公开(公告)号：US20050110096A1

公开(公告)日：2005-05-26

申请号：US10904565

申请日：2004-11-16

申请人： Arne Ballantine ,  Kevin Chan ,  Jeffrey Gilbert ,  Kevin Houlihan ,  Glen Miles ,  James Quinlivan ,  Samuel Ramac ,  Michael Rice ,  Beth Ward

发明人： Arne Ballantine ,  Kevin Chan ,  Jeffrey Gilbert ,  Kevin Houlihan ,  Glen Miles ,  James Quinlivan ,  Samuel Ramac ,  Michael Rice ,  Beth Ward

IPC分类号： H01L21/28 ,  H01L21/336 ,  H01L29/49 ,  H01L29/76 ,  H01L21/3205 ,  H01L21/4763 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119

CPC分类号： H01L21/28035 ,  H01L29/4925 ,  H01L29/665

摘要： Polysilicon electrical depletion in a polysilicon gate electrode is reduced by depositing the polysilicon under controlled conditions so as to vary the crystal grain size through the thickness of the polysilicon. The resulting CMOS transistor may have two or more depth-wise contiguous regions of respective crystalline grain size, and the selection of grain size may be directed to maximize dopant activation in the polysilicon near the gate dielectric and to tailor the resistance of the polysilicon above that first region and more distant from the gate dielectric. A region of polycrystalline silicon may have a varying grain size as a function of a distance measured from a surface of the dielectric film.

摘要翻译： 通过在受控条件下沉积多晶硅来减少多晶硅栅电极中的多晶硅电耗，从而通过多晶硅的厚度来改变晶粒尺寸。 所得到的CMOS晶体管可以具有各自的晶粒尺寸的两个或更多个深度连续的区域，并且可以针对晶体尺寸的选择来最大化在栅极电介质附近的多晶硅中的掺杂剂活化，并且将多晶硅的电阻调整到高于该 第一区域并且远离栅极电介质。 多晶硅的区域可以具有作为从电介质膜的表面测量的距离的函数的变化的晶粒尺寸。

公开(公告)号：US06556887B2

公开(公告)日：2003-04-29

申请号：US09905091

申请日：2001-07-12

申请人： Marvin L. Freeman ,  Jeffrey C. Hudgens ,  Damon Keith Cox ,  Chris Holt Pencis ,  Michael Rice ,  David A. Van Gogh

发明人： Marvin L. Freeman ,  Jeffrey C. Hudgens ,  Damon Keith Cox ,  Chris Holt Pencis ,  Michael Rice ,  David A. Van Gogh

IPC分类号： G06F700

CPC分类号： H01L21/67259 ,  B25J9/0009 ,  B25J9/107 ,  G05B19/404 ,  G05B2219/37608 ,  G05B2219/39192 ,  G05B2219/49169 ,  G05B2219/49207 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/68 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/139

摘要： Generally, a method of determining a position of a robot is provided. In one embodiment, a method of determining a position of a robot comprises acquiring a first set of positional metrics, acquiring a second set of positional metrics and resolving the position of the robot due to thermal expansion using the first set and the second set of positional metrics. Acquiring the first and second set of positional metrics may occur at the same location within a processing system, or may occur at different locations. For example, in another embodiment, the method may comprise acquiring a first set of positional metrics at a first location proximate a processing chamber and acquiring a second set of positional metrics in another location. In another embodiment, substrate center information is corrected using the determined position of the robot.

摘要翻译： 通常，提供了一种确定机器人的位置的方法。 在一个实施例中，一种确定机器人位置的方法包括获取第一组位置度量，获取第二组位置度量并且利用第一组和第二组位置来解决由于热膨胀引起的机器人的位置 指标 获取第一和第二组位置度量可以发生在处理系统内的相同位置处，或者可以在不同位置处发生。 例如，在另一个实施例中，该方法可以包括在靠近处理室的第一位置获取第一组位置度量，并在另一位置获取第二组位置度量。 在另一个实施例中，使用所确定的机器人的位置校正基板中心信息。

公开(公告)号：US06444085B1

公开(公告)日：2002-09-03

申请号：US09675319

申请日：2000-09-29

申请人： Kenneth S. Collins ,  Michael Rice ,  John Trow ,  Douglas Buchberger ,  Craig A. Roderick

发明人： Kenneth S. Collins ,  Michael Rice ,  John Trow ,  Douglas Buchberger ,  Craig A. Roderick

IPC分类号： C23C1600

CPC分类号： H01J37/32458 ,  B01D53/22 ,  B01D53/226 ,  B01D53/268 ,  C23C16/517 ,  H01F2029/143 ,  H01J37/32082 ,  H01J37/321 ,  H01J37/32146 ,  H01J37/32165 ,  H01J37/32467 ,  H01J37/32522 ,  H01J37/32688 ,  H01J37/32706 ,  H01J37/32871 ,  H01J2237/3343 ,  H01J2237/3345 ,  H01J2237/3346 ,  H01L21/31116 ,  H01L21/6831

