公开(公告)号：US07861288B2

公开(公告)日：2010-12-28

申请号：US10534541

申请日：2004-07-12

申请人： Yukio Tsuruoka ,  Yoshinao Kikuchi ,  Shintaro Mizuno ,  Kenji Takahashi ,  Kei Karasawa

发明人： Yukio Tsuruoka ,  Yoshinao Kikuchi ,  Shintaro Mizuno ,  Kenji Takahashi ,  Kei Karasawa

IPC分类号： H04L29/06

CPC分类号： H04L63/061 ,  H04L9/0866 ,  H04L9/3213 ,  H04L9/3271 ,  H04L29/12216 ,  H04L61/2007 ,  H04L63/0442 ,  H04L63/0807 ,  H04L2209/56 ,  H04L2209/80

摘要： An address allocated to a user by an authentication server is used as an IP address of a packet which is transmitted from a user terminal, preventing an illicit use if the IP address were eavesdropped. An authentication server 100 performs an authentication of a user based on a user authentication information which is transmitted from the user terminal, and upon a successful authentication, allocates an address to the user terminal, and issues a ticket containing the address to be returned to the user terminal. The user terminal sets up the address contained in the ticket as a source address, and transmits the ticket to the application server 300, requesting a session to be established. After verifying that the ticket is authentic, the server 300 stores the ticket and establishes a session with the user terminal. The user terminal transmits a service request packet containing the source address to the server 300 utilizing the session. If the source address coincides with the address contained in the stored ticket, the server 300 provides a service to the user.

摘要翻译： 使用由认证服务器分配给用户的地址作为从用户终端发送的分组的IP地址，如果IP地址被窃听，则防止非法使用。 认证服务器100基于从用户终端发送的用户认证信息来执行用户的认证，成功认证后，向用户终端分配地址，并发送包含要返回的地址的票据 用户终端。 用户终端将包含在票中的地址设置为源地址，并将票据发送到应用服务器300，请求建立会话。 在验证票证是真实的之后，服务器300存储票据并与用户终端建立会话。 用户终端利用会话向服务器300发送包含源地址的服务请求包。 如果源地址与存储的票证中包含的地址一致，则服务器300向用户提供服务。

公开(公告)号：USD629130S1

公开(公告)日：2010-12-14

申请号：US29363030

申请日：2010-06-03

申请人： Yutaka Murakami ,  Kenji Takahashi ,  Nobuyuki Matsui ,  Tetsushi Tamura ,  Yasushige Tomiyoshi

设计人： Yutaka Murakami ,  Kenji Takahashi ,  Nobuyuki Matsui ,  Tetsushi Tamura ,  Yasushige Tomiyoshi

公开(公告)号：US07853099B2

公开(公告)日：2010-12-14

申请号：US11617945

申请日：2006-12-29

申请人： Katsuhisa Shinmei ,  Kenji Takahashi ,  Tsutomu Ichikawa ,  Takashi Sawao ,  Koji Yano ,  Toshinobu Sugiyama ,  Akihiro Okumura ,  Takao Inoue ,  Noriaki Takahashi ,  Tetsujiro Kondo

发明人： Katsuhisa Shinmei ,  Kenji Takahashi ,  Tsutomu Ichikawa ,  Takashi Sawao ,  Koji Yano ,  Toshinobu Sugiyama ,  Akihiro Okumura ,  Takao Inoue ,  Noriaki Takahashi ,  Tetsujiro Kondo

IPC分类号： G06K9/54 ,  G06K9/40 ,  H04N5/228

CPC分类号： H04N5/367 ,  G06T5/002 ,  G06T5/005 ,  G06T2207/20081 ,  H04N5/357

摘要： An information processing apparatus includes an image taking means for taking images of a subject, a class-classification means for classifying a first image outputted by the image taking means into a class according to a characteristics thereof, a storage means for storing plural coefficient memories having different image taking conditions at the time of image taking, which store prediction coefficients according to the class acquired by learning, a designation means for designating one coefficient memory from among the plural coefficient memories based on the image taking condition when the image was taken by the image taking means, and a calculation means for calculating a second image in which noise is removed from the first image by calculating a prediction coefficient of the class of the first image, which is in the designated coefficient memory.

