公开(公告)号：US11742335B2

公开(公告)日：2023-08-29

申请号：US17120643

申请日：2020-12-14

申请人： InnoLux Corporation

发明人： Shih-Chang Huang ,  Chia-Lun Chen ,  Ming-Hui Chu ,  Chin-Lung Ting ,  Chien-Tzu Chu ,  Hui-Chi Wang

IPC分类号： H01L25/075 ,  H01L27/12 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L25/16 ,  H01L33/54

CPC分类号： H01L25/0753 ,  H01L27/1214 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

摘要： An electronic device is provided. The electronic device includes a driving substrate, a plurality of light-emitting units, and a protective layer. The light-emitting units are electrically connected to the driving substrate. The protective layer covers the light-emitting units, and the protective layer has a Young's modulus less than or equal to 20 MPa.

公开(公告)号：US20230268471A1

公开(公告)日：2023-08-24

申请号：US18307015

申请日：2023-04-26

申请人： NICHIA CORPORATION

发明人： Masakatsu TOMONARI ,  Masahiko SANO

IPC分类号： H01L33/54 ,  H01L33/60 ,  H01L33/58 ,  H01L33/46 ,  H01L33/08 ,  H01L33/50 ,  H01L33/52 ,  H01L25/075 ,  H01L33/28 ,  H01L33/30 ,  H01L33/32 ,  H01L33/62 ,  H01L33/64

CPC分类号： H01L33/54 ,  H01L33/60 ,  H01L33/58 ,  H01L33/46 ,  H01L33/08 ,  H01L33/50 ,  H01L33/52 ,  H01L25/0753 ,  H01L33/28 ,  H01L33/30 ,  H01L33/32 ,  H01L33/502 ,  H01L33/62 ,  H01L33/647 ,  H01L33/642 ,  H01L33/486

摘要： A light emitting device including a first light emitting element and an optical member disposed over the first light emitting element. The optical member includes a light transmissive member and a ceramic component. The light transmissive member has a first upper surface, a second upper surface, and a lower surface opposing to the first upper surface and a second upper surface. The ceramic component is disposed on the second upper surface of the light transmissive member. The light transmissive member and the ceramic component each has a portion that overlaps with the first light emitting element when viewed in plan view.

公开(公告)号：US20230261162A1

公开(公告)日：2023-08-17

申请号：US18135194

申请日：2023-04-17

申请人： InnoLux Corporation

发明人： Wan-Ling Huang ,  Shu-Ming Kuo ,  Tsau-Hua Hsieh ,  Tzu-Min Yan

IPC分类号： H01L33/62 ,  H01L33/52 ,  H01L33/50

CPC分类号： H01L33/62 ,  H01L33/52 ,  H01L33/50

摘要： An electronic device includes a first substrate, a circuit layer, a conductive wire, and an adhesive layer. The first substrate has a first surface, a second surface and a first side surface. The second surface is opposite to the first surface, the first side surface is located between the first surface and the second surface, and the first side surface connects the first surface and the second surface. The circuit layer is disposed on the first surface of the first substrate. The conductive wire is electrically connected to the circuit layer. The adhesive layer is disposed on the first surface and the circuit layer. The adhesive layer has a second side surface, and a first portion of the conductive wire is disposed on the first side surface of the first substrate and the second side surface of the adhesive layer.

公开(公告)号：US20230245932A1

公开(公告)日：2023-08-03

申请号：US18296493

申请日：2023-04-06

申请人： InnoLux Corporation

发明人： Chia-Hsiung CHANG ,  Ting-Kai HUNG ,  Hsiao-Lang LIN

IPC分类号： H01L21/66 ,  H01L25/16 ,  H01L25/00 ,  H01L33/44 ,  H01L33/52 ,  H01L33/62

CPC分类号： H01L22/22 ,  H01L25/167 ,  H01L25/50 ,  H01L33/44 ,  H01L33/52 ,  H01L33/62 ,  H01L2933/005 ,  H01L33/50

摘要： Methods for manufacturing an electronic device are provided. A representative method includes providing a substrate. The substrate has an active layer, a first patterned metal layer passing through a passivation layer to electrically connected to the active layer, a second patterned metal layer passing through an insulating layer to electrically connected to the first patterned metal layer, and a metal layer under the second patterned metal layer. A part of the metal layer does not serve as a portion of a thin film transistor, and the part of the metal layer serves as a portion of a gate line. The method includes providing a carrier substrate supporting a plurality of elements, conducting a testing to the elements, transferring the elements from the carrier substrate to the second patterned metal layer of the substrate, and fixing the elements to the substrate.

公开(公告)号：US11713418B2

公开(公告)日：2023-08-01

申请号：US17558774

申请日：2021-12-22

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Yuho Won ,  Hwea Yoon Kim ,  Jeong Hee Lee ,  Eun Joo Jang ,  Hyo Sook Jang

IPC分类号： C09K11/88 ,  C09K11/02 ,  C01G9/00 ,  H01L33/50 ,  B82Y20/00 ,  B82Y40/00 ,  H10K50/115 ,  H10K102/00

CPC分类号： C09K11/883 ,  C01G9/006 ,  C09K11/025 ,  H01L33/50 ,  B82Y20/00 ,  B82Y40/00 ,  C01P2004/04 ,  C01P2004/64 ,  C01P2006/60 ,  H10K50/115 ,  H10K2102/00

摘要： A quantum dot including zinc, tellurium, selenium, and sulfur, wherein the quantum dot comprises a core and a shell disposed on the core, and wherein the quantum dot is a cadmium-free red light-emitting quantum dot and has an emission peak wavelength of greater than or equal to about 600 nanometers (nm), and efficiency of greater than or equal to about 50%.