摘要： The invention is embodied in an inductively coupled RF plasma reactor including a reactor chamber enclosure defining a plasma reactor chamber and a support for holding a workpiece inside the chamber, a non-planar inductive antenna adjacent the reactor chamber enclosure, the non-planar inductive antenna including inductive elements spatially distributed in a non-planar relative to a plane of the workpiece to compensate for a null in an RF inductive pattern of the antenna, and a plasma source RF power supply coupled to the non-planar inductive antenna. The planar inductive antenna may be symmetrical or non-symmetrical, although it preferably includes a solenoid winding such as a vertical stack of conductive windings. In a preferred embodiment, the windings are at a minimum radial distance from the axis of symmetry while in an alternative embodiment the windings are at a radial distance from the axis of symmetry which is a substantial fraction of a radius of the chamber.

摘要翻译： 本发明体现在电感耦合RF等离子体反应器中，其包括限定等离子体反应器室的反应室外壳和用于将工件保持在室内的支撑件，邻近反应室壳体的非平面感应天线，非平面感应天线 包括相对于工件的平面空间分布在非平面中的电感元件，以补偿天线的RF感应图案中的零点，以及耦合到非平面感应天线的等离子体源RF电源。 平面感应天线可以是对称的或非对称的，尽管它优选地包括诸如导电绕组的垂直堆叠的螺线管绕组。 在优选实施例中，绕组处于距对称轴的最小径向距离，而在替代实施例中，绕组处于与对称半径相当大的部分的对称轴的径向距离处。

公开(公告)号：US06165311A

公开(公告)日：2000-12-26

申请号：US648254

申请日：1996-05-13

申请人： Kenneth S. Collins ,  Michael Rice ,  John Trow ,  Douglas Buchberger ,  Craig A. Roderick

发明人： Kenneth S. Collins ,  Michael Rice ,  John Trow ,  Douglas Buchberger ,  Craig A. Roderick

IPC分类号： H05H1/46 ,  B01D53/22 ,  B01D53/26 ,  C23C16/517 ,  C23F4/00 ,  H01J37/32 ,  H01L21/205 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/683 ,  C23F1/02

CPC分类号： H01J37/32458 ,  B01D53/22 ,  B01D53/226 ,  B01D53/268 ,  C23C16/517 ,  H01F2029/143 ,  H01J37/32082 ,  H01J37/321 ,  H01J37/32146 ,  H01J37/32165 ,  H01J37/32467 ,  H01J37/32522 ,  H01J37/32688 ,  H01J37/32706 ,  H01J37/32871 ,  H01J2237/3343 ,  H01J2237/3345 ,  H01J2237/3346 ,  H01L21/31116 ,  H01L21/6831

摘要： The invention is embodied in an inductively coupled RF plasma reactor including a reactor chamber enclosure defining a plasma reactor chamber and a support for holding a workpiece inside the chamber, a non-planar inductive antenna adjacent the reactor chamber enclosure, the non-planar inductive antenna including inductive elements spatially distributed in a non-planar manner relative to a plane of the workpiece to compensate for a null in an RF inductive pattern of the antenna, and a plasma source RF power supply coupled to the non-planar inductive antenna. The planar inductive antenna may be symmetrical or non-symmetrical, although it preferably includes a solenoid winding such as a vertical stack of conductive windings. In a preferred embodiment, the windings are at a minimum radial distance from the axis of symmetry while in an alternative embodiment the windings are at a radial distance from the axis of symmetry which is a substantial fraction of a radius of the chamber.

摘要翻译： 本发明体现在电感耦合RF等离子体反应器中，其包括限定等离子体反应器室的反应室外壳和用于将工件保持在室内的支撑件，邻近反应室壳体的非平面感应天线，非平面感应天线 包括相对于工件的平面以非平面方式空间分布的电感元件，以补偿天线的RF感应图案中的零点，以及耦合到非平面感应天线的等离子体源RF电源。 平面感应天线可以是对称的或非对称的，尽管它优选地包括诸如导电绕组的垂直堆叠的螺线管绕组。 在优选实施例中，绕组处于距对称轴的最小径向距离，而在替代实施例中，绕组处于与对称半径相当大的部分的对称轴的径向距离处。

公开(公告)号：US06063233A

公开(公告)日：2000-05-16

申请号：US733555

申请日：1996-10-21

申请人： Kenneth Collins ,  Michael Rice ,  Eric Askarinam ,  Douglas Buchberger ,  Craig Roderick

发明人： Kenneth Collins ,  Michael Rice ,  Eric Askarinam ,  Douglas Buchberger ,  Craig Roderick

