公开(公告)号：US06191952B1

公开(公告)日：2001-02-20

申请号：US09067708

申请日：1998-04-28

申请人： Miquel A. Jimarez ,  Eric A. Johnson ,  Li Li ,  Jan Obrzut

发明人： Miquel A. Jimarez ,  Eric A. Johnson ,  Li Li ,  Jan Obrzut

IPC分类号： H05K118

CPC分类号： H01L23/49894 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00

摘要： Flip-chip electronic packages are provided with a compliant surface layer, normally positioned between an underfill layer and a substrate such as a chip carrier or a printed circuit board or card, which reduces stress and strain resulting from differences in coefficients of thermal expansion between the chip and substrate. The compliant layer, which should have a storage modulus of less than ½ the modulus of the substrate, preferably between about 50,000 psi and about 20,000 psi, may comprise rubbery materials such as silicone, virco-plastic polymers such as polytetrafluoroethylene or interpenetrating polymer networks (IPNs). Photosensitive IPNs used for solder marks are preferred.

摘要翻译： 倒装芯片电子封装设置有通常位于底部填充层和诸如芯片载体或印刷电路板或卡之类的基板之间的顺应性表面层，其减少了由于两者之间的热膨胀系数差异导致的应力和应变 芯片和基板。 应该具有小于衬底模量的1/2的柔性层，优选在约50,000psi和约20,000psi之间的弹性层可以包括橡胶状材料，例如硅树脂，诸如聚四氟乙烯的环氧塑料聚合物或互穿聚合物网络（ IPN）。 用于焊锡标记的光敏IPN是优选的。

公开(公告)号：US5972642A

公开(公告)日：1999-10-26

申请号：US989860

申请日：1997-12-12

申请人： Bent Flen.o slashed. ,  Ib Christensen ,  Robert Larsen ,  Steffen Radich Johansen ,  Eric A. Johnson

发明人： Bent Flen.o slashed. ,  Ib Christensen ,  Robert Larsen ,  Steffen Radich Johansen ,  Eric A. Johnson

IPC分类号： A23C19/00 ,  A23D7/005 ,  A23J1/18 ,  A23K20/179 ,  A23K50/80 ,  A23L5/44 ,  A23L5/46 ,  A23L17/00 ,  C12N1/16 ,  C12P23/00 ,  C12R1/645

CPC分类号： C12R1/645 ,  A23D7/0053 ,  A23D7/0056 ,  A23J1/18 ,  A23K20/179 ,  A23K50/80 ,  A23L17/70 ,  A23L5/44 ,  A23L5/46 ,  C12P23/00

摘要： An isolated pure culture of a strain of the yeast Phaffia rhodozyma which produces large amounts of astaxanthin, in excess of about 600 micrograms per gram of Phaffia rhodozyma dry matter, as determined by HPLC analysis, is disclosed.

摘要翻译： 公开了通过HPLC分析测定的，产生大量虾青素的酵母红酵母菌的分离的纯培养物，其超过约600微克/克红发夫酵母干物质。

公开(公告)号：US5831828A

公开(公告)日：1998-11-03

申请号：US71630

申请日：1993-06-03

申请人： Lawrence R. Cutting ,  Michael A. Gaynes ,  Eric A. Johnson ,  Cynthia S. Milkovich ,  Jeffrey S. Perkins ,  Mark V. Pierson ,  Steven E. Poetzinger ,  Jerzy Zalesinski

发明人： Lawrence R. Cutting ,  Michael A. Gaynes ,  Eric A. Johnson ,  Cynthia S. Milkovich ,  Jeffrey S. Perkins ,  Mark V. Pierson ,  Steven E. Poetzinger ,  Jerzy Zalesinski

IPC分类号： H01L21/48 ,  H01L23/367 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/12 ,  H05K3/34 ,  H05K7/20

