公开(公告)号：US4959692A

公开(公告)日：1990-09-25

申请号：US282449

申请日：1988-12-09

申请人： Yuji Hayashi ,  Susumu Sakakibara ,  Katsumi Maeda

发明人： Yuji Hayashi ,  Susumu Sakakibara ,  Katsumi Maeda

IPC分类号： G03G15/09

CPC分类号： G03G15/09 ,  G03G15/0921

摘要： A developing device including a rotatable developing sleeve confronting an electrostatic latent image support member, a supply device for supplying developer to a peripheral surface of the developing sleeve, a bristle height regulating member, a device for removing from the peripheral surface of the developing sleeve, the developer having passed through a developing region, a cutoff device for cutting off supply of the developer from the supply device to the developing sleeve, which is retractably projected into a developer supply region defined between the developing sleeve and the supply device and a magnet member provided fixedly in the developing sleeve and having a developing magnetic pole confronting the support member, a first magnetic pole confronting the bristle height regulating member and a second magnetic pole of a polarity identical with that of the first magnetic pole such that the developer is continuously held in an erect state on the developing sleeve by the first and second magnetic poles.

摘要翻译： 一种显影装置，包括面向静电潜像支撑构件的可旋转显影套筒，用于向显影套筒的外周表面供应显影剂的供应装置，刷毛高度调节构件，用于从显影套筒的外周表面移除的装置， 已经通过显影区域的显影剂，用于切断从供给装置向显影套筒供应显影剂的切断装置，其可伸缩地突出到限定在显影套筒和供给装置之间的显影剂供应区域中，磁体构件 固定地安装在显影套筒中并且具有与支撑构件相对的显影磁极，面对刷毛高度调节构件的第一磁极和与第一磁极的极性相同的极性的第二磁极，使得显影剂被连续地保持 在开发套筒上的直立状态由第一和第二 第二磁极。

公开(公告)号：US08802798B2

公开(公告)日：2014-08-12

申请号：US12230485

申请日：2008-08-29

申请人： Katsumi Maeda ,  Shigeyuki Iwasa ,  Kaichiro Nakano ,  Etsuo Hasegawa

发明人： Katsumi Maeda ,  Shigeyuki Iwasa ,  Kaichiro Nakano ,  Etsuo Hasegawa

IPC分类号： C08F24/00 ,  C08F10/00 ,  C08F32/08 ,  C08F118/02 ,  C08F2/00

CPC分类号： C08F222/14 ,  C07D307/93 ,  C08F20/28 ,  C08F120/28 ,  C08F220/32 ,  G03F7/004 ,  G03F7/0045 ,  G03F7/038 ,  G03F7/0382 ,  G03F7/039 ,  Y10S430/111

摘要： A photoresist material for lithography using a light of 220 nm or less which comprises at least a polymer represented by the following formula (2) and a photo-acid generator for generating an acid by exposure: wherein R1, R2, R3 and R5 are each a hydrogen atom or a methyl group; R4 is an acid-labile group or one of a specified subset of alicyclic hydrocarbon groups, alicyclic hydrocarbon groups, or hydrocarbon groups; R6 is a hydrogen atom or one of a specified subset of hydrocarbon groups or alicyclic hydrocarbon groups; x, y and z are optional values which meet x+y+z=1, 0

摘要翻译： 一种用于光刻的光致抗蚀剂材料，其使用220nm以下的光，其至少包含由下式（2）表示的聚合物和通过曝光产生酸的光酸发生剂：其中R1，R2，R3和R5各自 氢原子或甲基; R4是酸不稳定基团或脂环族烃基，脂环族烃基或烃基的特定子集之一; R6是氢原子或烃基或脂环烃基的特定子集之一; x，y和z是满足x + y + z = 1,0,0

公开(公告)号：US08536691B2

公开(公告)日：2013-09-17

申请号：US12446899

申请日：2007-10-09

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Katsumi Maeda ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Masaya Kawano ,  Yuuji Kayashima

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Katsumi Maeda ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Masaya Kawano ,  Yuuji Kayashima

IPC分类号： H01L23/02

CPC分类号： H01L23/5389 ,  H01L24/19 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/83 ,  H01L2224/82

摘要： A semiconductor device including a metal frame having a penetrating opening; a semiconductor chip provided in the opening; an insulating layer provided on the upper surface of the metal frame such that the insulating layer covers the upper surface, which is the circuit-formed surface of the semiconductor chip; an interconnect layer provided only on the upper-surface side of the metal frame with intervention of the insulating material and electrically connected to a circuit of the semiconductor chip; a via conductor provided on the upper surface of said semiconductor chip to electrically connect the circuit of the semiconductor chip and the interconnect layer; and a resin layer provided on the lower surface of the metal frame.