IPC分类号： H05H1/46 ,  C23C16/517 ,  H01J37/32 ,  H01L21/205 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/683 ,  C23F1/02 ,  C23C16/00

CPC分类号： H01J37/32458 ,  C23C16/517 ,  H01J37/32082 ,  H01J37/321 ,  H01J37/32146 ,  H01J37/32165 ,  H01J37/32467 ,  H01J37/32522 ,  H01J37/32688 ,  H01J37/32706 ,  H01J37/32871 ,  H01L21/31116 ,  H01L21/6831 ,  H01F2029/143 ,  H01J2237/3343 ,  H01J2237/3345 ,  H01J2237/3346

摘要： The invention is embodied in a plasma reactor including a plasma reactor chamber and a workpiece support for holding a workpiece near a support plane inside the chamber during processing, the chamber having a reactor enclosure portion facing the support, a cold body overlying the reactor enclosure portion, a plasma source power applicator between the reactor enclosure portion and the cold body and a thermally conductor between and in contact with the cold body and the reactor enclosure. The thermal conductor and the cold sink define a cold sink interface therebetween, the reactor preferably further including a thermally conductive substance within the cold sink interface for reducing the thermal resistance across the cold sink interface. The thermally conductive substance can be a thermally conductive gas filling the cold body interface. Alternatively, the thermally conductive substance can be a thermally conductive solid material. The reactor can include a gas manifold in the cold body communicable with a source of the thermally conductive gas an inlet through the cold body from the gas manifold and opening out to the cold body interface. The reactor can further include an O-ring apparatus sandwiched between the cold body and the thermal conductor and defining a gas-containing volume in the cold body interface of nearly infinitesimal thickness in communication with the inlet from the cold body. More generally, the reactor can include the facilitation of thermal transfer across an interface between a hot and/or cold sink and any part exposed to the reactor chamber interior atmosphere, such as the ceiling, wall or polymer-hardening precursor ring, for example, by the insertion into that interface of a thermally conductive gas or substance.

公开(公告)号：US5990017A

公开(公告)日：1999-11-23

申请号：US104550

申请日：1998-06-25

申请人： Kenneth Collins ,  Michael Rice ,  David Groechel ,  Gerald Yin ,  Jon Mohn ,  Craig Roderick ,  Douglas Buchberger ,  Chan-Lon Yang ,  Jerry Wong ,  Jeffrey Marks ,  Peter Keswick

发明人： Kenneth Collins ,  Michael Rice ,  David Groechel ,  Gerald Yin ,  Jon Mohn ,  Craig Roderick ,  Douglas Buchberger ,  Chan-Lon Yang ,  Jerry Wong ,  Jeffrey Marks ,  Peter Keswick

IPC分类号： H01L21/302 ,  H01J37/32 ,  H01L21/02 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/00

CPC分类号： H01J37/321 ,  H01J37/32082 ,  H01J37/32146 ,  H01J37/32165 ,  H01J37/32458 ,  H01J37/32467 ,  H01J37/32522 ,  H01J37/32688 ,  H01J37/32706 ,  H01J37/32871 ,  H01L21/31116 ,  H01F2029/143 ,  H01J2237/3343 ,  H01J2237/3345 ,  H01J2237/3346 ,  H01J2237/3382

摘要： A general method of the invention is to provide a polymer-hardening precursor piece (such as silicon, carbon, silicon carbide or silicon nitride, but preferably silicon) within the reactor chamber during an etch process with a fluoro-carbon or fluoro-hydrocarbon gas, and to heat the polymer-hardening precursor piece above the polymerization temperature sufficiently to achieve a desired increase in oxide-to-silicon etch selectivity. Generally, this polymer-hardening precursor or silicon piece may be an integral part of the reactor chamber walls and/or ceiling or a separate, expendable and quickly removable piece, and the heating/cooling apparatus may be of any suitable type including apparatus which conductively or remotely heats the silicon piece.

公开(公告)号：US5477975A

公开(公告)日：1995-12-26

申请号：US138060

申请日：1993-10-15

申请人： Michael Rice ,  Jeffrey Marks ,  David W. Groechel ,  Nicolas J. Bright

发明人： Michael Rice ,  Jeffrey Marks ,  David W. Groechel ,  Nicolas J. Bright

IPC分类号： C23F4/00 ,  B44C1/22 ,  H01J37/32 ,  H01L21/302 ,  H01L21/3065 ,  H05H1/00

CPC分类号： H01J37/32871 ,  H01J37/32082 ,  H01J37/321 ,  H01J37/32165 ,  H01J37/32458 ,  H01J37/32522 ,  H01J2237/3343 ,  H01J2237/3346 ,  Y10S438/909

摘要： The invention is embodied in a method of operating a plasma etch reactor, consisting of introducing a gas into the reactor which disassociates as a plasma into an etch species which etches oxide films on a work piece in the reactor and a non-etching species combinable with the etch species into an etch-preventing polymer condensable onto the work piece below a characteristic deposition temperature, providing an interior wall comprising a material which scavenges the etching species, and maintaining a temperature of the interior wall above the deposition temperature.