CPC分类号： H05K7/20454 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/3672 ,  H01L23/5387 ,  H05K1/021 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/1216 ,  H05K3/4691 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01322 ,  H05K1/0298 ,  H05K1/182 ,  H05K2201/0154 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1056 ,  H05K2201/2009 ,  H05K2203/1394 ,  H05K3/3415 ,  H05K3/3452 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A multi-layer flexible circuit board has thicker regions to which surface-mount-technology (SMT) components (such as flip chips and QFPs) and pin-in-hole (PIH) components are mounted on both sides and which contains conductive through vias between wiring layers. After the SMT components have been mounted to the first side, a screening fixture with a support surface that has cavities conforming the components on the first side, is used to screen solder paste to the other side of the board. The thicker regions are surrounded by thinner regions of the board with fewer wiring layers and preferably fewer or thinner dielectric layers, and which can be bent along a line without bending the thicker regions. A common heat spreader plate with cavities or holes for multiple components is laminated to the thicker regions on one side of the board. The thicker regions have windows in which wire-bond chips are mounted to the heat spreader and the chips are wirebonded to the other side of the board. A thermally conductive adhesive or grease connects between the components and the bottoms of the cavities. Two heat sink plates are bolted together and along with other such heat sink plates are bolted to an enclosure frame to improve thermal performance.

摘要翻译： 多层柔性电路板具有较厚的区域，表面贴装技术（SMT）部件（例如倒装芯片和QFP）和销钉（PIH）部件安装在两侧并且包含导电通孔 布线层之间。 在SMT部件已经安装到第一侧之后，使用具有与第一面上的部件相符合的空腔的支撑表面的屏蔽夹具将焊膏屏蔽到板的另一侧。 较厚的区域由较薄的区域围绕，具有更少的布线层，优选更少或更薄的介电层，并且可以沿着线弯曲而不弯曲较厚的区域。 具有用于多个部件的空腔或孔的普通散热板被层压到板的一侧上较厚的区域。 较厚的区域具有将引线键合芯片安装到散热器的窗口，并且芯片被引线键合到板的另一侧。 导热粘合剂或油脂在部件和空腔的底部之间连接。 两个散热板被螺栓连接在一起，并且与其它这样的散热板一起用螺栓连接到外壳框架以改善热性能。

公开(公告)号：US5759269A

公开(公告)日：1998-06-02

申请号：US470507

申请日：1995-06-06

申请人： Lawrence R. Cutting ,  Michael A. Gaynes ,  Eric A. Johnson ,  Cynthia S. Milkovich ,  Jeffrey S. Perkins ,  Mark V. Pierson ,  Steven E. Poetzinger ,  Jerzy Zalesinski

发明人： Lawrence R. Cutting ,  Michael A. Gaynes ,  Eric A. Johnson ,  Cynthia S. Milkovich ,  Jeffrey S. Perkins ,  Mark V. Pierson ,  Steven E. Poetzinger ,  Jerzy Zalesinski

IPC分类号： H01L21/48 ,  H01L23/367 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/12 ,  H05K3/34 ,  H05K7/20 ,  B05C13/00

CPC分类号： H05K7/20454 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/3672 ,  H01L23/5387 ,  H05K1/021 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/1216 ,  H05K3/4691 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01322 ,  H05K1/0298 ,  H05K1/182 ,  H05K2201/0154 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1056 ,  H05K2201/2009 ,  H05K2203/1394 ,  H05K3/3415 ,  H05K3/3452 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A screen printing machine comprising a backing plate with holes conforming to components attached to the surface of a flexible circuit board. The machine includes a screen which patterns solder paste on the surface of the circuit board while the circuit board is on the backing plate. Also included is a spring loaded element disposed adjacent to the backing plate which applies a predetermined continuous force to the four corners of the circuit board. This force is applied in a diagonal direction to the corners to stretch the circuit board so that the circuit board is parallel to the backing plate during screening.