摘要翻译： 一种半导体器件，包括具有穿透开口的金属框架; 设置在开口内的半导体芯片; 绝缘层，设置在金属框架的上表面上，使得绝缘层覆盖作为半导体芯片的电路形成表面的上表面; 互连层，其仅在金属框架的上表面侧设置，并且绝缘材料的介入并且电连接到半导体芯片的电路; 设置在所述半导体芯片的上表面上的通孔导体，以电连接半导体芯片的电路和互连层; 以及设置在金属框架的下表面上的树脂层。

公开(公告)号：US20110196122A1

公开(公告)日：2011-08-11

申请号：US13088311

申请日：2011-04-15

申请人： Katsumi Maeda ,  Shigeyuki Iwasa ,  Kaichiro Nakano ,  Etsuo Hasegawa

发明人： Katsumi Maeda ,  Shigeyuki Iwasa ,  Kaichiro Nakano ,  Etsuo Hasegawa

IPC分类号： C08F222/14

CPC分类号： C08F222/14 ,  C07D307/93 ,  C08F20/28 ,  C08F120/28 ,  C08F220/32 ,  G03F7/004 ,  G03F7/0045 ,  G03F7/038 ,  G03F7/0382 ,  G03F7/039 ,  Y10S430/111

摘要： There are here disclosed a photoresist material for lithography using a light of 220 nm or less which comprises at least a polymer represented by the following formula (2) and a photo-acid generator for generating an acid by exposure: wherein R1, R2, R3 and R5 are each a hydrogen atom or a methyl group; R4 is an acid-labile group, an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has an acid labile group, an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has a carboxyl group, or a hydrocarbon group having 3 to 13 carbon atoms, which has an epoxy group; R6 is a hydrogen atom, a hydrocarbon group having 1 to 12 carbon atoms, or an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has a carboxyl group; x, y and z are optional values which meet x+y+z=1, 0

摘要翻译： 这里公开了使用220nm以下的光的光刻胶材料，该光致抗蚀剂材料至少包含由下式（2）表示的聚合物和通过曝光产生酸的光酸发生剂：其中R1，R2，R3 和R 5各自为氢原子或甲基; R4是酸不稳定基团，具有7〜13个碳原子的脂环族烃基，其具有酸不稳定基团，具有7〜13个碳原子的脂环族烃基，其具有羧基或具有3〜 13个碳原子，其具有环氧基; R6为氢原子，碳原子数1〜12的烃基或碳原子数为7〜13的脂环族烃基，具有羧基; x，y和z是满足x + y + z = 1,0,0

公开(公告)号：US20110175213A1

公开(公告)日：2011-07-21

申请号：US13062262

申请日：2009-10-05

申请人： Kentaro Mori ,  Daisuke Ohshima ,  Shintaro Yamamichi ,  Hideya Murai ,  Katsumi Maeda ,  Katsumi Kikuchi ,  Yoshiki Nakashima

发明人： Kentaro Mori ,  Daisuke Ohshima ,  Shintaro Yamamichi ,  Hideya Murai ,  Katsumi Maeda ,  Katsumi Kikuchi ,  Yoshiki Nakashima

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L24/85 ,  H01L23/13 ,  H01L23/142 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/24 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L24/92 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/2402 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/73227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device includes: at least one semiconductor element having electrode terminals; a metal plate supporting the semiconductor element; and a wiring board covering the semiconductor element and including a plurality of insulating layers and wiring layers alternately stacked and external connection terminals on a surface, the wiring layers being electrically connected to each other by vias. The electrode terminals and the external connection terminals are electrically connected via at least one of the wiring layers and the vias. At least one of the electrode terminals, the is wiring layers, and the vias is electrically connected to the metal plate.

