公开(公告)号：USD597502S1

公开(公告)日：2009-08-04

申请号：US29326361

申请日：2008-10-16

Applicant: Toshifumi Ogata ,  Yasuharu Ueno ,  Nobuyuki Matsui ,  Masumi Abe

Designer： Toshifumi Ogata ,  Yasuharu Ueno ,  Nobuyuki Matsui ,  Masumi Abe

公开(公告)号：USD576576S1

公开(公告)日：2008-09-09

申请号：US29296870

申请日：2007-10-30

Applicant: Satoshi Shida ,  Nobuyuki Matsui ,  Yoshihiko Kanayama ,  Makoto Morikawa

Designer： Satoshi Shida ,  Nobuyuki Matsui ,  Yoshihiko Kanayama ,  Makoto Morikawa

公开(公告)号：US07375381B2

公开(公告)日：2008-05-20

申请号：US11125392

申请日：2005-05-09

Applicant: Masanori Shimizu ,  Tadashi Yano ,  Tatsumi Setomoto ,  Nobuyuki Matsui ,  Tetsushi Tamura

Inventor： Masanori Shimizu ,  Tadashi Yano ,  Tatsumi Setomoto ,  Nobuyuki Matsui ,  Tetsushi Tamura

IPC: H01L29/22

CPC classification number: F21V29/70 ,  F21K9/23 ,  F21L4/00 ,  F21L4/005 ,  F21L4/027 ,  F21S2/00 ,  F21S6/00 ,  F21S6/003 ,  F21V7/0083 ,  F21V19/003 ,  F21V19/045 ,  F21Y2103/33 ,  F21Y2105/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  F21Y2115/15 ,  F21Y2115/20 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/64 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01R12/714 ,  H01R33/225 ,  H05B33/0803 ,  H05B33/0821 ,  H05B33/0842 ,  H05B33/0863 ,  H05K1/05 ,  H05K1/112 ,  H05K1/117 ,  H05K2201/10106 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An LED illumination apparatus according to the present invention includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.

Abstract translation: 根据本发明的LED照明装置包括至少一个连接器和照明驱动电路。 连接器连接到可插入和可拆卸的卡式LED照明源，其包括已经安装在基板的一个表面上的多个LED。 照明驱动电路通过连接器电连接到卡型LED照明源。 卡式LED照明光源优选地包括金属基底基板和已经安装在金属基底基板的一个表面上的多个LED。 金属基底基板的不包括LED的背面与照明装置的一部分热接触。 与设置有LED的金属基底基板的表面上设置与连接器电连接的馈电端子。

公开(公告)号：US07282853B2

公开(公告)日：2007-10-16

申请号：US11193939

申请日：2005-07-29

Applicant: Tadashi Yano ,  Masanori Shimizu ,  Nobuyuki Matsui ,  Tatsumi Setomoto ,  Tetsushi Tamura

Inventor： Tadashi Yano ,  Masanori Shimizu ,  Nobuyuki Matsui ,  Tatsumi Setomoto ,  Tetsushi Tamura

IPC: H01J1/62

CPC classification number: H01L33/505 ,  H01L25/0753 ,  H01L33/508 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An LED lamp includes a substrate, an LED chip, and a resin portion. The LED chip is flip-chip bonded to the substrate. The resin portion covers the LED chip and includes at least one type of phosphor that transforms the emission of the LED chip into light having a longer wavelength than the emission. In this LED lamp, the resin portion has at least one side surface. The side surface is separated from another surface that can reflect the outgoing light of the resin portion, surrounds the side surfaces of the LED chip and is curved at least partially.