摘要翻译： 一种丝网印刷机，其包括具有与附接到柔性电路板的表面的部件相符的孔的背板。 该机器包括在电路板位于背板上时在电路板表面上形成焊膏的屏幕。 还包括弹簧加载元件，其布置成与背板相邻，其向电路板的四个角施加预定的连续力。 该力沿对角方向施加到角部以拉伸电路板，使得电路板在屏蔽期间平行于背板。

公开(公告)号：US5451641A

公开(公告)日：1995-09-19

申请号：US138112

申请日：1993-10-20

申请人： Eric K. Eisenhart ,  Dennis P. Lorah ,  Susan R. Gill ,  Eric A. Johnson

发明人： Eric K. Eisenhart ,  Dennis P. Lorah ,  Susan R. Gill ,  Eric A. Johnson

IPC分类号： C08F290/06 ,  C08L51/00 ,  C08L71/02 ,  C09D133/06

CPC分类号： C08L71/02 ,  C08F290/062 ,  C09D133/06 ,  C08L51/003

摘要： Multi-stage polymer particles comprising at least one hydrophobically-modified, ionically-soluble polymer stage polymerized from a) hydrophobic monomer, b) ethylenically-unsaturated, ionizable monomer, c) non-ionic, ethylenically-unsaturated monomer and optionally d) multi-functional compound are improved thickeners.

摘要翻译： 包含至少一个由a）疏水性单体，b）烯属不饱和的，可电离的单体，c）非离子型，烯属不饱和单体和任选地d）多级聚合物的聚合的至少一种疏水改性的离子可溶性聚合物级的多级聚合物颗粒， 功能性化合物是改进的增稠剂。

公开(公告)号：US5227320A

公开(公告)日：1993-07-13

申请号：US757412

申请日：1991-09-10

申请人： Eric A. Johnson ,  Ying T. Loh ,  Yoshiko H. Strunk ,  Chung S. Wang

发明人： Eric A. Johnson ,  Ying T. Loh ,  Yoshiko H. Strunk ,  Chung S. Wang

IPC分类号： H01L21/336 ,  H01L29/78

CPC分类号： H01L29/6659 ,  H01L29/7836

摘要： A method produces a transistor with an overlapping gate. A first gate region is placed on a substrate between two source/drain regions. The first gate region includes a polysilicon region on top of a dielectric region. Gate overlap regions are placed around the polysilicon region. The gate overlap regions extend out over the two source/drain regions. The gate overlap regions are formed of a metal-silicide layer, for example Titanium-silicide. A top portion of the metal-silicide layer is oxidized to form a silicon dioxide layer on top of the metal-silicide layer. At the time of oxidation, the metal-silicide layer is also annealed to which further helps to improves the Titanium-silicide stoichiometry.

摘要翻译： 一种方法产生具有重叠栅极的晶体管。 第一栅极区域放置在两个源极/漏极区域之间的衬底上。 第一栅极区域包括位于电介质区域顶部的多晶硅区域。 栅极重叠区域放置在多晶硅区域周围。 栅极重叠区域在两个源极/漏极区域上延伸出来。 栅极重叠区域由金属硅化物层形成，例如硅化钛。 金属硅化物层的顶部被氧化以在金属硅化物层的顶部上形成二氧化硅层。 在氧化时，金属硅化物层也被退火，这进一步有助于改善硅化钛化学计量。

公开(公告)号：US10253074B2

公开(公告)日：2019-04-09

申请号：US12550692

申请日：2009-08-31

申请人： Eric A. Johnson ,  Marite Bradshaw ,  Kristin M. Marshall

发明人： Eric A. Johnson ,  Marite Bradshaw ,  Kristin M. Marshall

IPC分类号： C12N15/10 ,  C07K14/33 ,  C12N15/09 ,  C12N15/87

摘要： A mutant strain of the bacterium Clostridium botulinum having an inactivated botulinal neurotoxin gene is disclosed. The mutant strain contains an artificially created and inserted modified intron vector between nucleotides 580 and 581 of the sense strand of the gene. The mutant strain can be used in microbiological challenge testing of foods and food processing methods.

