公开(公告)号：US20210210435A1

公开(公告)日：2021-07-08

申请号：US16997173

申请日：2020-08-19

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ming-Fan Tsai ,  Chih-Wei Chen ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

Abstract: An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.

公开(公告)号：US20200013728A1

公开(公告)日：2020-01-09

申请号：US16573276

申请日：2019-09-17

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/31 ,  H01L21/56

Abstract: An electronic package and a method for fabricating the same are provided. The method includes disposing an electronic component on a lower side of a first carrier and forming an encapsulant on an upper side of the first carrier. A first conductor is disposed on the encapsulant and configured for generating radiation energy by an alternating voltage, an alternating current or radiation variation. As such, the electronic package has a reduced thickness and improved antenna efficiency.

公开(公告)号：US10461041B2

公开(公告)日：2019-10-29

申请号：US15660227

申请日：2017-07-26

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/31 ,  H01L21/56 ,  H01Q23/00

Abstract: An electronic package and a method for fabricating the same are provided. The method includes disposing an electronic component on a lower side of a first carrier and forming an encapsulant on an upper side of the first carrier. A first conductor is disposed on the encapsulant and configured for generating radiation energy by an alternating voltage, an alternating current or radiation variation. As such, the electronic package has a reduced thickness and improved antenna efficiency.

公开(公告)号：US10199317B2

公开(公告)日：2019-02-05

申请号：US15083421

申请日：2016-03-29

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Ying-Wei Lu ,  Jyun-Yuan Jhang ,  Ming-Fan Tsai

IPC: H01L23/498 ,  H01L23/66 ,  H01Q9/06 ,  H01Q19/10 ,  H01Q23/00 ,  H01Q1/24

Abstract: An electronic package includes a circuit structure having a first metal layer, a packaging layer formed on the circuit structure, and a second metal layer formed on the packaging layer and separated from the first metal layer at a distance. The first metal layer and the second metal layer constitute an antenna structure. Since the second metal layer is formed on a portion of a surface of the packaging layer, a propagating wave emitted by the first metal layer cannot pass through the second metal layer, but a surface of the packaging layer not covered by the second metal layer. Therefore, the propagating wave can be transmitted to a predetermined target, and the electronic package performs the function of an antenna.

公开(公告)号：US10074613B2

公开(公告)日：2018-09-11

申请号：US15584281

申请日：2017-05-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hao-Ju Fang ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Tsung-Hsien Tsai ,  Chia-Yang Chen ,  Chun-Chi Ke

IPC: H01L23/552 ,  H01L21/48 ,  H01L21/54 ,  H01L21/56 ,  H01L21/78 ,  H01L23/16 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/54 ,  H01L21/561 ,  H01L21/563 ,  H01L21/78 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/85

Abstract: A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.

公开(公告)号：US09899335B2

公开(公告)日：2018-02-20

申请号：US15298480

申请日：2016-10-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Chia-Yang Chen ,  Chao-Ya Yang

IPC: H01L21/00 ,  H01L23/52 ,  H01L23/58 ,  H01L23/552 ,  H01L21/56 ,  H01L21/48 ,  H01L21/78 ,  H01L23/66 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.

公开(公告)号：US20170278807A1

公开(公告)日：2017-09-28

申请号：US15181489

申请日：2016-06-14

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chi-Pin Tsai ,  Chi-Liang Shih ,  Ming-Fan Tsai ,  Chia-Yang Chen

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/66 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48106 ,  H01L2224/48195 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48265 ,  H01L2224/49171 ,  H01L2224/73253 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107

Abstract: Provided is an electronic package, including: a carrier, an electronic component disposed on the carrier, and an antenna structure, wherein the antenna structure has a plurality of spacing members and at least one wire connected among the spacing members. No additional layout area is required to be formed on a surface of the carrier, such that the objective of miniaturization can be achieved.

公开(公告)号：US09508656B2

公开(公告)日：2016-11-29

申请号：US14463999

申请日：2014-08-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Chia-Yang Chen ,  Chao-Ya Yang

IPC: H01L23/552 ,  H05K3/30 ,  H01L21/78 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.

Abstract translation: 封装结构包括载体，布置在载体上的电子部件，形成在载体上用于封装电子部件的密封剂，形成在密封剂上的第一屏蔽层和形成在第一屏蔽层上的第二屏蔽层。 第一和第二屏蔽层由不同的材料制成。 通过形成在封装层上的多个屏蔽层，电子部件被保护免受电磁干扰。 本发明还提供一种制造封装结构的方法。

公开(公告)号：US09502377B2

公开(公告)日：2016-11-22

申请号：US13971189

申请日：2013-08-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Chia-Yang Chen ,  Chih-Ming Cheng ,  Yude Chu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  H01L23/433 ,  H01L25/065 ,  H01L23/31 ,  H01L23/552 ,  H01L23/66

CPC classification number: H01L24/85 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/552 ,  H01L23/66 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A semiconductor package is disclosed, which includes: a circuit board; a carrier disposed on the circuit board; an RF chip disposed on the carrier; a plurality of high level bonding wires electrically connecting electrode pads of the RF chip and the circuit board; and an encapsulant formed on the circuit board for encapsulating the carrier, the high level bonding wires and the RF chip. The present invention positions the RF chip at a high level so as to facilitate element arrangement and high frequency wiring on the circuit board, thereby achieving a highly integrated wireless SiP (System in Package) module.

Abstract translation: 公开了一种半导体封装，其包括：电路板; 布置在电路板上的载体; 布置在载体上的RF芯片; 电连接RF芯片的电极焊盘和电路板的多个高级焊接线; 以及形成在电路板上用于封装载体，高电平接合线和RF芯片的密封剂。 本发明将RF芯片定位在高水平，以便于电路板上的元件布置和高频布线，从而实现高度集成的无线SiP（系统级封装）模块。

公开(公告)号：US20160155559A1

公开(公告)日：2016-06-02

申请号：US14695076

申请日：2015-04-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Ming-Fan Tsai ,  Chia-Yang Chen ,  Chao-Ya Yang

IPC: H01F27/28 ,  H01L23/522 ,  H01F27/02 ,  H01L23/498 ,  H01F27/24 ,  H01L23/31 ,  H01L23/528

CPC classification number: H01F27/2804 ,  H01F17/0033 ,  H01F27/022 ,  H01F27/24 ,  H01F2027/2809 ,  H01L23/49822 ,  H01L23/645 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic package is provided, including a substrate body, a ferromagnetic material embedded in the substrate body, and a conductor structure disposed around the conductor structure. Therefore, the conductor structure generates high magnetic flux and thus increases inductance.

Abstract translation: 提供了一种电子封装，包括基板主体，嵌入在基板主体中的铁磁材料，以及设置在导体结构周围的导体结构。 因此，导体结构产生高磁通量，从而增加电感。