Abstract translation: LED灯包括基板，LED芯片和树脂部分。 LED芯片倒装芯片结合到基板上。 树脂部分覆盖LED芯片，并且包括将LED芯片的发射转换成具有比发射更长波长的光的至少一种类型的荧光体。 在该LED灯中，树脂部具有至少一个侧面。 侧表面与可以反射树脂部分的出射光的另一表面分离，包围LED芯片的侧表面并且至少部分弯曲。

公开(公告)号：US07242086B2

公开(公告)日：2007-07-10

申请号：US10543636

申请日：2003-12-24

Applicant: Tetsushi Tamura ,  Tatsumi Setomoto ,  Nobuyuki Matsui ,  Masanori Shimizu ,  Yoshihisa Yamashita

Inventor： Tetsushi Tamura ,  Tatsumi Setomoto ,  Nobuyuki Matsui ,  Masanori Shimizu ,  Yoshihisa Yamashita

IPC: H01L23/053 ,  H01L23/12 ,  H01L23/48 ,  H01L23/52

CPC classification number: H01L33/20 ,  H01L33/38 ,  H01L2924/0002 ,  H05K1/111 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/10106 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: A wiring board used for mounting an LED bare chip capable of firmly bonding the LED bare chip and improving yield. In a printed wiring board 2, a distance D between wiring patterns 81 and 85 disposed so as to oppose each other is the smallest at a position nearest to a center point (G) of an LED chip 14 disposed at a designed location, and increases with an increasing distance from the point G. In addition, pattern edges 83 and 87 of the wiring patterns 81 and 85 recede in the direction of widening the distance D as a distance from the center point G increases with respect to electrode edges 148 and 149 of the LED chip 14.

Abstract translation: 用于安装LED裸芯片的布线板，能够牢固地接合LED裸芯片并提高产量。 在印刷布线板2中，布置在彼此相对的布线图案81和85之间的距离D在最靠近布置在设计位置处的LED芯片14的中心点（G）的位置处最小，并且增加 距离点G的距离增加。此外，布线图案81和85的图案边缘83和87随着距离中心点G的距离相对于电极边缘148和149而增加的方向后退。 的LED芯片14。

公开(公告)号：USD528994S1

公开(公告)日：2006-09-26

申请号：US29219402

申请日：2004-12-16

Applicant: Nobuyuki Matsui ,  Hideo Nagai ,  Kenji Mukai ,  Masanori Shimizu

Designer： Nobuyuki Matsui ,  Hideo Nagai ,  Kenji Mukai ,  Masanori Shimizu

公开(公告)号：US20060160409A1

公开(公告)日：2006-07-20

申请号：US11277952

申请日：2006-03-30

Applicant: Masanori SHIMIZU ,  Tadashi YANO ,  Tatsumi SETOMOTO ,  Nobuyuki Matsui ,  Tetsushi TAMURA

Inventor： Masanori SHIMIZU ,  Tadashi YANO ,  Tatsumi SETOMOTO ,  Nobuyuki Matsui ,  Tetsushi TAMURA

IPC: H01R3/00

CPC classification number: F21V29/70 ,  F21K9/23 ,  F21L4/00 ,  F21L4/005 ,  F21L4/027 ,  F21S2/00 ,  F21S6/00 ,  F21S6/003 ,  F21V7/0083 ,  F21V19/003 ,  F21V19/045 ,  F21Y2103/33 ,  F21Y2105/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  F21Y2115/15 ,  F21Y2115/20 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/64 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01R12/714 ,  H01R33/225 ,  H05B33/0803 ,  H05B33/0821 ,  H05B33/0842 ,  H05B33/0863 ,  H05K1/05 ,  H05K1/112 ,  H05K1/117 ,  H05K2201/10106 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An LED illumination apparatus includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.

Abstract translation: LED照明装置包括至少一个连接器和照明驱动电路。 连接器连接到可插入和可拆卸的卡式LED照明源，其包括已经安装在基板的一个表面上的多个LED。 照明驱动电路通过连接器电连接到卡型LED照明源。 卡式LED照明光源优选地包括金属基底基板和已经安装在金属基底基板的一个表面上的多个LED。 金属基底基板的不包括LED的背面与照明装置的一部分热接触。 与设置有LED的金属基底基板的表面上设置与连接器电连接的馈电端子。

