公开(公告)号：US4457464A

公开(公告)日：1984-07-03

申请号：US337614

申请日：1982-01-07

Applicant: Gerard Forterre ,  Pierre Hartemann

Inventor： Gerard Forterre ,  Pierre Hartemann

IPC: H01P1/30 ,  C04B37/02 ,  H01P1/383 ,  H01P1/39 ,  H01P11/00

CPC classification number: H01P1/383 ,  C04B37/026 ,  C04B37/028 ,  H01P1/39 ,  C04B2235/5445 ,  C04B2235/6562 ,  C04B2237/121 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/34 ,  C04B2237/406 ,  C04B2237/708 ,  C04B2237/72 ,  Y10S228/903

Abstract: In a method for fixing a ferrite to a metal piece such as a pole-piece of a magnetic polarizing circuit of a microwave device, a first step consists in depositing a nonresistive metal on the ferrite face to be fixed. A second step consists in applying a very thin layer of heat-conducting adhesive on the metallized ferrite face and bonding the ferrite to the metal piece, thus ensuring low thermal resistance, very low insertion loss and high power capability.

Abstract translation: 在将铁氧体固定在诸如微波器件的磁极化电极的极片之类的金属片的方法中，第一步是将非电阻金属沉积在待固定的铁氧体表面上。 第二步是在金属化的铁氧体表面上施加非常薄的导热粘合剂层，并将铁氧体与金属片接合，从而确保低热阻，非常低的插入损耗和高功率能力。

公开(公告)号：US3957497A

公开(公告)日：1976-05-18

申请号：US95329

申请日：1970-12-04

Applicant: Don N. Gray ,  John D. Grier

Inventor： Don N. Gray ,  John D. Grier

IPC: C03C27/00 ,  C04B37/00 ,  C04B41/50 ,  C04B41/51 ,  C08K3/00 ,  C09D5/24 ,  C09D125/16 ,  C03C5/02

CPC classification number: C08K3/0033 ,  C03C27/00 ,  C04B35/63432 ,  C04B37/005 ,  C04B37/008 ,  C04B37/025 ,  C04B37/028 ,  C04B37/045 ,  C04B37/047 ,  C04B41/5022 ,  C04B41/5188 ,  C09D125/16 ,  C09D5/24 ,  C04B2237/06 ,  C04B2237/062 ,  C04B2237/064 ,  C04B2237/10 ,  C04B2237/12 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/30 ,  C04B2237/32 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/345 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/363 ,  C04B2237/401 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/525 ,  C04B2237/592 ,  C04B2237/64 ,  C04B2237/70 ,  C04B2237/708

Abstract: There is disclosed the preparation of a polymeric based composition comprising a finely divided, particulate inorganic material dispersed in a low molecular weight, low vapor pressure, liquid having a relatively constant viscosity and thixotropic character and capable of being decomposed or pyrolyzed completely to gaseous products at a relatively low temperature without forming a carbonaceous or like residue having a deleterious effect(s) in the application of the composition to a substrate.

Abstract translation: 公开了一种聚合物基组合物的制备，其包含以低分子量，低​​蒸气压分散的细分散的颗粒状无机材料，具有相对恒定的粘度和触变特性的液体，并能够完全分解或热解为气态产物 相对较低的温度，而不形成在将组合物施用于基材中具有有害作用的碳质或类似残余物。

公开(公告)号：US3291578A

公开(公告)日：1966-12-13

申请号：US32105163

申请日：1963-11-04

Applicant: GEN ELECTRIC

Inventor： FAHEY JOHN R

IPC: B22F7/06 ,  B29C65/02 ,  C03C17/06 ,  C04B37/02 ,  C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C22C27/04 ,  C22C32/00 ,  H01B1/00 ,  H01L21/58 ,  H01L21/60

