Resin composition, prepreg and their uses
    46.
    发明申请
    Resin composition, prepreg and their uses 有权
    树脂组合物,预浸料及其用途

    公开(公告)号:US20090203279A1

    公开(公告)日:2009-08-13

    申请号:US12379042

    申请日:2009-02-11

    摘要: A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d) for a high-multilayer and high-frequency printed wiring board, which resin composition is excellent in varnish shelf life at low temperature and does not show a decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition.

    摘要翻译: 含有具有聚苯醚骨架的双功能亚苯基醚低聚物的末端乙烯基化合物(a),特殊的马来酰亚胺化合物(b),萘酚芳烷基型氰酸酯树脂(c)和萘-2-甲酸酯树脂的乙烯基化合物系树脂组合物, 骨架改性的酚醛清漆型环氧树脂(d)用于高多层和高频印刷线路板,该树脂组合物在低温下的清漆保质期优异,并且不显示多层成型性降低,吸湿后的耐热性 ,电气特性和剥离强度,以及预浸料,覆金属箔层压板和使用上述树脂组合物的树脂片。

    Thermosetting polyphenylene ether resin composition, cured resin composition obtained therefrom, and laminated structure
    49.
    发明授权
    Thermosetting polyphenylene ether resin composition, cured resin composition obtained therefrom, and laminated structure 失效
    热固性聚苯醚树脂组合物,由其获得的固化树脂组合物和层压结构

    公开(公告)号:US06558783B1

    公开(公告)日:2003-05-06

    申请号:US09582526

    申请日:2000-06-28

    IPC分类号: B32B2704

    摘要: Disclosed are a curable polyphenylene ether (PPE) resin composition comprising (a) a PPE resin and (b) a of a compound having a 3,4-dihydro-3-substituted-1,3-benzoxazine skeleton (DSBS compound), or a mixture of the DSBS compound and a ring-opening polymerization re-action product thereof; a cured PPE resin composition obtainable by curing the curable PPE resin composition; and a laminate structure obtained by using the curable or cured PPE resin composition. The curable PPE resin composition exhibits, after cured, excellent chemical resistance, moisture resistance, dielectric characteristics, heat resistance, flame retardancy and dimensional stability, so that it can be used as a dielectric, insulating or heat resistant material in the electrical, electronic, space and aircraft industries. Especially, it can be advantageously used as a resin composition for forming insulating layers, such as substrates for a single-sided, double-sided or multi-layer printed circuit board, a flexible printed circuit board and a semi-rigid circuit board, and a substrate for a structure having excellent heat removal characteristics.

    摘要翻译: 公开了包含(a)PPE树脂和(b)具有3,4-二氢-3-取代-1,3-苯并恶嗪骨架(DSBS化合物)的化合物的可固化聚苯醚(PPE)树脂组合物,或 DSBS化合物与其开环聚合反应产物的混合物; 可固化的PPE树脂组合物可固化的PPE树脂组合物; 以及通过使用可固化或固化的PPE树脂组合物获得的层压结构。 可固化PPE树脂组合物在固化后表现出优异的耐化学性,耐湿性,介电特性,耐热性,阻燃性和尺寸稳定性,使其可用作电气,电子, 太空和飞机行业。 特别是,作为用于形成绝缘层的树脂组合物,例如单面,双面或多层印刷电路板,柔性印刷电路板和半刚性电路板的基板,可以有利地使用,以及 用于具有优异散热特性的结构的基板。