公开(公告)号：US06388208B1

公开(公告)日：2002-05-14

申请号：US09360002

申请日：1999-07-23

Applicant: Sepehr Kiani ,  Mikhail Khusid

Inventor： Sepehr Kiani ,  Mikhail Khusid

IPC: H01R909

CPC classification number: H05K1/0222 ,  H01R12/523 ,  H05K1/112 ,  H05K1/115 ,  H05K3/043 ,  H05K3/308 ,  H05K3/3421 ,  H05K3/403 ,  H05K3/429 ,  H05K2201/09645 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10893 ,  H05K2201/10969 ,  H05K2203/0455

Abstract: An interconnection circuit and related techniques are described. The interconnection circuit includes a plated through hole having a plurality of electrically isolated segments with at least one of the plurality of electrically isolated segments coupled to a signal path and at least one of the electrically isolated segments coupled to ground. With this arrangement, the circuit provides a signal path between a first and a second different layers of a multilayer. By providing one segment as a signal segment and another segment as a ground segment the size and shape of the electrically isolated segments can be selected to provide the interconnection circuit having a predetermined impedance characteristic. The interconnection circuit can thus be impedance matched to circuit board circuits, devices and transmission lines, such as striplines, microstrips and co-planar waveguides. This results in an interconnection circuit which maintains the integrity of relatively high-frequency signals propagating through the interconnection circuit from the first layer to the second layer. The interconnect circuits can be formed by creating distinct conductor paths within the cylindrical plated through-holes using variety of manufacturing techniques including, but not limited to, broaching techniques, electrostatic discharge milling (EDM) techniques and laser etching techniques.

Abstract translation: 描述了互连电路及相关技术。 互连电路包括具有多个电隔离段的电镀通孔，其中多个电隔离段中的至少一个耦合到信号路径以及耦合到地的电隔离段中的至少一个。 利用这种布置，电路提供了多层的第一和第二不同层之间的信号路径。 通过将一个段作为信号段，另一个段作为接地段，可以选择电隔离段的大小和形状，以提供具有预定阻抗特性的互连电路。 因此，互连电路可以与电路板电路，器件和传输线（例如带状线，微带和共面波导）阻抗匹配。 这导致互连电路，其维持通过互连电路从第一层传播到第二层的相对高频信号的完整性。 互连电路可以通过使用各种制造技术（包括但不限于拉削技术，静电放电铣削（EDM）技术和激光蚀刻技术）在圆柱形电镀通孔内产生不同的导体路径来形成。

公开(公告)号：US5922989A

公开(公告)日：1999-07-13

申请号：US711963

申请日：1996-09-06

Applicant: Akimasa Tsunoda ,  Yuichi Nagase ,  Seiichi Katagiri ,  Shigeo Suzuki ,  Kiyohumi Nakayama ,  Kenji Hirota ,  Noboru Sato ,  Tatsuya Tsukagoshi

Inventor： Akimasa Tsunoda ,  Yuichi Nagase ,  Seiichi Katagiri ,  Shigeo Suzuki ,  Kiyohumi Nakayama ,  Kenji Hirota ,  Noboru Sato ,  Tatsuya Tsukagoshi

IPC: H05K1/18 ,  H01H1/58 ,  H01R4/02 ,  H01R12/55 ,  H05K3/30 ,  H05K3/34 ,  H01L23/02

CPC classification number: H01R4/028 ,  H05K3/3447 ,  H01H1/5805 ,  H01R12/58 ,  H05K2201/10053 ,  H05K2201/10856 ,  H05K2203/1147 ,  H05K2203/304 ,  H05K3/308

Abstract: An electronic part capable of preventing a flux from intruding thereinto without using a sealing material can be provided. In the electronic part 1, terminals 3 to be inserted through electrode holes of a circuit board are projected from a casing 1a. In the terminals 3, there are provided cut-in portions 8 extending to a space formed between the casing 1a and the circuit board when the terminals 3 are inserted through the electrode holes.