摘要翻译： 半导体器件包括：至少一个具有电极端子的半导体元件; 支撑半导体元件的金属板; 以及覆盖半导体元件并且在表面上交替堆叠的多个绝缘层和布线层以及外部连接端子的布线板，布线层通过通孔彼此电连接。 电极端子和外部连接端子经由布线层和通孔中的至少一个电连接。 至少一个电极端子，即布线层和通孔，电连接到金属板。

公开(公告)号：US07847017B2

公开(公告)日：2010-12-07

申请号：US12092679

申请日：2006-11-01

申请人： Katsumi Maeda ,  Kaichiro Nakano

发明人： Katsumi Maeda ,  Kaichiro Nakano

IPC分类号： G02B6/00 ,  B29D11/00 ,  C09K11/06

CPC分类号： G02B6/138 ,  C08F220/28 ,  C08F220/30 ,  C08L33/14 ,  C09D133/14

摘要： The present invention has an object to provide a photosensitive resin composition for optical waveguide formation, which has low transmission loss and can form a waveguide pattern with high shape accuracy at low cost; an optical waveguide; and a method for producing an optical waveguide. The present invention provides a photosensitive resin composition for optical waveguide formation comprising at least: a polymer containing at least a (meth)acrylate structure unit having an epoxy structure, and a (meth)acrylate structure unit having a lactone structure and/or a vinyl monomer structure unit having an aromatic structure; and a photoacid generator, of which one or both of a core layer and a cladding layer are formed of a cured product.

摘要翻译： 本发明的目的是提供一种光波导形成用感光性树脂组合物，其具有低的传输损耗并且可以以低成本形成具有高形状精度的波导图案; 光波导; 以及光波导的制造方法。 本发明提供一种光波导形成用感光性树脂组合物，其至少包含：至少含有具有环氧结构的（甲基）丙烯酸酯结构单元的聚合物和具有内酯结构的（甲基）丙烯酸酯结构单元和/或乙烯基 具有芳族结构的单体结构单元; 以及光固化发生器，其中核心层和包覆层中的一个或两个由固化产物形成。

公开(公告)号：US20100150506A1

公开(公告)日：2010-06-17

申请号：US12594029

申请日：2008-02-29

申请人： Katsumi Maeda ,  Kaichiro Nakano

发明人： Katsumi Maeda ,  Kaichiro Nakano

IPC分类号： G02B6/02 ,  G02B6/00 ,  G03F7/004 ,  G03F7/20

CPC分类号： G02B6/138 ,  C08F232/08 ,  C08G59/1444 ,  C08L63/00 ,  C09D145/00 ,  G02B6/1221 ,  C08L2666/22

摘要： There are provided polymer optical waveguide forming material, a polymer optical waveguide and a manufacturing method of the polymer optical waveguide which reduces transmission loss with good processability. The polymer optical waveguide forming material is comprised of a polymer containing norbornene-based structural units including a hydroxy group; a photoacid generator for generating acid by irradiation of an actinic ray; and a monomer component polymerized by acid generated by said photoacid generator.

摘要翻译： 提供聚合物光波导形成材料，聚合物光波导和聚合物光波导的制造方法，其以良好的加工性降低传输损耗。 聚合物光波导形成材料由含有羟基的降冰片烯类结构单元的聚合物构成; 用于通过光化射线照射产生酸的光致酸产生器; 和由所述光酸产生剂产生的酸聚合的单体组分。

公开(公告)号：US20090068587A1

公开(公告)日：2009-03-12

申请号：US11919891

申请日：2006-05-12

申请人： Katsumi Maeda ,  Kaichirou Nakano

发明人： Katsumi Maeda ,  Kaichirou Nakano

IPC分类号： C07C233/27 ,  C07D309/06 ,  C07C69/96 ,  C08F20/56 ,  C08F24/00 ,  G03F7/031 ,  G03F7/20

CPC分类号： G03F7/0392 ,  C07C233/27 ,  C07D307/32 ,  C07D307/93 ,  C07D309/12 ,  C07F7/0838 ,  C08F220/58 ,  Y10S430/106 ,  Y10S430/107 ,  Y10S430/111 ,  Y10S430/115

摘要： The present invention relates to a novel (meth)acrylamide compound represented by the general formula (1), a (co)polymer of the (meth)acrylamide compound, and a chemically amplified photosensitive resin composition composed of the polymer and a photoacid generator. In the formula, R1 represents a hydrogen atom or a methyl group; R2 represents an acid-decomposable group; and R3 to R6 independently represent a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms.