摘要翻译： 一种信息处理设备，包括用于拍摄被摄体的图像拍摄装置，用于将由图像获取装置输出的第一图像分类为根据其特征的类别的类别分类装置;存储装置，用于存储具有 根据通过学习获得的类存储预测系数的图像拍摄时的不同图像拍摄条件，用于基于当通过图像拍摄的图像拍摄时的图像拍摄条件从多个系数存储器中指定一个系数存储器的指定装置 图像摄取装置，以及计算装置，用于通过计算在指定的系数存储器中的第一图像的类别的预测系数来计算从第一图像中去除了噪声的第二图像。

公开(公告)号：US07847211B2

公开(公告)日：2010-12-07

申请号：US11512824

申请日：2006-08-30

申请人： Tomoko Fukunaka ,  Masashi Ishiguro ,  Kenji Takahashi ,  Shinsuke Kurahashi ,  Michio Sakurai

发明人： Tomoko Fukunaka ,  Masashi Ishiguro ,  Kenji Takahashi ,  Shinsuke Kurahashi ,  Michio Sakurai

IPC分类号： B23K1/005 ,  B23K26/20 ,  G06F19/00

CPC分类号： G06F17/5036 ,  H05K1/0201 ,  H05K1/116 ,  H05K3/3494 ,  H05K3/429 ,  H05K2203/107 ,  H05K2203/304

摘要： A method and device capable of properly selecting light radiating conditions in soldering work where components are soldered onto a board with light radiation applied to a solder joint. The device for selecting the light radiation conditions may contain a) an input device for entering information on; b) a storage for storing at least any one of databases on light radiation power and light radiation time for soldering; c) a calculator for determining light radiating conditions according to the information entered through the input device and the database stored in the storage; and d) an output device for outputting the light radiating conditions determined by the calculator. The input device may further comprise i) a component; ii) a board on which the component is soldered; and iii) solder for soldering the component.

摘要翻译： 一种方法和装置，其能够在焊接工作中适当地选择光辐射条件，其中组件被焊接到板上，施加到焊接点上的光辐射。 用于选择光辐射条件的装置可以包含：a）用于输入信息的输入装置; b）用于存储用于焊接的光辐射功率和光辐射时间上的数据库中的至少任一个的存储器; c）计算器，用于根据通过输入设备输入的信息和存储在存储器中的数据库来确定光照条件; 以及d）用于输出由所述计算器确定的所述光辐射条件的输出装置。 输入设备还可以包括：i）组件; ii）组件焊接在其上的板; 和iii）用于焊接部件的焊料。

公开(公告)号：US20100274478A1

公开(公告)日：2010-10-28

申请号：US12810482

申请日：2008-12-09

申请人： Kenji Takahashi

发明人： Kenji Takahashi

IPC分类号： G01C21/36 ,  G06K9/00 ,  G08G1/123 ,  G09G5/00

CPC分类号： G01C21/30 ,  G08G1/0969

摘要： A first road shape in camera image data generated by a camera that captures images of the surroundings of a vehicle is recognized based on the camera image data. In addition, after reading map image data in the vicinity of the vehicle from a navigation unit, second point of interest coordinates existing in a second road shape in the map image data which was read and first point of interest coordinates existing in the first road shape are each detected and the first point of interest coordinates and the second point of interest coordinates are made to correspond to each other.

