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    SYSTEM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    1.
    发明申请
    SYSTEM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
    用于制造半导体器件的系统和方法

    公开(公告)号：US20130183810A1

    公开(公告)日：2013-07-18

    申请号：US13479968

    申请日：2012-05-24

    申请人： Satoshi HONGO ,  Kenji Takahashi ,  Kazumasa Tanida

    发明人： Satoshi HONGO ,  Kenji Takahashi ,  Kazumasa Tanida

    IPC分类号： H01L21/762 ,  H01L21/00

    CPC分类号： H01L21/2007 ,  H01L21/67092 ,  H01L21/76251 ,  Y10T29/413

    摘要： According to one embodiment, a system for manufacturing a semiconductor device includes a spontaneous joining unit and a deformative joining unit. The spontaneous joining unit overlaps a first substrate and a second substrate and spontaneously joins mutual center portions of respective joint faces of the first substrate and the second substrate. The deformative joining unit deforms at least one peripheral portion of the respective joint faces of the first substrate and second substrate joined by the spontaneous joining unit toward the other peripheral portion and joins the mutual peripheral portions of the respective joint faces.

    摘要翻译： 根据一个实施例，一种用于制造半导体器件的系统包括自发接合单元和变形接合单元。 自发接合单元与第一基板和第二基板重叠，并且自发地接合第一基板和第二基板的各个接合面的相互中心部分。 变形接合单元使由第一基板和第二基板的各个接合面的至少一个周边部分朝向另一个周边部分变形，并且连接各个接合面的相互的周边部分。

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    3.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
    半导体器件的半导体器件和制造方法

    公开(公告)号：US20120217600A1

    公开(公告)日：2012-08-30

    申请号：US13368930

    申请日：2012-02-08

    申请人： Satoshi HONGO ,  Kazumasa Tanida ,  Akihiro Hori ,  Kenji Takahashi ,  Hideo Numata

    发明人： Satoshi HONGO ,  Kazumasa Tanida ,  Akihiro Hori ,  Kenji Takahashi ,  Hideo Numata

    IPC分类号： H01L31/0232 ,  H01L31/18

    CPC分类号： H01L27/1464 ,  H01L21/84 ,  H01L27/1203 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/1469

    摘要： A manufacturing method of a semiconductor device according to embodiments includes forming a photodiode layer, which is an active region including a photodiode, on a main surface of a first substrate, forming a wiring layer, which includes a wire and a dielectric layer covering the wire, on the photodiode layer, and forming a dielectric film on the wiring layer. The manufacturing method of the semiconductor device according to the embodiments further includes bonding a second substrate to the dielectric film of the first substrate so that a crystal orientation of the photodiode layer matches a crystal orientation of the second substrate.

    摘要翻译： 根据实施例的半导体器件的制造方法包括在第一衬底的主表面上形成作为包括光电二极管的有源区的光电二极管层，形成布线层，其包括线和覆盖线的介电层 在光电二极管层上，并在布线层上形成电介质膜。 根据实施例的半导体器件的制造方法还包括将第二衬底接合到第一衬底的电介质膜，使得光电二极管层的晶体取向与第二衬底的晶体取向相匹配。

    System and method for manufacturing semiconductor device
    7.
    发明授权
    System and method for manufacturing semiconductor device 有权
    制造半导体器件的系统和方法

    公开(公告)号：US09004337B2

    公开(公告)日：2015-04-14

    申请号：US13479968

    申请日：2012-05-24

    申请人： Satoshi Hongo ,  Kenji Takahashi ,  Kazumasa Tanida

    发明人： Satoshi Hongo ,  Kenji Takahashi ,  Kazumasa Tanida

    IPC分类号： B31B1/68 ,  H01L21/20 ,  H01L21/67 ,  H01L21/762

    CPC分类号： H01L21/2007 ,  H01L21/67092 ,  H01L21/76251 ,  Y10T29/413

    摘要： According to one embodiment, a system for manufacturing a semiconductor device includes a spontaneous joining unit and a deformative joining unit. The spontaneous joining unit overlaps a first substrate and a second substrate and spontaneously joins mutual center portions of respective joint faces of the first substrate and the second substrate. The deformative joining unit deforms at least one peripheral portion of the respective joint faces of the first substrate and second substrate joined by the spontaneous joining unit toward the other peripheral portion and joins the mutual peripheral portions of the respective joint faces.

    摘要翻译： 根据一个实施例，一种用于制造半导体器件的系统包括自发接合单元和变形接合单元。 自发接合单元与第一基板和第二基板重叠，并且自发地接合第一基板和第二基板的各个接合面的相互中心部分。 变形接合单元使由第一基板和第二基板的各个接合面的至少一个周边部分朝向另一个周边部分变形，并且连接各个接合面的相互的周边部分。

    Semiconductor manufacturing apparatus and semiconductor manufacturing method
    9.
    发明授权
    Semiconductor manufacturing apparatus and semiconductor manufacturing method 有权
    半导体制造装置及半导体制造方法

    公开(公告)号：US08822307B2

    公开(公告)日：2014-09-02

    申请号：US13422966

    申请日：2012-03-16

    申请人： Naoko Yamaguchi ,  Kazumasa Tanida ,  Hideo Numata ,  Satoshi Hongo ,  Kenji Takahashi

    发明人： Naoko Yamaguchi ,  Kazumasa Tanida ,  Hideo Numata ,  Satoshi Hongo ,  Kenji Takahashi

    IPC分类号： H01L21/762 ,  B32B37/10 ,  B32B38/18 ,  H01L21/67

    CPC分类号： H01L21/76251 ,  H01L21/67092 ,  Y10T156/1744

    摘要： According to one embodiment, a semiconductor manufacturing apparatus is provided. The semiconductor manufacturing apparatus includes a stage, a substrate supporter, first and second pushers, and a controller. The stage is configured to support outer periphery portions of the first semiconductor substrate from below. The substrate supporter is configured to hold the back of the second semiconductor substrate. The first and second pushers are configured to bring the first and second semiconductor substrates in contact. The controller is configured to form the bonding initiation point between the first and second semiconductor substrates.

    摘要翻译： 根据一个实施例，提供一种半导体制造装置。 半导体制造装置包括台，基板支撑件，第一和第二推动器以及控制器。 该台被配置为从下方支撑第一半导体衬底的外围部分。 衬底支撑件构造成保持第二半导体衬底的背面。 第一和第二推动器构造成使第一和第二半导体衬底接触。 控制器被配置为在第一和第二半导体衬底之间形成接合起始点。