公开(公告)号：US08658904B2

公开(公告)日：2014-02-25

申请号：US12914064

申请日：2010-10-28

申请人： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

发明人： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

IPC分类号： H05K1/03

CPC分类号： H05K3/4691 ,  H05K1/025 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4053 ,  H05K3/429 ,  H05K3/4614 ,  H05K2201/0191 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745

摘要： A flex-rigid wiring board including a flexible wiring board, a first insulation layer positioned to a side of the flexible board and having a first hole through the first layer, a second insulation layer over the first layer and an end portion of the flexible board and with a second hole through the second layer along the axis of the first hole, a third insulation layer over the first layer and the end portion of the flexible board on the opposite side of the second layer and with a third hole through the third layer along the axis of the first hole, a first structure having a filled conductor in the first hole, a second structure having a filled conductor in the second hole along the axis of the first structure, and a third structure having a filled conductor in the third hole along the axis of the first structure.

摘要翻译： 一种挠性刚性布线板，包括柔性布线板，位于所述柔性板的一侧的第一绝缘层，并且具有穿过所述第一层的第一孔，所述第一层上的第二绝缘层和所述柔性板的端部 并且沿着第一孔的轴线穿过第二层的第二孔，在第二层的相对侧的第一层和柔性板的端部之上的第三绝缘层和穿过第三层的第三孔 沿着第一孔的轴线，具有在第一孔中的填充导体的第一结构，具有沿着第一结构的轴线的第二孔中的填充导体的第二结构，以及在第三孔中具有填充导体的第三结构 孔沿着第一结构的轴线。

公开(公告)号：US08621748B2

公开(公告)日：2014-01-07

申请号：US12574287

申请日：2009-10-06

申请人： Michimasa Takahashi ,  Yukinobu Mikado ,  Hiroyuki Yanagisawa

发明人： Michimasa Takahashi ,  Yukinobu Mikado ,  Hiroyuki Yanagisawa

IPC分类号： H05K3/30

CPC分类号： H05K1/167 ,  H05K3/205 ,  H05K3/4644 ,  H05K2201/0376 ,  H05K2201/09736 ,  H05K2203/1453

摘要： A manufacturing method of a printed wiring board, including forming a plurality of electrodes on a conductive layer formed on a substrate by a plating method, forming an insulation layer on the electrodes and the conductive layer, removing the substrate from the conductive layer, patterning the conductive layer except for a resistor forming region reserved for forming a resistor, thereby forming an external connection conductive pattern, and forming a resistor in the resistor forming region such that the resistor is separated by a space from the external connection conductive pattern.

摘要翻译： 一种印刷电路板的制造方法，其特征在于，在电镀形成于基板上的导电层上形成多个电极，在所述电极和所述导电层上形成绝缘层，从所述导电层除去所述基板， 导电层除了保留用于形成电阻器的电阻器形成区域，从而形成外部连接导电图案，并且在电阻器形成区域中形成电阻器，使得电阻器与外部连接导电图案间隔开。

公开(公告)号：US08609991B2

公开(公告)日：2013-12-17

申请号：US12489864

申请日：2009-06-23

申请人： Michimasa Takahashi

发明人： Michimasa Takahashi

IPC分类号： H05K1/00 ,  H05K3/00

CPC分类号： H05K3/4697 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/183 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4664 ,  H05K3/4691 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2203/308 ,  Y10T29/49124 ,  Y10T29/49158 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A flex-rigid wiring board including a rigid substrate including a rigid base material and a conductor layer, and a flexible substrate having a conductor layer. The conductor layer of the flexible substrate is electrically connected to the conductor layer of the rigid substrate. The rigid substrate has a recessed portion which is formed on a surface of the rigid substrate and which accommodates an electronic component.

