公开(公告)号：US20240198460A1

公开(公告)日：2024-06-20

申请号：US18555829

申请日：2022-04-14

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Ranjit PANDHER ,  Niveditha NAGARAJAN ,  Girard SIDONE ,  Carl BILGRIEN

IPC: B23K35/02 ,  B23K1/19 ,  B23K35/26 ,  B23K35/30

CPC classification number: B23K35/0238 ,  B23K1/19 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/3093

Abstract: A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.

公开(公告)号：US20230340642A1

公开(公告)日：2023-10-26

申请号：US18215929

申请日：2023-06-29

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Md Hasnine ,  Lik Wai Kho

IPC: C22C13/00 ,  B23K35/26 ,  C22C13/02

CPC classification number: C22C13/00 ,  B23K35/262 ,  C22C13/02 ,  B23K35/0244

Abstract: A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, titanium, and antimony. The alloy may further comprise antimony, nickel, or both. The silver may be present in an amount from about 3.1% to 3.8% by weight of the solder. The copper may be present in an amount from about 0.5% to 0.8% by weight of the solder. The bismuth may be present in an amount from about 0.0% (or 1.5%) to about 3.2% by weight of the solder. The cobalt may be present in an amount from about 0.03% to about 1.0% (or 0.05%) by weight of the solder. The titanium may be present in an amount from about 0.005% to about 0.02% by weight of the solder. The antimony may be present in an amount between about 1.0% to about 3.0% by weight of the solder. The balance of the solder is tin.

公开(公告)号：US20230330788A1

公开(公告)日：2023-10-19

申请号：US18205590

申请日：2023-06-05

Applicant: Alpha Assembly Solutions Inc.

Inventor： Pritha Choudhury ,  Morgana De Avila Ribas ,  Sutapa Mukherjee ,  Anil Kumar ,  Siuli Sarkar ,  Ranjit Pandher ,  Ravi Bhatkal ,  Bawa Singh

IPC: B23K35/02 ,  B23K1/012 ,  B23K1/005 ,  B23K35/26 ,  B23K1/08 ,  B23K1/00 ,  H05K3/34 ,  C22C13/02 ,  B23K1/20 ,  B23K1/002 ,  B23K1/19 ,  C22C13/00

CPC classification number: B23K35/262 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0056 ,  B23K1/012 ,  B23K1/085 ,  B23K1/19 ,  B23K1/203 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  C22C13/00 ,  C22C13/02 ,  H05K3/3457 ,  H05K3/3463 ,  B23K2103/12 ,  Y10T403/479

Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt.% of silver, 2.5 to 4 wt.% of bismuth, 0.3 to 0.8 wt.% of copper, 0.03 to 1 wt.% nickel, 0.005 to 1 wt.% germanium, and a balance of tin, together with any unavoidable impurities.

公开(公告)号：US20230287232A1

公开(公告)日：2023-09-14

申请号：US18113812

申请日：2023-02-24

Applicant: Alpha Assembly Solutions Inc. ,  MacDermid Autotype Limited

Inventor： Nirmalya Kumar CHAKI ,  Chetan Pravinchandra SHAH ,  Barun DAS ,  Supriya DEVARAJAN ,  Siuli SARKAR ,  Rahul RAUT ,  Bawa SINGH ,  Anubhav RUSTOGI ,  Anna Jane HARRIS ,  Keith Paul PARSONS ,  Jeffrey William BRAHAM

IPC: C09D11/52 ,  C09D11/033 ,  C09D11/037 ,  C09D11/104 ,  H01H13/704

CPC classification number: C09D11/52 ,  C09D11/033 ,  C09D11/037 ,  C09D11/104 ,  H01H13/704 ,  H01H2209/016

Abstract: This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.