公开(公告)号：US06963166B2

公开(公告)日：2005-11-08

申请号：US10704005

申请日：2003-11-07

Applicant: Tadashi Yano ,  Masanori Shimizu ,  Nobuyuki Matsui ,  Tatsumi Setomoto ,  Tetsushi Tamura

Inventor： Tadashi Yano ,  Masanori Shimizu ,  Nobuyuki Matsui ,  Tatsumi Setomoto ,  Tetsushi Tamura

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01J1/62

CPC classification number: H01L33/505 ,  H01L25/0753 ,  H01L33/508 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An LED lamp includes a substrate, an LED chip, and a resin portion. The LED chip is flip-chip bonded to the substrate. The resin portion covers the LED chip and includes at least one type of phosphor that transforms the emission of the LED chip into light having a longer wavelength than the emission. In this LED lamp, the resin portion has at least one side surface. The side surface is separated from another surface that can reflect the outgoing light of the resin portion, surrounds the side surfaces of the LED chip and is curved at least partially.

Abstract translation: LED灯包括基板，LED芯片和树脂部分。 LED芯片倒装芯片结合到基板上。 树脂部分覆盖LED芯片，并且包括将LED芯片的发射转换成具有比发射更长波长的光的至少一种类型的荧光体。 在该LED灯中，树脂部具有至少一个侧面。 侧表面与可以反射树脂部分的出射光的另一表面分离，包围LED芯片的侧表面并且至少部分弯曲。

公开(公告)号：US20050242362A1

公开(公告)日：2005-11-03

申请号：US11158836

申请日：2005-06-22

Applicant: Masanori Shimizu ,  Tadashi Yano ,  Tatsumi Setomoto ,  Nobuyuki Matsui ,  Tetsushi Tamura

Inventor： Masanori Shimizu ,  Tadashi Yano ,  Tatsumi Setomoto ,  Nobuyuki Matsui ,  Tetsushi Tamura

IPC: F21K99/00 ,  F21V9/00 ,  H01L25/075 ,  H01L33/64 ,  H01R33/22 ,  H01L33/00

CPC classification number: F21V29/70 ,  F21K9/23 ,  F21L4/00 ,  F21L4/005 ,  F21L4/027 ,  F21S2/00 ,  F21S6/00 ,  F21S6/003 ,  F21V7/0083 ,  F21V19/003 ,  F21V19/045 ,  F21Y2103/33 ,  F21Y2105/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  F21Y2115/15 ,  F21Y2115/20 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/64 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01R12/714 ,  H01R33/225 ,  H05B33/0803 ,  H05B33/0821 ,  H05B33/0842 ,  H05B33/0863 ,  H05K1/05 ,  H05K1/112 ,  H05K1/117 ,  H05K2201/10106 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An LED illumination apparatus includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.

公开(公告)号：US06940101B2

公开(公告)日：2005-09-06

申请号：US10721981

申请日：2003-11-25

Applicant: Tadashi Yano ,  Masanori Shimizu ,  Nobuyuki Matsui ,  Tatsumi Setomoto ,  Tetsushi Tamura

Inventor： Tadashi Yano ,  Masanori Shimizu ,  Nobuyuki Matsui ,  Tatsumi Setomoto ,  Tetsushi Tamura

IPC: H01L33/44 ,  H01L33/50 ,  H01L33/00

CPC classification number: H01L33/44 ,  H01L33/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: An LED lamp includes at least one LED chip and a wavelength converting portion including a phosphor for transforming the emission of the LED chip into light having a longer wavelength than that of the emission. The LED lamp further includes filtering member. The filtering member is designed such that the spectral transmittance thereof becomes lower in at least a portion of the wavelength range of 550 nm to 605 nm than in the remaining visible radiation range.

Abstract translation: LED灯包括至少一个LED芯片和包括用于将LED芯片的发射转换成具有比发射的波长更长的波长的光的荧光体的波长转换部分。 LED灯还包括过滤构件。 过滤构件被设计成使得其在550nm至605nm的波长范围的至少一部分中的光谱透射率比剩余的可见光范围内的光谱透射率变低。