package includes a substrate having opposing first and second surfaces. Conductive areas are on a first surface of the substrate and include at least one edge conductive area. A plurality of conductive bumps are on the second surface of the substrate and coupled to respective ones of the conductive areas. An integrated circuit (IC) is carried by the substrate. Bond wires are coupled between the IC and respective ones of the conductive areas. An encapsulating material is over the IC and adjacent portions of the substrate. A conductive layer is on the encapsulating material, and at least one conductive body is coupled between the at least one edge conductive area and the conductive layer.

公开(公告)号：US09818675B2

公开(公告)日：2017-11-14

申请号：US14674069

申请日：2015-03-31

Applicant: STMICROELECTRONICS, INC.

Inventor： Jefferson Talledo ,  Ela Mia Cadag

IPC: H01L23/495 ,  H01L23/31

CPC classification number: H01L23/49513 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49555 ,  H01L23/49562 ,  H01L2224/37599 ,  H01L2224/40 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/37099

Abstract: An integrated circuit (IC) device may include a leadframe and an IC die having a first surface coupled to the lead frame and a second surface opposite the first surface. The IC device may further include a conductive clip including a first portion coupled to the second surface of the IC die, a second portion coupled to the first portion and extending laterally away from the IC die, and at least one flexible lead coupled to the second portion and looping back under the second portion toward the leadframe. Furthermore, a package may be over the leadframe, IC die, and conductive clip and have an opening therein exposing the at least one flexible lead.

公开(公告)号：US09791568B2

公开(公告)日：2017-10-17

申请号：US14587130

申请日：2014-12-31

Applicant: STMICROELECTRONICS, INC.

Inventor： John Bloomfield ,  Kenneth Weiner

IPC: G01S17/32 ,  G01S17/88 ,  H01L31/107 ,  H01S5/183 ,  H01S5/30 ,  B65H26/08 ,  G01S17/08 ,  B65H23/182 ,  B65H23/195

CPC classification number: G01S17/32 ,  B65H23/1825 ,  B65H23/1955 ,  B65H26/08 ,  B65H2403/942 ,  B65H2511/142 ,  B65H2553/412 ,  B65H2557/512 ,  G01S17/08 ,  G01S17/88 ,  H01L31/107 ,  H01S5/183 ,  H01S5/3013 ,  B65H2220/03

Abstract: A sensing device is for sensing an outer surface of a roll of material. An infrared (IR) laser source is configured to direct IR laser radiation to the outer surface of the roll of material. A single photon avalanche diode (SPAD) detector is configured to receive reflected IR laser radiation from the outer surface of the roll of material. A controller is coupled to the IR laser source and the SPAD detector to determine a distance to the outer surface of the roll of material based upon a time-of-flight of the IR laser radiation.

公开(公告)号：US09761538B1

公开(公告)日：2017-09-12

申请号：US15068752

申请日：2016-03-14

Applicant: STMICROELECTRONICS, INC

Inventor： Rennier Rodriguez ,  Frederick Arellano ,  Aiza Marie Agudon

IPC: H01L21/78 ,  H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L21/4814 ,  H01L21/561 ,  H01L21/78 ,  H01L23/29 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/81

Abstract: A method for making shielded integrated circuit (IC) packages includes providing spaced apart IC dies carried by a substrate and covered by a common encapsulating material, and cutting through the common encapsulating material between adjacent IC dies to define spaced apart IC packages carried by the substrate. An electrically conductive layer is positioned over the spaced apart IC packages and fills spaces between adjacent IC packages. The method further includes cutting through the electrically conductive layer between adjacent IC packages and through the substrate to form the shielded IC packages.