公开(公告)号：US11699632B2

公开(公告)日：2023-07-11

申请号：US17153706

申请日：2021-01-20

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Oscar Khaselev ,  Michael T. Marczi ,  Bawa Singh

IPC: H05K13/04 ,  H01L23/373 ,  H01L23/00

CPC classification number: H01L23/373 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H05K13/0465 ,  H01L2224/2936 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/32225 ,  H01L2224/8384 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2924/0102 ,  H01L2924/0103 ,  H01L2924/014 ,  H01L2924/0104 ,  H01L2924/0105 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0132 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/203 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T428/24893 ,  H01L2224/29101 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/0132 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29111 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2224/83192 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/203 ,  H01L2924/0002

Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.

公开(公告)号：US20220371089A1

公开(公告)日：2022-11-24

申请号：US17754125

申请日：2020-09-24

Applicant: Alpha Assembly Solutions Inc.

Inventor： Shamik GHOSHAL ,  Nirmalya Kumar CHAKI ,  Remya CHANDRAN ,  Manoharan VENODH ,  Bawa SINGH ,  Barun DAS ,  Niveditha NAGARAJAN ,  Rahul RAUT ,  Oscar KHASELEV ,  Ranjit PANDHER ,  Supriya DEVARAJAN ,  Anubhav RUSTOGI

IPC: B22F7/04 ,  B22F1/107 ,  B22F9/30 ,  H05K1/09 ,  H05K3/12 ,  H01B13/012 ,  H05K3/34 ,  H01L23/00 ,  H01B1/02 ,  B23K35/30

Abstract: A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.

公开(公告)号：US11411150B2

公开(公告)日：2022-08-09

申请号：US16257441

申请日：2019-01-25

Applicant: Alpha Assembly Solutions Inc.

Inventor： Morgana de Avila Ribas ,  Pritha Choudhury ,  Siuli Sarkar ,  Ranjit Pandher ,  Nicholas G Herrick ,  Amit Patel ,  Ravindra M Bhatkal ,  Bawa Singh

IPC: B23K35/26 ,  C22C13/02 ,  H01L33/62 ,  H01L23/00 ,  B23K1/00 ,  B23K1/002 ,  B23K1/005 ,  B23K1/08 ,  H01L33/64

Abstract: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.

公开(公告)号：US20220241852A1

公开(公告)日：2022-08-04

申请号：US17594978

申请日：2020-05-05

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Oscar KHASELEV ,  Matthew James SIEBENHUHNER ,  Monnir BOUREGHDA ,  Mike MARCZI ,  Carl BILGRIEN

IPC: B22D21/06 ,  B23K1/00 ,  B22D25/04 ,  B22C9/22

Abstract: A method of making a combined sinter-ready silver film and carrier (1) comprises the steps of: a) creating a carrier (2) comprising designed openings (5); b) casting a silver film layer (7) into the designed openings (5), for example casting a silver paste; and c) drying the carrier (2) and silver film layer (7) to form the combined sinter-ready silver film and carrier (1). The carrier (2) may comprise a plastic carrier, which may be created by permanently bonding two plastic films, using a plasma bonding process or using a temperature stable glue. The carrier (2) may comprise a stencil layer (3) and a backing layer (4). The stencil layer (3) may define the designed openings (5). The backing layer (4) may be configured for sealing a bottom of the designed openings (5), wherein at the start of step b), a top of the designed openings (5) may be open for receiving the cast silver film layer (7).

公开(公告)号：US20210205935A1

公开(公告)日：2021-07-08

申请号：US17149503

申请日：2021-01-14

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Shamik Ghoshal ,  Remya Chandran ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Ranjit Pandher ,  Bawa Singh

IPC: B23K35/30 ,  B22F1/00 ,  B22F1/02 ,  B22F9/24 ,  C09C1/62 ,  B23K35/02 ,  B23K35/36

Abstract: A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.

公开(公告)号：US20210162496A1

公开(公告)日：2021-06-03

申请号：US17255289

申请日：2019-06-21

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Shamik GHOSAL ,  Remya CHANDRAN ,  Venodh MANOHARAN ,  Siuli SARKAR ,  Bawa SINGH ,  Rahul RAUT

IPC: B22F1/00 ,  B23K35/30 ,  B23K35/02 ,  B22F9/24 ,  B22F5/00

Abstract: A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.