CPC classification number: H01L24/83 ,  B22F7/062 ,  B22F2998/00 ,  C03C17/06 ,  C03C2217/263 ,  C03C2218/17 ,  C04B35/632 ,  C04B35/63432 ,  C04B35/653 ,  C04B37/006 ,  C04B37/008 ,  C04B37/028 ,  C04B41/009 ,  C04B41/5138 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C04B2111/00844 ,  C04B2237/12 ,  C04B2237/122 ,  C04B2237/125 ,  C04B2237/128 ,  C04B2237/16 ,  C04B2237/32 ,  C04B2237/343 ,  C04B2237/52 ,  C04B2237/555 ,  C04B2237/68 ,  C04B2237/72 ,  C04B2237/86 ,  C22C27/04 ,  C22C32/00 ,  H01B1/00 ,  H01L24/26 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15787 ,  Y10S428/936 ,  Y10S428/939 ,  Y10T428/12056 ,  Y10T428/12083 ,  Y10T428/12139 ,  Y10T428/12528 ,  Y10T428/12618 ,  Y10T428/1266 ,  C04B41/50 ,  C04B41/5025 ,  C04B41/53 ,  C04B41/0072 ,  C04B41/5035 ,  C04B41/5096 ,  C04B41/5323 ,  C04B41/5338 ,  C04B41/5116 ,  C04B35/00 ,  B22F7/08 ,  H01L2924/00

公开(公告)号：US20240312678A1

公开(公告)日：2024-09-19

申请号：US18281762

申请日：2021-07-07

Applicant: JIANGSU NEW LINZHI ELECTRONIC TECHNOLOGY CO., LTD.

Inventor： Qiuyun FU ,  Zhengan HE ,  Dongxiang ZHOU

IPC: H01C7/02 ,  C04B37/02 ,  H01C1/14

CPC classification number: H01C7/021 ,  C04B37/023 ,  C04B37/028 ,  H01C1/1406 ,  C04B2237/10 ,  C04B2237/346 ,  C04B2237/74

Abstract: A positive temperature coefficient ceramic thermistor element includes a sintered thermosensitive ceramic piece that uses lead barium titanate as a base, as well as metal ohmic electrodes which are positioned on two side surfaces of the thermosensitive ceramic piece. The thermistor element has a microporous channel barrier layer, and includes a glass sealing layer which wraps the outer surface of the thermosensitive ceramic piece, or an organic matter sealant which fills and blocks micro-pores in the surfaces of the metal ohmic electrodes combined on the two side surfaces of the thermosensitive ceramic piece and, at the same time, blocks gaps in the surfaces of areas, that do not have the metal ohmic electrodes, of a peripheral edge of the thermosensitive ceramic piece.

公开(公告)号：US12027406B2

公开(公告)日：2024-07-02

申请号：US17052634

申请日：2019-01-08

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Makoto Kuribayashi ,  Masahiro Inoue ,  Toshimasa Sakakibara

IPC: H01L21/683 ,  C04B37/02 ,  H01L21/687

CPC classification number: H01L21/6833 ,  C04B37/028 ,  C04B37/025 ,  H01L21/68757 ,  H01L21/68785

Abstract: A holding device manufacturing method includes a step of preparing a first joined body which includes a pre-machining ceramic member having a first surface and a fifth surface located opposite the first surface and approximately parallel to the first surface, a base member, and a joining portion disposed between the first surface of the pre-machining ceramic member and a third surface of the base member and joining the pre-machining ceramic member and the base member together. The thickness of the joining portion of the first joined body in a first direction, in which the first surface and the third surface face each other via the joining portion, increases from one end side toward the other end side of the joining portion in a second direction perpendicular to the first direction. The method includes a step of machining the fifth surface of the pre-machining ceramic member in the first joined body.

公开(公告)号：US10037910B2

公开(公告)日：2018-07-31

申请号：US15068936

申请日：2016-03-14

Applicant: NGK INSULATORS, LTD.