Abstract translation: 可以提供一种能够防止焊剂在不使用密封材料的情况下侵入其中的电子部件。 在电子部件1中，从电路基板的电极孔插入的端子3从壳体1a突出。 在端子3中，当端子3插入通过电极孔时，设置有延伸到形成在壳体1a和电路板之间的空间的切口部分8。

公开(公告)号：US3764955A

公开(公告)日：1973-10-09

申请号：US3764955D

申请日：1972-05-17

Applicant: AMP INC

Inventor： WARD J

IPC: H01R12/71 ,  H05K3/30 ,  H05K3/36 ,  H05K1/07 ,  H01R13/62

CPC classification number: H05K3/366 ,  H01R12/716 ,  H05K3/308 ,  H05K2201/10386 ,  H05K2201/10424 ,  H05K2201/1059 ,  H05K2201/10856

Abstract: Connecting and mounting means for substrates comprises an elongated mounting bar having connecting devices mounted therein at spaced intervals. The connecting devices have aligned spring receptacles which receive and support the substrate and have posts which are adapted to enter holes in a printed circuit board.

Abstract translation: 用于基板的连接和安装装置包括细长的安装杆，其具有以间隔的间隔安装在其中的连接装置。 连接装置具有对准的弹簧容器，其接收和支撑衬底并具有适于进入印刷电路板中的孔的柱。

公开(公告)号：US20150044889A1

公开(公告)日：2015-02-12

申请号：US14318851

申请日：2014-06-30

Applicant: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED ,  LITE-ON TECHNOLOGY CORP.

Inventor： CHUNG-FU WANG ,  NIEN-HUNG YAO ,  HSIN-YU YANG ,  YU-SHAN KAO

IPC: H01R4/02 ,  H05K1/11 ,  H01R12/57

CPC classification number: H01R4/02 ,  H01R12/57 ,  H01R12/585 ,  H01R12/707 ,  H01R12/716 ,  H05K1/11 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10856 ,  H05K2201/10878

Abstract: An electrical connector includes an insulating body having a bottom surface, a receiving groove formed in the bottom surface, and at least one support block projecting downwardly from the bottom surface for connection with a circuit board and cooperating with the bottom surface to define a venting space that communicates with the receiving groove and a solder hole in the circuit board. A conductive terminal includes a first positioning portion extending into and positioned in the receiving groove, and a second positioning portion connected to the first positioning portion and extending through the venting space and adapted to be positioned in the solder hole.

Abstract translation: 电连接器包括具有底表面的绝缘体，形成在底表面中的接收槽，以及从底表面向下伸出的至少一个支撑块，用于与电路板连接并与底表面配合以形成通气空间 其与电路板中的接收槽和焊接孔连通。 导电端子包括延伸到接收槽中并定位在接收槽中的第一定位部分和连接到第一定位部分并延伸穿过通气空间并适于定位在焊料孔中的第二定位部分。

公开(公告)号：US20130316551A1

公开(公告)日：2013-11-28

申请号：US13481176

申请日：2012-05-25

Applicant: James A. Day, JR. ,  Zachary B. Durham ,  Luke D. Remis ,  Tony C. Sass ,  Gregory D. Sellman

Inventor： James A. Day, JR. ,  Zachary B. Durham ,  Luke D. Remis ,  Tony C. Sass ,  Gregory D. Sellman

IPC: H01R12/58 ,  H05K3/30

CPC classification number: H05K13/04 ,  H01R12/585 ,  H05K1/115 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/09845 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10878

Abstract: A universal press-fit connection allows a component having a connector pin to be connected to a compatible plated through hole of a circuit board regardless of circuit board thickness. The connector pin includes a proximate end adjacent the component, a distal end with a fork lock, and a compliant portion between the proximate and distal ends. A multi-width through hole includes a first portion partially extending through the circuit board and a second, wider portion extending beyond the first portion. The fork lock initially moves radially inward upon insertion into the first portion via flexing of the compliant portion, and re-expands when entering the second portion. The compliant portion engages the through hole and the fork lock secures the connector pin in the through hole.