公开(公告)号：US11710812B2

公开(公告)日：2023-07-25

申请号：US17332378

申请日：2021-05-27

申请人： EPISTAR CORPORATION

发明人： Min-Hsun Hsieh ,  Hsin-Mao Liu ,  Ying-Yang Su

IPC分类号： H01L33/58 ,  H01L25/075 ,  H01L33/50 ,  H01L27/15 ,  H01L33/60 ,  H01L23/00

CPC分类号： H01L33/58 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/505 ,  H01L33/60 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L33/50 ,  H01L2224/06102 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/83886 ,  H01L2933/0058

摘要： A light-emitting device includes a light-emitting element having a first-type semiconductor layer, a second-type semiconductor layer, an active stack between the first-type semiconductor layer and the second-type semiconductor layer, a bottom surface, and a top surface. A first electrode is disposed on the bottom surface and electrically connected to the first-type semiconductor layer. A second electrode is disposed on the bottom surface and electrically connected to the second-type semiconductor layer. A supporting structure is disposed on the top surface. The supporting structure has a thickness and a maximum width. A ratio of the maximum width to the thickness is of 2˜150.

公开(公告)号：US20230231001A1

公开(公告)日：2023-07-20

申请号：US17695848

申请日：2022-03-16

申请人： PlayNitride Display Co., Ltd.

发明人： Sheng-Yuan Sun ,  LOGANATHAN MURUGAN ,  Po-Wei Chiu

IPC分类号： H01L27/15 ,  H01L33/50 ,  H01L33/58

CPC分类号： H01L27/156 ,  H01L33/50 ,  H01L33/58

摘要： A micro light-emitting diode display device includes a display substrate, multiple pixels, and at least one color conversion layer. The pixels are disposed on the display substrate. Each of the pixels includes multiple sub-pixels. Each of the sub-pixels includes at least one micro light-emitting diode. The at least one color conversion layer is disposed on the pixels. The at least one color conversion layer is continuously disposed on at least a part of sub-pixels of different pixels along a same direction.

公开(公告)号：US11705480B2

公开(公告)日：2023-07-18

申请号：US17733262

申请日：2022-04-29

申请人： EPISTAR CORPORATION

发明人： Chao Hsing Chen ,  Jia Kuen Wang ,  Chien Fu Shen ,  Chun Teng Ko

IPC分类号： H01L27/15 ,  H01L33/64 ,  H01L33/50 ,  H01L33/60 ,  H01L33/48 ,  H01L33/62 ,  H01L25/075

CPC分类号： H01L27/156 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/644 ,  H01L33/64 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00

摘要： An optoelectronic device comprises an epitaxial stack, comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a trench exposing a portion of the first semiconductor layer; a first insulating layer formed on a side wall of the trench to electrically insulate from the active layer and the second semiconductor layer; a first electrode formed on the trench; a second electrode formed on the second semiconductor layer; a supporting device covering the epitaxial stack; an optical layer covering the first electrode and the second electrode, comprising a plurality of openings corresponding to positions of the first electrodes and the second electrodes; a fifth electrode electrically connected with the first electrode; and a sixth electrode electrically connected with the second electrode, wherein the fifth electrode and the sixth electrode each comprises a side comprising a length longer that of an edge of the epitaxial stack.

公开(公告)号：US20230225026A1

公开(公告)日：2023-07-13

申请号：US18124580

申请日：2023-03-22

申请人： Seoul Semiconductor Co., Ltd.

发明人： Chung Hoon LEE

IPC分类号： H05B45/20 ,  H01L33/50 ,  G09G3/32 ,  H05B45/22 ,  G09G3/20

CPC分类号： H05B45/20 ,  H01L33/50 ,  G09G3/32 ,  H05B45/22 ,  G09G3/2003

摘要： A lighting device including a first light emitter including a plurality of light sources each being configured to emit light with a different color temperature, a second light emitter including at least one light emitting structure to emit light having a different color range than that emitted from the first light emitter, a controller to adjust characteristics of light emitted from the first and second light emitters, a user interface member configured to receive input of a user and connected to the controller, and a storage medium connected to the controller, in which each of the light sources includes a light-emitting diode chip and a wavelength conversion member to convert a wavelength range of light emitted from the light-emitting diode chip, and the controller is further configured to control the first and second light emitters according to a spectrum of light stored in the storage medium.

公开(公告)号：US11699688B2

公开(公告)日：2023-07-11

申请号：US17106630

申请日：2020-11-30

申请人： NICHIA CORPORATION

发明人： Eiko Minato ,  Masaaki Katsumata

IPC分类号： H01L25/075 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/58

CPC分类号： H01L25/0753 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0066

摘要： A surface-emitting light source includes: light-emitting modules; a wiring substrate including a base member having a surface at a light-emitting modules side and a rear surface opposite to that, a wiring layer on the rear surface of the base member and including wiring pads being portions of the wiring layer, electrically-conductive members each supplied across corresponding two or more of a plurality of vias in each of the wiring pads, and a covering layer covering the wiring layer and defining openings in each of which a portion of a corresponding one of the wiring pads is exposed; and an adhesive layer between the light-emitting modules and the wiring substrate. Each light-emitting module has an array of light emitting devices. The covering layer defines the openings at locations corresponding to the wiring pads with an area dimension smaller than respective area dimensions of the wiring pads.