摘要翻译： 本发明涉及由通式（1）表示的新型（甲基）丙烯酰胺化合物，（甲基）丙烯酰胺化合物的（共）聚合物和由聚合物和光酸产生剂组成的化学增幅感光性树脂组合物。 在该式中，R 1表示氢原子或甲基; R2代表酸可分解基团; R 3〜R 6独立地表示氢原子，卤素原子或碳原子数1〜4的烷基。

公开(公告)号：US20090001604A1

公开(公告)日：2009-01-01

申请号：US11817669

申请日：2006-03-01

申请人： Daisuke Tanaka ,  Shintaro Yamamichi ,  Hideya Murai ,  Tadanori Shimoto ,  Kaichirou Nakano ,  Katsumi Maeda ,  Katsumi Kikuchi ,  Yoichiro Kurita ,  Kouji Soejima

发明人： Daisuke Tanaka ,  Shintaro Yamamichi ,  Hideya Murai ,  Tadanori Shimoto ,  Kaichirou Nakano ,  Katsumi Maeda ,  Katsumi Kikuchi ,  Yoichiro Kurita ,  Kouji Soejima

IPC分类号： H01L23/485 ,  H01L21/56

CPC分类号： H01L21/563 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/3121 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/00

摘要： An oxide layer and a metal layer composed of a gold- or platinum-group metal are formed in the stated order on a substrate. A wiring body having a wiring layer, insulating layer, via, and electrode is formed on the metal layer. A semiconductor element is then connected as a flip chip via solder balls on the wiring body electrode, and underfill is introduced between the semiconductor element and the wiring body. Subsequently, a sealing resin layer is formed so as to cover the semiconductor element and the surface of the wiring body on which the semiconductor element is mounted, thus producing a semiconductor package. A high-density, detailed, thin semiconductor package can thereby be realized.

摘要翻译： 在基板上按规定的顺序形成由金或铂族金属构成的氧化物层和金属层。 具有布线层，绝缘层，通孔和电极的布线体形成在金属层上。 然后，半导体元件作为倒装芯片通过布线体电极上的焊球连接，底部填充物被引入到半导体元件与布线体之间。 随后，形成密封树脂层，以覆盖半导体元件和安装有半导体元件的布线体的表面，从而制造半导体封装。 由此可以实现高密度，详细，薄的半导体封装。

公开(公告)号：US07439005B2

公开(公告)日：2008-10-21

申请号：US10590804

申请日：2005-02-25

申请人： Katsumi Maeda ,  Kaichiro Nakano

发明人： Katsumi Maeda ,  Kaichiro Nakano

IPC分类号： G03F7/023 ,  G03F7/30 ,  G03F7/004

CPC分类号： G03F7/0233 ,  C08F212/32 ,  C08K5/08 ,  G03F7/038 ,  G03F7/0382 ,  G03F7/0392 ,  C08L25/18 ,  C08F212/08 ,  C08F220/10

摘要： There is disclosed a photosensitive resin composition for interlayer insulating films, surface protection films or the like, which exhibits excellent resolution and can be developed with an aqueous alkaline solution. The photosensitive resin composition is prepared using a polymer at least having a constitutional repeating unit represented by general formula II: wherein R1 represents hydrogen atom or methyl group; R2 to R9 independently represent hydrogen atom, halogen atom or alkyl group having 1 to 4 carbon atoms; X represents —CH═N—, —CONH—, —(CH2)n—CH═N— or —(CH2)n—CONH— and the N atom in X is bonded to a carbon atom in the benzene ring having AO— at an o-position; A represents hydrogen atom or a group being decomposed by an acid; and n represents a positive integer of 1 to 3.

摘要翻译： 公开了一种用于层间绝缘膜，表面保护膜等的感光性树脂组合物，其表现出优异的分辨率并且可以用碱性水溶液显影。 感光性树脂组合物使用至少具有由通式II表示的结构重复单元的聚合物制备，其中R 1表示氢原子或甲基; R 9至R 9独立地表示氢原子，卤素原子或具有1至4个碳原子的烷基; X表示-CH-N-，-CONH-， - （CH 2）n - ， - CH-N - 或 - （CH 2） NON原子，X中的N原子与O位的苯环中的碳原子键合; A表示氢原子或被酸分解的基团; n表示1〜3的正整数。