公开(公告)号：US08642255B2

公开(公告)日：2014-02-04

申请号：US12934644

申请日：2009-03-27

申请人： Ian B. Nicoud ,  Dominic M. Clarke ,  Aby J. Mathew ,  Michael Rice

发明人： Ian B. Nicoud ,  Dominic M. Clarke ,  Aby J. Mathew ,  Michael Rice

IPC分类号： A01N1/02

CPC分类号： C12N5/0641 ,  A01N1/02 ,  A01N1/0226 ,  A01N1/0284 ,  A61K35/44 ,  A61K35/50

摘要： The present invention relates to materials and methods for hypothermic collection of whole blood, and components thereof, which can extend the holding time of blood beyond the current useable limit. Additionally, blood can be drawn directly into a hypothermic preservation solution without the addition of standard anticoagulants. This is enabled by providing sustained cellular viability under hypothermic conditions using a nutrient matrix devoid of animal proteins and containing energy substrates, free-radical scavengers, and impermeants that is ionically balanced for storage of biologic materials at low temperatures to prevent cellular stress-induced apoptosis.

摘要翻译： 本发明涉及全血及其组分的低体温收集的材料和方法，其可以将血液的保持时间延长超过目前的可用极限。 此外，血液可以直接吸入低温保存溶液中，而不添加标准抗凝剂。 这是通过在低温条件下使用不含动物蛋白质的营养基质并含有能量底物，自由基清除剂和离子平衡的不渗液在低温下储存生物材料以防止细胞应激诱导的细胞凋亡来实现的 。

公开(公告)号：US08550031B2

公开(公告)日：2013-10-08

申请号：US13524854

申请日：2012-06-15

申请人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

发明人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC分类号： B05C13/02 ,  C23C14/00 ,  H01L21/677

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： Embodiments of the invention generally include a robot assembly comprising a robot operable to position a substrate at one or more points within a plane, and a motion assembly having a motor operable to position the robot in a direction generally parallel to a first direction. The motion assembly comprises a robot support interface having the robot coupled thereto, and one or more walls that form an interior region in which the motor is enclosed. The walls define an elongated opening through which the robot support interface travels, and the motor is operable to move the robot support interface laterally in the elongated opening. The motion assembly further comprises one or more fan assemblies that are in fluid communication with the interior region. The fan assemblies are operable to create a subatmospheric pressure in the interior region thereby causing gas to flow through the elongated opening into the interior region.

摘要翻译： 本发明的实施例通常包括机器人组件，其包括可操作以在平面内的一个或多个点处定位衬底的机器人，以及具有可操作以将机器人沿大致平行于第一方向的方向定位的电动机的运动组件。 运动组件包括机器人支撑接口，其具有耦合到其上的机器人，以及一个或多个壁，其形成电机被封闭的内部区域。 壁限定了机器人支撑接口行进的细长开口，电动机可操作以在细长的开口中横向移动机器人支撑界面。 运动组件还包括与内部区域流体连通的一个或多个风扇组件。 风扇组件可操作以在内部区域中产生低于大气压的压力，从而使气体通过细长的开口流入内部区域。

公开(公告)号：US08215262B2

公开(公告)日：2012-07-10

申请号：US12254784

申请日：2008-10-20

申请人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lu

发明人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lu

IPC分类号： B05C13/02 ,  C23C14/00 ,  H01L21/677

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, a cluster tool for processing a substrate includes a first processing rack, a first robot assembly and a second robot assembly operable to transfer substrates to substrate processing chambers in the first processing rack, and a horizontal motion assembly. The horizontal motion assembly includes one or more walls that form an interior region in which a motor is enclosed. The one or more walls defining an elongated opening through which a robot support interface travels, the robot support interface supporting a robot of the horizontal motion assembly.

摘要翻译： 实施例通常提供使用具有增加的系统吞吐量，增加的系统可靠性的多腔室处理系统（例如，集群工具）来处理衬底的装置和方法，在集群工具中处理的衬底具有更可重复的晶片历史，并且还 集群工具具有更小的系统占用空间。 在一个实施例中，用于处理衬底的簇工具包括第一处理架，第一机器人组件和可操作以将衬底传送到第一处理架中的衬底处理室的第二机器人组件和水平运动组件。 水平运动组件包括形成电动机被封闭的内部区域的一个或多个壁。 所述一个或多个壁限定机器人支撑接口行进的细长开口，所述机器人支撑界面支撑水平运动组件的机器人。