摘要翻译： 一种柔性刚性布线板，包括刚性基板，其包括刚性基材和导体层，以及柔性基板，具有导体层。 柔性基板的导体层电连接到刚性基板的导体层。 刚性基板具有形成在刚性基板的表面上并且容纳电子部件的凹部。

公开(公告)号：US08569630B2

公开(公告)日：2013-10-29

申请号：US12914378

申请日：2010-10-28

申请人： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

发明人： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

IPC分类号： H05K1/00 ,  H05K3/36

CPC分类号： H05K3/4691 ,  H05K2201/09527 ,  H05K2201/096

摘要： A flex-rigid wiring board having a flexible wiring board, a first insulation layer positioned adjacent to a side of the flexible board and having a first hole which penetrates through the first layer, a second insulation layer laminated over the flexible board and the first layer and having a second hole which penetrates through the second layer, the second hole of the second layer being formed along the axis of the first hole of the first layer, a first conductor structure formed in the first hole and including a filled conductor formed by filling plating in the first hole, and a second conductor structure formed in the second hole and including a filled conductor formed by filling plating in the second hole, the second conductor structure being formed along the axis of the first conductor structure and electrically connected to the first conductor structure.

摘要翻译： 一种具有柔性布线板的挠性刚性布线板，与柔性板的一侧相邻并且具有穿过第一层的第一孔的第一绝缘层，层压在柔性板上的第二绝缘层和第一层 并且具有穿过所述第二层的第二孔，所述第二层的第二孔沿着所述第一层的第一孔的轴线形成，形成在所述第一孔中的第一导体结构，所述第一导体结构包括填充导体， 电镀在第一孔中，第二导体结构形成在第二孔中，并且包括通过在第二孔中填充电镀形成的填充导体，第二导​​体结构沿着第一导体结构的轴线形成并电连接到第一孔 导体结构。

公开(公告)号：US08513539B2

公开(公告)日：2013-08-20

申请号：US13234365

申请日：2011-09-16

申请人： Michimasa Takahashi

发明人： Michimasa Takahashi

IPC分类号： H05K1/00

CPC分类号： H05K3/4602 ,  H05K1/0366 ,  H05K3/4652 ,  H05K2201/09536 ,  H05K2201/0959 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T156/1062

摘要： A wiring board has a base substrate, a conductive pattern formed on the base substrate, an insulation layer formed on the conductive pattern and the base substrate and including a resin-impregnated inorganic cloth, a conductive pattern formed on the insulating layer, a via formed in the insulation layer and connecting the conductive pattern formed on the base substrate and the conductive pattern formed on the insulating layer, and a through-hole connected to the conductive pattern formed on the base substrate, penetrating through the base substrate and having a hole diameter in a range of 10 μm to 150 μm.

摘要翻译： 布线板具有基底基板，形成在基底基板上的导电图案，形成在导电图案和基底基板上的绝缘层，并且包括树脂浸渍的无机布，形成在绝缘层上的导电图案，形成的通孔 在所述绝缘层中并且连接形成在所述基底基板上的导电图案和形成在所述绝缘层上的导电图案，以及连接到形成在所述基底基板上的所述导电图案的通孔，穿过所述基底基板，并具有孔直径 在10个到150个妈妈的范围内。

公开(公告)号：US08354596B2

公开(公告)日：2013-01-15

申请号：US13242043

申请日：2011-09-23

申请人： Michimasa Takahashi

发明人： Michimasa Takahashi

IPC分类号： H05K1/00 ,  H05K3/00 ,  H05K3/36 ,  H05K3/20 ,  H05K3/10 ,  H01R43/00

CPC分类号： H05K3/4691 ,  H05K1/0218 ,  H05K1/142 ,  H05K3/36 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/096

摘要： A wiring board including a main substrate including a base material and having an opening portion, and a flex-rigid printed wiring board connected to the main substrate in the opening portion of the main substrate and including a rigid substrate and a flexible substrate, the rigid substrate including a non-flexible base material, the flexible substrate including a flexible base material.

