公开(公告)号：US11973039B2

公开(公告)日：2024-04-30

申请号：US17336078

申请日：2021-06-01

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Chia-Hao Sung ,  Hsuan-Yu Chen ,  Yu-Kai Lin

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L23/562 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/214 ,  H01L2924/3511

Abstract: A semiconductor device package includes a semiconductor die, a first conductive element, a second conductive element, a metal layer, and a first redistribution layer (RDL). The semiconductor die includes a first surface and a second surface opposite to the first surface. The first conductive element is disposed on the second surface of the semiconductor die. The second conductive element is disposed next to the semiconductor die. The metal layer is disposed on the second conductive element and electrically connected to the second conductive element. The first RDL is disposed on the metal layer and electrically connected to the metal layer.

公开(公告)号：US11967559B2

公开(公告)日：2024-04-23

申请号：US17535400

申请日：2021-11-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Chi Lee ,  Chiu-Wen Lee ,  Jung Jui Kang

IPC: H01L23/538 ,  H01L25/065

CPC classification number: H01L23/5384 ,  H01L23/5386 ,  H01L25/0655

Abstract: An electronic package is provided. The electronic package includes a semiconductor substrate. The semiconductor substrate includes a first active region and a first passive region separated from the first active region. The first active region is configured to regulate a power signal. The first passive region is configured to transmit a data signal.

公开(公告)号：US11961831B2

公开(公告)日：2024-04-16

申请号：US17408297

申请日：2021-08-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： You-Lung Yen ,  Bernd Karl Appelt

IPC: H01L25/18 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/00

CPC classification number: H01L25/18 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49811 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/48 ,  H01L25/50 ,  H01L2224/48141 ,  H01L2224/48227

Abstract: An electronic package, a semiconductor package structure and a method for manufacturing the same are provided. The electronic package includes a carrier, a first electronic component, an electrical extension structure, and an encapsulant. The carrier has a first face and a second face opposite to the first face. The first electronic component is adjacent to the first face of the carrier. The electrical extension structure is adjacent to the first face of the carrier and defines a space with the carrier for accommodating the first electronic component, the electrical extension structure is configured to connect the carrier with an external electronic component. The encapsulant encapsulates the first electronic component and at least a portion of the electrical extension structure.

公开(公告)号：US20240113061A1

公开(公告)日：2024-04-04

申请号：US18530123

申请日：2023-12-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Chi-Han CHEN ,  Chang-Yu LIN ,  Jr-Wei LIN ,  Chih-Pin HUNG

IPC: H01L23/00

CPC classification number: H01L24/17 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/02373 ,  H01L2224/02375 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17177 ,  H01L2224/73204 ,  H01L2224/81951

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

公开(公告)号：US20240112978A1

公开(公告)日：2024-04-04

申请号：US17956682

申请日：2022-09-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Vikas GUPTA ,  Mark GERBER

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L23/3735 ,  H01L23/3121 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/562 ,  H01L24/32 ,  H01L2224/32225

Abstract: An electronic package is provided. The electronic package includes an insulating carrier, a first conductive layer, and an electronic component. The first conductive layer is disposed over the insulating carrier. The electronic component is disposed over the first conductive layer and electrically connected to the first conductive layer, wherein the insulating carrier is configured to dissipate heat from the electronic component to a second side of the insulating carrier opposite to a first side facing the electronic component.

公开(公告)号：US11948852B2

公开(公告)日：2024-04-02

申请号：US17239483

申请日：2021-04-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh

IPC: H01L23/367 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538

CPC classification number: H01L23/367 ,  H01L21/4846 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2224/16237

Abstract: The present disclosure provides a semiconductor device package including a first substrate, a second substrate disposed over the first substrate, an electronic component disposed between the first substrate and the second substrate, a spacer disposed between the first substrate and the electronic component, and a supporting element disposed on the first substrate and configured to support the second substrate. The spacer is configured to control a distance between the first substrate and the second substrate through the electronic component. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US20240096779A1

公开(公告)日：2024-03-21

申请号：US17949142

申请日：2022-09-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Hao CHANG

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L23/4985 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/5387 ,  H01L24/13

Abstract: A flexible package is provided. The flexible package includes a first carrier and a second carrier. The second carrier is electrically connected to the first carrier. The second carrier is at least partially embedded in the first carrier, and an electrical connection interface between the first carrier and the second carrier is within the first carrier.

公开(公告)号：US20240094460A1

公开(公告)日：2024-03-21

申请号：US17949143

申请日：2022-09-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/30

CPC classification number: G02B6/12004 ,  G02B6/1228 ,  G02B6/305

Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component, a connection structure, and an electronic component. The photonic component has an active surface. The connection structure is in contact with the active surface of the photonic component. The electronic component is embedded in the connection structure. The connection structure includes a first redistribution structure in contact with the active surface of the photonic component.

公开(公告)号：US20240063163A1

公开(公告)日：2024-02-22

申请号：US18498931

申请日：2023-10-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Pin TSAI ,  Ming-Chi LIU ,  Yu-Ting LU ,  Kai-Chiang HSU ,  Che-Ting LIU

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L23/498 ,  H01L25/10 ,  H01L21/683 ,  H01L21/78 ,  H01L21/56

CPC classification number: H01L24/24 ,  H01L23/3128 ,  H01L24/05 ,  H01L23/295 ,  H01L23/49838 ,  H01L24/25 ,  H01L25/105 ,  H01L21/6836 ,  H01L21/78 ,  H01L21/565 ,  H01L24/19 ,  H01L24/97 ,  H01L23/49827 ,  H01L2924/35121 ,  H01L2221/68381 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/19102 ,  H01L2224/2518 ,  H01L2224/24226

Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.

公开(公告)号：US20240063159A1

公开(公告)日：2024-02-22

申请号：US17891949

申请日：2022-08-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： An-Hsuan HSU ,  Chin-Li KAO

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/498

CPC classification number: H01L24/08 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/35121 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06589 ,  H01L2224/08145 ,  H01L2224/32145 ,  H01L2224/32221 ,  H01L2224/08221 ,  H01L2224/80098 ,  H01L2224/80895 ,  H01L2224/83098 ,  H01L2224/05541 ,  H01L2224/05556 ,  H01L2224/08503 ,  H01L2224/05647 ,  H01L2224/05605 ,  H01L2224/80815

Abstract: A package structure is disclosed. The package structure includes a substrate including a conductive element and a plurality of wires having a surface area through which heat of the conductive element can be dissipated, lowering a bonding temperature of the conductive element. The package structure also includes a conductive layer disposed between the conductive element of the substrate and the plurality of wires. The conductive contact layer attaches the plurality of wires over the conductive element.