摘要翻译： 基于摄像机图像数据识别摄像机生成的摄像机图像数据的第一道路形状，其拍摄车辆周围环境的图像。 此外，在从导航单元读取车辆附近的地图图像数据之后，在读取的地图图像数据中以第二道路形状存在的第二兴趣坐标坐标存在于第一道路形状 并且使第一兴趣点坐标和第二兴趣点坐标彼此对应。

公开(公告)号：US20100272235A1

公开(公告)日：2010-10-28

申请号：US12662642

申请日：2010-04-27

申请人： Kenji Takahashi

发明人： Kenji Takahashi

IPC分类号： G01N23/04

CPC分类号： A61B6/484 ,  A61B6/4021 ,  A61B6/4291 ,  A61B6/502 ,  G21K2207/005

摘要： Providing a radiation emission unit that includes a radiation source and outputs a fan beam of radiation, a diffraction grating onto which radiation outputted from the radiation emission unit is emitted, and a periodic information imaging radiation image detector that includes multiple linear electrodes and detects periodic information of radiation diffracted by the diffraction grating, disposing the radiation emission unit and the periodic information imaging radiation image detector such that an extending direction of the linear electrodes of the periodic information imaging radiation image detector is perpendicular to a fan surface of the fan beam having a larger spread angle, and configuring the radiation emission unit to scan the fan beam in the perpendicular direction.

摘要翻译： 提供包括辐射源并输出扇形辐射束的辐射发射单元，从辐射发射单元输出的辐射发射到其上的衍射光栅;以及周期性信息成像放射线图像检测器，包括多个线性电极并检测周期信息 设置辐射发射单元和周期性信息成像放射线图像检测器，使得周期性信息成像放射线图像检测器的线性电极的延伸方向垂直于扇形光束的风扇表面，该风扇表面具有 较大的扩展角度，以及配置辐射发射单元沿垂直方向扫描风扇光束。

公开(公告)号：US20100252902A1

公开(公告)日：2010-10-07

申请号：US12718419

申请日：2010-03-05

申请人： Kazumasa Tanida ,  Kenji Takahashi

发明人： Kazumasa Tanida ,  Kenji Takahashi

IPC分类号： H01L31/14 ,  H01L31/0232

CPC分类号： H01L27/14618 ,  H01L27/14632 ,  H01L27/14687 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/05686 ,  H01L2224/13 ,  H01L2924/00014 ,  H01L2924/04941 ,  H01L2924/01074 ,  H01L2924/01023 ,  H01L2924/01026 ,  H01L2924/04953

摘要： A semiconductor device, includes: a semiconductor substrate including a first surface and a second surface which are opposite to one another; a light receiving portion provided at the first surface of the semiconductor substrate; and an optical transparent protective member so as to cover and to be adjacent to the first surface or the second surface of the semiconductor substrate; wherein a plurality of depressed portions are formed at the optical transparent protective member so as to be opposite to the light receiving portion.

摘要翻译： 半导体器件包括：包括彼此相对的第一表面和第二表面的半导体衬底; 设置在所述半导体衬底的所述第一表面处的光接收部分; 以及光学透明保护构件，以覆盖并邻近半导体衬底的第一表面或第二表面; 其中在所述光学透明保护构件处形成多个凹陷部分以与所述光接收部分相对。

公开(公告)号：US20100216333A1

公开(公告)日：2010-08-26

申请号：US12622772

申请日：2009-11-20

申请人： Yoshinari Hane ,  Kouzou Kurita ,  Kenji Takahashi ,  Takaaki Kubozono

发明人： Yoshinari Hane ,  Kouzou Kurita ,  Kenji Takahashi ,  Takaaki Kubozono

IPC分类号： H01R11/00 ,  H01R13/40

CPC分类号： H01R13/53 ,  H01R13/533

摘要： There is provided a cable connecting member for use in cold climates which is capable of easily applying a common rubber insulating tube to several types of cables having different outside diameters and achieving high insulating performance without decreasing mechanical strength even in cold climates where the environmental temperature is low. An end of a cable is housed in a rubber insulating tube, and electrical insulation from the cable is enhanced. A rubber spacer is inserted between the rubber insulating tube and the end of the cable. At a temperature at which a elongation modulus of the rubber insulating tube increases three or more times as high as the elongation modulus of the rubber insulating tube at room temperature, a elongation modulus of the rubber spacer at such temperature is less than three times as high as the elongation modulus of the rubber spacer at room temperature.