Abstract translation: 通用压配合连接允许具有连接器引脚的部件连接到电路板的兼容的电镀通孔，而与电路板厚度无关。 连接器销包括邻近部件的近端，具有叉锁的远端以及近端和远端之间的柔顺部分。 多宽度通孔包括部分延伸穿过电路板的第一部分和延伸超过第一部分的第二较宽部分。 当通过柔性部分的弯曲插入到第一部分中时，叉锁首先向内径向移动，并且当进入第二部分时，叉锁重新膨胀。 柔性部分接合通孔，叉锁将连接器销固定在通孔中。

公开(公告)号：US20130264102A1

公开(公告)日：2013-10-10

申请号：US13851544

申请日：2013-03-27

Applicant: TELLABS OY

Inventor： Antti HOLMA ,  Jari-Pekka LAIHONEN

IPC: H05K1/11 ,  H05K13/04 ,  H05K1/02

CPC classification number: H05K1/11 ,  H05K1/0201 ,  H05K3/3447 ,  H05K13/04 ,  H05K2201/09781 ,  H05K2201/10303 ,  H05K2201/10765 ,  H05K2201/10856 ,  H05K2203/044

Abstract: A system provided with a solder joint includes: a circuit board (101) provided with an aperture (102), an electrical component (103) including a conductor foot (104) protruding through the aperture, and soldering metal (105) inside the aperture and in contact with the conductor foot. The system further includes a thermal conductor element (106) including a first portion outside the aperture and a second portion inside the aperture and in contact with the soldering metal. The thermal conductor element is capable of conducting heat and thereby it intensifies the heat transfer into the aperture during pre-heating which precedes the process phase when the molten soldering metal is enabled to be absorbed into the aperture. Thus the reliability of the solder joint is improved, i.e. a risk of a faulty “cold” solder is decreased.

Abstract translation: 设置有焊接接头的系统包括：设置有孔（102）的电路板（101），包括突出穿过孔的导体脚（104）的电气部件（103）和孔内的焊接金属（105） 并与导体脚接触。 该系统还包括热导体元件（106），其包括孔外部的第一部分和孔内的第二部分并与焊接金属接触。 热导体元件能够传导热量，从而当熔融焊接金属能够被吸收到孔中时，其在预加热之前加热到加工阶段之前的热传递。 因此，提高了焊点的可靠性，即，存在故障“冷”焊料的风险降低。

公开(公告)号：US20120164865A1

公开(公告)日：2012-06-28

申请号：US12980115

申请日：2010-12-28

Applicant: Reinhold Bayerer

Inventor： Reinhold Bayerer

IPC: H01R13/62 ,  H01R43/00

CPC classification number: H05K3/308 ,  H01L2924/0002 ,  H01R12/585 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/1059 ,  H05K2201/10856 ,  Y10T29/49117 ,  H01L2924/00

Abstract: A connecting system for electrically connecting electronic devices includes an electrically conductive first connector, an electrically conductive second connector and a clip element. The first connector is insertable in the second connector. The first connector or the second connector has a first opening into which the clip element can be inserted. In the inserted state, the clip element generates a contact pressure due to which the first connector and the second connector are pressed against one another so that an electrical contact between the first connector and the second connector is safeguarded.

Abstract translation: 用于电连接电子设备的连接系统包括导电的第一连接器，导电的第二连接器和夹子元件。 第一连接器可插入第二连接器。 第一连接器或第二连接器具有可插入夹子元件的第一开口。 在插入状态下，夹子元件产生接触压力，由此第一连接器和第二连接器彼此挤压，从而保护第一连接器和第二连接器之间的电接触。

公开(公告)号：US20120122326A1

公开(公告)日：2012-05-17

申请号：US13319863

申请日：2010-05-07

Applicant: Werner Kallee

Inventor： Werner Kallee

IPC: H01R12/51

CPC classification number: H05K1/141 ,  H01C1/014 ,  H01C1/022 ,  H01C1/14 ,  H01C7/10 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/049 ,  H05K2201/10022 ,  H05K2201/10181 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10871