Inventor： Takuya Yanoh ,  Kazuma Ohba ,  Tetsuya Kawajiri ,  Hideyoshi Tsuruta

IPC: H01T23/00 ,  H01L21/683 ,  B29C43/20 ,  C04B37/02 ,  H01L21/67 ,  H01L21/687 ,  C04B37/00 ,  B29K33/00 ,  B29K63/00 ,  B29L31/00 ,  B29C43/18 ,  B29C43/36

CPC classification number: H01L21/6833 ,  B29C43/18 ,  B29C43/206 ,  B29C2043/3644 ,  B29K2033/08 ,  B29K2033/12 ,  B29K2063/00 ,  B29L2031/7502 ,  C04B37/008 ,  C04B37/028 ,  C04B2235/96 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/708 ,  C04B2237/72 ,  H01L21/67103 ,  H01L21/6831 ,  H01L21/68757 ,  H01L21/68785

Abstract: A wafer holder 10 includes a resin adhesive layer 16 between a ceramic electrostatic chuck 12 and a metal cooling plate 14. The adhesive layer 16 includes a first layer 16a in contact with the electrostatic chuck 12, a second layer 16b in contact with the cooling plate 14, and an intermediate layer 16c located between the first layer 16a and the second layer 16b. Heat resistance of each of the first layer 16a and the intermediate layer 16c is higher than heat resistance of the second layer 16b, flexibility of the second layer 16b is higher than flexibility of each of the first layer 16a and the intermediate layer 16c, and the layers are in hermetic contact with each other.

公开(公告)号：US20160099163A1

公开(公告)日：2016-04-07

申请号：US14870115

申请日：2015-09-30

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Takakuni NASU ,  Tomonori NIWA ,  Taichi KIBE

IPC: H01L21/683 ,  B32B37/00 ,  G03F7/40 ,  H01L21/687

CPC classification number: G03F7/40 ,  B32B18/00 ,  B32B2457/14 ,  C04B37/021 ,  C04B37/028 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/402 ,  C04B2237/62 ,  C04B2237/64 ,  C04B2237/66 ,  C04B2237/706 ,  H01L21/67103 ,  H01L21/6831 ,  H01L21/68757

Abstract: A method of making a semiconductor manufacturing equipment component, such as an electrostatic chuck, includes an application step of applying a photosensitive metal paste onto a ceramic green sheet, which is to become the body substrate, the photosensitive metal paste being a heating element material; an exposure-and-development step of exposing the photosensitive metal paste, which has been applied onto the ceramic green sheet, to light and developing the photosensitive metal paste to form an intermediate heating element, which is to become the heating element, on the ceramic green sheet; and a firing step of co-firing the ceramic green sheet and the intermediate heating element to form the body substrate and the heating element.

Abstract translation: 一种制造半导体制造设备部件如静电卡盘的方法包括将感光金属浆料施加到作为主体基板的陶瓷生片上的施加步骤，感光金属膏是加热元件材料; 曝光和显影步骤，其将施加到陶瓷生片上的感光金属膏曝光，以使感光性金属膏发光并显影，以形成在陶瓷上成为加热元件的中间加热元件 绿色板材 以及烧结陶瓷生片和中间加热元件以形成主体基板和加热元件的烧制步骤。

公开(公告)号：US08974914B2

公开(公告)日：2015-03-10

申请号：US13279701

申请日：2011-10-24

Applicant: Andreas Meyer ,  Jürgen Schulz-Harder

Inventor： Andreas Meyer ,  Jürgen Schulz-Harder

IPC: B32B15/04 ,  C04B37/00 ,  B82Y30/00 ,  C04B35/634 ,  C04B37/02 ,  H01L23/373

CPC classification number: C04B37/006 ,  B82Y30/00 ,  C04B35/63452 ,  C04B37/021 ,  C04B37/026 ,  C04B37/028 ,  C04B2235/5248 ,  C04B2235/5288 ,  C04B2237/121 ,  C04B2237/124 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/40 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/72 ,  H01L23/3735 ,  H01L2924/0002 ,  Y10T156/10 ,  Y10T428/12542 ,  Y10T428/12549 ,  H01L2924/00

Abstract: A metal-ceramic substrate for electrical circuits or modules includes at least one first outer metal layer forming one first surface side of the metal-ceramic substrate and at least one second outer metal layer forming one second surface side of the metal-ceramic substrate. The outer metal layers are bonded respectively by two-dimensional bonding with the surface sides of a plate-like substrate body.