摘要翻译： 一种布线基板，包括：具有基材的主基板和具有开口部分;以及柔性刚性印刷布线板，其与主基板连接在主基板的开口部分中，并且包括刚性基板和柔性基板，刚性 基材包括非柔性基材，柔性基材包括柔性基材。

公开(公告)号：US08320135B2

公开(公告)日：2012-11-27

申请号：US13079243

申请日：2011-04-04

申请人： Sotaro Ito ,  Michimasa Takahashi ,  Yukinobu Mikado

发明人： Sotaro Ito ,  Michimasa Takahashi ,  Yukinobu Mikado

IPC分类号： H05K1/16

CPC分类号： H05K1/0218 ,  H01L23/49822 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/2402 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/1517 ,  H01L2924/15331 ,  H01L2924/15788 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/183 ,  H05K1/185 ,  H05K3/4652 ,  H05K2201/09981 ,  H05K2203/0733 ,  Y10T29/49155 ,  H01L2924/00

摘要： A multilayer printed circuit board, wherein, on a resin-insulating layer that houses a semiconductor element, another resin-insulating layer and a conductor circuit are formed with conductor circuits electrically connected through a via hole, wherein an electromagnetic shielding layer is formed on a resin-insulating layer surrounding a concave portion for housing a semiconductor element or on the inner wall surface of the concave portion, and the semiconductor element is embedded in the concave portion.

摘要翻译： 一种多层印刷电路板，其中，在容纳半导体元件的树脂绝缘层上，另一树脂绝缘层和导体电路形成有通过通孔电连接的导体电路，其中电磁屏蔽层形成在 环绕用于容纳半导体元件的凹部或凹部的内壁面的树脂绝缘层，并且半导体元件嵌入在凹部中。

公开(公告)号：US20120291276A1

公开(公告)日：2012-11-22

申请号：US13562895

申请日：2012-07-31

申请人： Michimasa Takahashi ,  Masakazu Aoyama

发明人： Michimasa Takahashi ,  Masakazu Aoyama

IPC分类号： H01K3/10

CPC分类号： H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4664 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/096 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A method of manufacturing a flex-rigid wiring board includes positioning a flexible board and a non-flexible substrate adjacent to each other, forming a metal layer over the flexible board such that the metal layer is formed to stop laser irradiation from reaching into the flexible board, forming an insulating layer such that the insulating layer covers the metal layer, the flexible board and the non-flexible substrate, irradiating laser upon the insulating layer such that a portion of the insulating layer covering the metal layer is cut; and removing the portion of the insulating layer covering the metal layer from the flexible board such that at least a portion of the flexible board is exposed.

摘要翻译： 制造柔性刚性布线板的方法包括将柔性基板和非柔性基板彼此相邻地定位，在柔性基板上形成金属层，使得形成金属层以停止激光照射到达柔性 形成绝缘层，使得绝缘层覆盖金属层，柔性板和非柔性基板，将激光照射在绝缘层上，使得覆盖金属层的绝缘层的一部分被切割; 以及从柔性板移除覆盖金属层的绝缘层的部分，使得柔性板的至少一部分露出。

公开(公告)号：US20120008290A1

公开(公告)日：2012-01-12

申请号：US13238429

申请日：2011-09-21

申请人： Michimasa TAKAHASHI ,  Masakazu Aoyama

发明人： Michimasa TAKAHASHI ,  Masakazu Aoyama

IPC分类号： H05K1/00

CPC分类号： H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/4652 ,  H05K3/4664 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  Y10T29/49124 ,  Y10T29/49165

摘要： A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

摘要翻译： 弹性刚性布线板包括柔性基板，该柔性基板包括形成在柔性基板上的柔性基板和导体图案，邻近柔性基板设置的非柔性基板，覆盖柔性基板和非柔性基板的绝缘层，以及 暴露柔性板的一个或多个部分，形成在绝缘层上的导体图案，以及将柔性板的导体图案和导体图案连接在绝缘层上的镀层。

公开(公告)号：US08071883B2

公开(公告)日：2011-12-06

申请号：US11876413

申请日：2007-10-22

申请人： Michimasa Takahashi ,  Masakazu Aoyama

发明人： Michimasa Takahashi ,  Masakazu Aoyama

IPC分类号： H05K1/00

CPC分类号： H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/4652 ,  H05K3/4664 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  Y10T29/49124 ,  Y10T29/49165

摘要： A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

摘要翻译： 弹性刚性布线板包括柔性基板，该柔性基板包括形成在柔性基板上的柔性基板和导体图案，邻近柔性基板设置的非柔性基板，覆盖柔性基板和非柔性基板的绝缘层，以及 暴露柔性板的一个或多个部分，形成在绝缘层上的导体图案，以及将柔性板的导体图案和导体图案连接在绝缘层上的镀层。