Abstract: In order to releasably mount an electronic or electric component, the component is combined in a subassembly along with a support element and a housing. An insulating member that is penetrated by through-holes is mounted on the external face of the support element. Connecting elements are accommodated within said through-holes. The connecting elements are electrically and mechanically connected to the support element on one side and project from the front of the insulating member on the other side, where the connecting elements are designed as contact elements that are to be inserted into plated-through bores of a printed circuit board. This allows the electronic component to be plugged as a subassembly to the housing containing the printed circuit board and be removed again as required. If necessary, multiple components can be arranged on the support element inside the housing if said components form a functional unit.

Abstract translation: 为了可释放地安装电子或电气部件，该部件与支撑元件和壳体一起组合在子组件中。 通过贯通孔的绝缘构件安装在支撑元件的外表面上。 连接元件容纳在所述通孔内。 连接元件在一侧电连接和机械地连接到支撑元件，并且在另一侧从绝缘构件的前部突出，其中连接元件被设计为接触元件，该接触元件将被插入到 印刷电路板。 这允许将电子部件作为子组件插入到包含印刷电路板的外壳上，并根据需要再次移除。 如果需要，如果所述组件形成功能单元，则可以在壳体内的支撑元件上布置多个部件。

公开(公告)号：US07578681B2

公开(公告)日：2009-08-25

申请号：US12222321

申请日：2008-08-07

Applicant: Takayoshi Honda ,  Minoru Hozuka

Inventor： Takayoshi Honda ,  Minoru Hozuka

IPC: H01R12/00 ,  H05K1/00

CPC classification number: H05K3/3447 ,  H01R12/57 ,  H01R12/58 ,  H01R12/724 ,  H01R43/0256 ,  H05K1/116 ,  H05K2201/09381 ,  H05K2201/10189 ,  H05K2201/10787 ,  H05K2201/1084 ,  H05K2201/10848 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K2203/1178

Abstract: An electronic device includes a printed circuit board and an electronic element having a terminal. The terminal has a surface section and an insertion section. The printed circuit board includes a through hole extending from a first surface to a second surface of the printed circuit board, a surface land disposed on the first surface, and an insertion land integrally disposed on a sidewall of the through hole and on a periphery around the through hole. The surface section is coupled with the surface land through a solder. The insertion section is disposed in the through hole and is coupled with the insertion land through the solder. The surface section has a recess part and a portion of recess part is disposed so as to be axially aligned with a portion of the through hole.

公开(公告)号：US07470147B2

公开(公告)日：2008-12-30

申请号：US10787681

申请日：2004-02-24

Applicant: Victor Prokofiev

Inventor： Victor Prokofiev

IPC: H01R13/73

CPC classification number: H05K3/308 ,  H01L23/49827 ,  H01L24/72 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01R12/52 ,  H01R12/58 ,  H01R13/052 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2201/1059 ,  H05K2201/10856

Abstract: A socket may be formed with socket pins that include two spring biased arms biased to extend away from one another. The arms may be provided with tapered upper surfaces that engage contact holes on a pin guide 18 of an integrated circuit package, camming the socket pin arms together. The pin guide may have a tapered via structure that expands as it extends into the package. Thus, as the spring arms spread apart inside the pin guide, they may rotate through an angle which causes contacting surfaces on the spring arms and the pin guide to be parallel, creating good surface contact.

Abstract translation: 插座可以形成有插座销，插座销包括被偏置以彼此远离延伸的两个弹簧偏置臂。 臂可以设置有锥形上表面，其接合集成电路封装的引脚引导件18上的接触孔，将插座销臂相互固定在一起。 销引导件可以具有锥形通孔结构，其在其延伸到包装中时膨胀。 因此，当弹簧臂在销引导件内分开时，它们可以旋转一定角度，这导致弹簧臂上的接触表面和销引导件平行，形成良好的表面接触。