摘要翻译： 提供了一种用于寒冷气候的电缆连接构件，其能够容易地将普通的橡胶绝缘管施加到具有不同外径的几种类型的电缆并且实现高绝缘性能，而不降低机械强度，即使在环境温度为 低。 电缆的一端容纳在橡胶绝缘管中，并且提高了电缆的电绝缘性。 在橡胶绝缘管和电缆末端之间插入橡胶垫片。 在橡胶绝缘管的伸长率模量在室温下增加橡胶绝缘管的伸长率的三倍以上的温度下，橡胶隔离物在该温度下的伸长率模量小于三倍 作为橡胶隔离物在室温下的伸长率模量。

公开(公告)号：US07750478B2

公开(公告)日：2010-07-06

申请号：US11808667

申请日：2007-06-12

申请人： Koujiro Kameyama ,  Akira Suzuki ,  Yoshio Okayama ,  Mitsuo Umemoto ,  Kenji Takahashi ,  Hiroshi Terao ,  Masataka Hoshino

发明人： Koujiro Kameyama ,  Akira Suzuki ,  Yoshio Okayama ,  Mitsuo Umemoto ,  Kenji Takahashi ,  Hiroshi Terao ,  Masataka Hoshino

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/12 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/0508 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05548 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2224/05599

摘要： A semiconductor device with improved reliability and its manufacturing method is offered. The semiconductor device of this invention includes a semiconductor substrate, a pad electrode formed on the semiconductor substrate through an insulation layer made of silicon oxide, silicon nitride or the like, a supporting plate bonded to a top surface of the semiconductor substrate to cover the pad electrode and a via hole formed in the semiconductor substrate and extending from a back surface of the semiconductor substrate to the pad electrode, wherein an aperture of the via hole at a portion close to the pad electrode is larger than an aperture of the via hole at a portion close to the back surface of the semiconductor substrate.

摘要翻译： 提供了可靠性提高的半导体器件及其制造方法。 本发明的半导体器件包括半导体衬底，通过由氧化硅，氮化硅等形成的绝缘层在半导体衬底上形成的焊盘电极，接合到半导体衬底的顶表面以覆盖衬垫的支撑板 电极和形成在半导体衬底中并从半导体衬底的背表面延伸到焊盘电极的通孔，其中靠近焊盘电极的部分处的通孔的孔径大于通孔的孔径 靠近半导体衬底的背面的部分。

公开(公告)号：US07732925B2

公开(公告)日：2010-06-08

申请号：US11055707

申请日：2005-02-11

申请人： Yoshio Okayama ,  Akira Suzuki ,  Koujiro Kameyama ,  Mitsuo Umemoto ,  Kenji Takahashi ,  Hiroshi Terao ,  Masataka Hoshino

发明人： Yoshio Okayama ,  Akira Suzuki ,  Koujiro Kameyama ,  Mitsuo Umemoto ,  Kenji Takahashi ,  Hiroshi Terao ,  Masataka Hoshino

IPC分类号： H01L29/40

CPC分类号： H01L24/12 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/0508 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05548 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2224/05599

摘要： A semiconductor device with improved reliability and its manufacturing method is offered. The semiconductor device of this invention includes a semiconductor substrate, a pad electrode formed on the semiconductor substrate through an insulation layer made of silicon oxide, silicon nitride or the like, a supporting plate bonded to a top surface of the semiconductor substrate to cover the pad electrode and a via hole formed in the semiconductor substrate and extending from a back surface of the semiconductor substrate to the pad electrode, wherein an aperture of the via hole at a portion close to the pad electrode is larger than an aperture of the via hole at a portion close to the back surface of the semiconductor substrate.

摘要翻译： 提供了可靠性提高的半导体器件及其制造方法。 本发明的半导体器件包括半导体衬底，通过由氧化硅，氮化硅等形成的绝缘层在半导体衬底上形成的焊盘电极，接合到半导体衬底的顶表面以覆盖衬垫的支撑板 电极和形成在半导体衬底中并从半导体衬底的背表面延伸到焊盘电极的通孔，其中靠近焊盘电极的部分处的通孔的孔径大于通孔的孔径 靠近半导体衬底的背面的部分。