公开(公告)号：US08940477B2

公开(公告)日：2015-01-27

申请号：US12291411

申请日：2008-11-10

申请人： Eric A. Johnson ,  Sabine Pellett ,  William H. Tepp ,  Gary E. Borodic ,  David J. Beebe ,  Amy Paguirigan

发明人： Eric A. Johnson ,  Sabine Pellett ,  William H. Tepp ,  Gary E. Borodic ,  David J. Beebe ,  Amy Paguirigan

IPC分类号： C12Q1/00 ,  C12Q1/68 ,  G01N33/567 ,  C12Q1/37

CPC分类号： C12Q1/37 ,  G01N2333/33

摘要： A highly sensitive method of analyzing a sample for the presence or activity of botulinum neurotoxin (BoNT) or antibodies specific for botulinum neurotoxin is disclosed. In one embodiment, the method comprises the steps of preparing primary non-human mammalian or avian spinal cord cells, and exposing the cells to a test sample, in parallel with a control sample, and examining the extent of cleavage of the intracellular neuronal target protein in both the test and control sample.

摘要翻译： 公开了一种分析样品对肉毒杆菌神经毒素（BoNT）或特异于肉毒杆菌神经毒素的抗体的存在或活性的高度灵敏的方法。 在一个实施方案中，该方法包括以下步骤：与对照样品平行地制备初级非人哺乳动物或禽脊髓细胞，并将细胞暴露于测试样品，并检查细胞内神经元靶蛋白的切割程度 在测试和对照样品中。

公开(公告)号：US08440204B2

公开(公告)日：2013-05-14

申请号：US12769754

申请日：2010-04-29

申请人： Eric A. Johnson ,  Mark Joseph Jacobson ,  Guangyun Lin ,  Raymond C. Stevens ,  Jerome Dupuy ,  P{dot over (a)}l Erik Gustav Stenmark ,  William H. Tepp

发明人： Eric A. Johnson ,  Mark Joseph Jacobson ,  Guangyun Lin ,  Raymond C. Stevens ,  Jerome Dupuy ,  P{dot over (a)}l Erik Gustav Stenmark ,  William H. Tepp

IPC分类号： C07K14/33 ,  C07K16/12 ,  C07H21/00 ,  A61K39/40 ,  A61K38/16 ,  C12P21/08 ,  C12P21/00 ,  G01N33/68 ,  A61P25/00 ,  A61P21/00

CPC分类号： C07K14/33 ,  A61K39/08 ,  A61K2039/505 ,  C07K16/1282 ,  Y02A50/469

摘要： A novel subtype of type A botulinum neurotoxin (BoNT/A) is disclosed in the application. Methods to purify the neurotoxin as well as uses thereof are also disclosed.

摘要翻译： 应用中公开了A型肉毒杆菌神经毒素（BoNT / A）的新型亚型。 还公开了纯化神经毒素的方法及其用途。

公开(公告)号：US08084075B1

公开(公告)日：2011-12-27

申请号：US11469220

申请日：2006-08-31

申请人： Bruce D. DeJong ,  Eric A. Johnson ,  David L. Luther ,  Gordon R. Taylor

发明人： Bruce D. DeJong ,  Eric A. Johnson ,  David L. Luther ,  Gordon R. Taylor

IPC分类号： A23L2/02

CPC分类号： A23N7/08 ,  A23L2/02 ,  A23L2/04 ,  A23N1/00

摘要： The process of producing a melon extract by the following steps: providing at least one whole melon comprising flesh; steaming the outside surface of the whole melon to thereby soften the outside surface of the melon and remove microbials from the outside surface of the melon; reducing the size of the whole melon to form melon pieces; and introducing the melon pieces into the first finisher and utilizing the finisher to remove the melon flesh from the melon pieces such that at least from about 1/16 inch of flesh remains on the melon pieces and form melon extract from the flesh that is removed from the melon pieces.

摘要翻译： 通过以下步骤生产甜瓜提取物的过程：提供至少一个包含肉的整个瓜; 蒸煮整个甜瓜的外表面，从而软化甜瓜的外表面并从甜瓜的外表面除去微生物; 减少整个瓜子的大小形成瓜片; 并将甜瓜片引入第一整理器并利用整理器从甜瓜片中去除瓜子，使得至少约1/16英寸的肉保留在瓜片上，并从从肉中除去的肉中形成瓜提取物 瓜片。