Abstract translation: 用于电路或模块的金属陶瓷衬底包括形成金属陶瓷衬底的一个第一表面侧的至少一个第一外部金属层和形成金属 - 陶瓷衬底的一个第二表面侧的至少一个第二外部金属层。 外部金属层通过与板状基板主体的表面侧的二维接合分别结合。

公开(公告)号：US08890310B2

公开(公告)日：2014-11-18

申请号：US12730294

申请日：2010-03-24

Applicant: Keunhyuk Lee ,  Oseob Jeon ,  Seungwon Lim

Inventor： Keunhyuk Lee ,  Oseob Jeon ,  Seungwon Lim

IPC: H01L23/495 ,  H01L23/10 ,  H01L23/433 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L23/49575 ,  C04B37/028 ,  C04B2237/343 ,  C04B2237/402 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L25/162 ,  H01L25/165 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A power module package includes a power circuit element, a control circuit element, a lead frame, an aluminum oxide substrate having a heat sink and an insulation layer, and a sealing resin. The control circuit element is electrically connected with the power circuit element to control chips within the power circuit element. The lead frame has external connection terminal leads in its edge and has a first surface to which the power circuit element and the control circuit element are attached and a second surface which is used as a heat transmission path. The heat sink is a plate made of metal such as aluminum and the electrical insulation layer is formed at least on an upper surface of the heat sink and made of aluminum oxide. The electrical insulation layer may be formed over an entire surface of the heat sink. Here, the insulation layer is attached to the second surface by an adhesive, on a region below where the power circuit element is attached, to the first surface of the lead frame. In addition, the sealing resin encloses the power circuit element and the control circuit element, the lead frame, and the metal oxide substrate and exposes the external connection terminals of the lead frame.

Abstract translation: 功率模块封装包括电源电路元件，控制电路元件，引线框架，具有散热器和绝缘层的氧化铝衬底以及密封树脂。 控制电路元件与电源电路元件电连接以控制电源电路元件内的芯片。 引线框架在其边缘具有外部连接端子引线，并且具有附接有电源电路元件和控制电路元件的第一表面和用作传热路径的第二表面。 散热器是由诸如铝的金属制成的板，电绝缘层至少形成在散热器的上表面上并由氧化铝制成。 电绝缘层可以形成在散热器的整个表面上。 这里，绝缘层通过粘合剂，在电力电路元件附接的下方的区域附着到引线框架的第一表面。 此外，密封树脂封装电源电路元件和控制电路元件，引线框架和金属氧化物基板，并且暴露引线框架的外部连接端子。

公开(公告)号：US08808494B2

公开(公告)日：2014-08-19

申请号：US13283490

申请日：2011-10-27

Applicant: Kuo-Chuang Chiu

Inventor： Kuo-Chuang Chiu

IPC: B32B15/04 ,  B32B15/20 ,  B32B37/06 ,  B32B37/14 ,  B32B18/00 ,  B32B37/12 ,  C08L1/00 ,  C08K3/22 ,  C04B35/636 ,  C04B37/02 ,  C04B35/634 ,  B82Y30/00 ,  H01L33/64

CPC classification number: C04B37/028 ,  B82Y30/00 ,  C04B35/63416 ,  C04B35/6342 ,  C04B35/6365 ,  C04B37/025 ,  C04B2235/3281 ,  C04B2235/5445 ,  C04B2235/5454 ,  C04B2235/9607 ,  C04B2237/06 ,  C04B2237/064 ,  C04B2237/068 ,  C04B2237/08 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/366 ,  C04B2237/407 ,  C04B2237/592 ,  C04B2237/60 ,  C04B2237/708 ,  C04B2237/72 ,  H01L33/641 ,  H01L2924/0002 ,  Y10T428/12056 ,  H01L2924/00

Abstract: Disclosed is a bonding structure, including a heat dissipation substrate, a eutectic layer on the heat dissipation substrate, and a copper layer on the eutectic layer. The thermal dissipation substrate includes aluminum oxide, aluminum nitride, or zirconium oxide. The eutectic layer includes aluminum oxide, aluminum nitride, or zirconium oxide doped with zinc, tin, indium, or combinations thereof.

Abstract translation: 公开了一种接合结构，其包括散热基板，散热基板上的共晶层和共晶层上的铜层。 散热基板包括氧化铝，氮化铝或氧化锆。 共晶层包括掺杂有锌，锡，铟或其组合的氧化铝，氮化铝或氧化锆。