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公开(公告)号：US07850887B2
公开(公告)日：2010-12-14
申请号：US11440166
申请日：2006-05-24
IPC分类号： B29D11/00
CPC分类号： B29D11/00432 , B29C33/0022 , B29C43/021 , B29C43/184 , B29C2043/5076 , B29K2105/0002 , B29L2011/0016
摘要： Method of forming a plastic element include dispensing a quantity of a liquid precursor material into a first die mold, positioning a carrier tape on the first die mold above the dispensed liquid precursor material, bringing a second die mold into contact with the carrier tape and the first die mold, and applying pressure to the first die mold and the second die mold. The liquid precursor material may include a liquid silicone.
摘要翻译： 形成塑料元件的方法包括将一定量的液体前体材料分配到第一模具模具中，将载带定位在分配的液体前体材料上方的第一模具模具上，使第二模具模具与载带接触，并且 第一模具，并向第一模具模具和第二模具模具施加压力。 液体前体材料可以包括液体硅酮。
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52.发明申请公开(公告)号：US20100276708A1
公开(公告)日：2010-11-04
申请号：US12835013
申请日：2010-07-13
CPC分类号： B29C45/14655 , B29C45/14836 , B29C45/34 , B29C2045/14844 , B29K2083/00 , B29K2995/0018 , B29L2011/0016 , H01L24/97 , H01L33/52 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： Semiconductor light emitting device packaging methods include fabricating a substrate configured to mount a semiconductor light emitting device thereon. The substrate may include a cavity configured to mount the semiconductor light emitting device therein. The semiconductor light emitting device is mounted on the substrate and electrically connected to a contact portion of the substrate. The substrate is liquid injection molded to form an optical element bonded to the substrate over the semiconductor light emitting device. Liquid injection molding may be preceded by applying a soft resin on the electrically connected semiconductor light emitting device in the cavity. Semiconductor light emitting device substrate strips are also provided.
摘要翻译： 半导体发光器件封装方法包括制造在其上安装半导体发光器件的衬底。 衬底可以包括被配置为将半导体发光器件安装在其中的空腔。 半导体发光器件安装在基板上并电连接到基板的接触部分。 衬底被液体注射成型以形成在半导体发光器件上结合到衬底的光学元件。 之前可以在空腔中的电连接的半导体发光器件上施加软树脂。 还提供了半导体发光器件衬底条。
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53.发明授权Packaged light emitting devices including multiple index lenses and multiple index lenses for packaged light emitting devices 有权封装的发光器件包括多个折射率透镜和用于封装的发光器件的多个折射率透镜公开(公告)号：US07646035B2
公开(公告)日：2010-01-12
申请号：US11443741
申请日：2006-05-31
IPC分类号： H01L29/16
CPC分类号： H01L33/58 , B29C45/14655 , B29C45/1671 , B29L2011/0016 , G02B19/0028 , G02B19/0052 , G02B19/0071 , H01L33/54 , Y10T156/10
摘要： A packaged light emitting device includes a substrate, a solid state light emitting device on the substrate, a first generally toroidal lens on the substrate and defining a cavity relative to the solid state light emitting device and having a first index of refraction, and a second lens at least partially within the cavity formed by the first lens and having a second index of refraction that is different from the first index of refraction. The second index of refraction may be higher than the first index of refraction. The lenses may be mounted on the substrate and/or may formed by dispensing and curing liquid encapsulant materials.
摘要翻译： 封装的发光器件包括衬底，在衬底上的固态发光器件，在衬底上的第一大致环形透镜，并且相对于固态发光器件限定空腔并具有第一折射率，第二 透镜至少部分地在由第一透镜形成的空腔内，并且具有不同于第一折射率的第二折射率。 第二折射率可能高于第一折射率。 透镜可以安装在基板上和/或可以通过分配和固化液体密封剂材料而形成。
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公开(公告)号：US20090219714A1
公开(公告)日：2009-09-03
申请号：US12093698
申请日：2006-11-17
申请人： Gerald H. Negley , Paul E. Sims , Ban P. Loh
发明人： Gerald H. Negley , Paul E. Sims , Ban P. Loh
CPC分类号： H05B33/0803 , F21K9/00 , F21Y2105/10 , F21Y2115/10 , G02F1/133603 , G02F2001/133613 , G09F9/35 , H01L2224/49175 , H01L2224/8592 , H05B33/0821 , H05K1/142 , H05K1/181 , H05K3/0058 , Y10S362/80
摘要： A solid state lighting tile (10) includes a substrate having a planar surface. A first plurality of solid state light emitting devices (LEDs) are on the substrate. The first plurality of LEDs (19) are connected in series to form a first string of LEDs of a first color having an anode contact (22) at a first end of the tile and a cathode contact (24) at a second end of the tile. A second plurality of LEDs are on the substrate. The second plurality of LEDs (21) are connected in series to form a second string of LEDs of the first color having a cathode contact (28) at the first end of the tile and an anode contact (26) at the second end of the tile.
摘要翻译： 固态照明瓦（10）包括具有平坦表面的基板。 第一多个固态发光器件（LED）在衬底上。 第一组多个LED（19）串联连接以形成第一颜色的第一串LED，在第一端具有阳极触点（22），在第二端的第二端处形成阴极触点（24） 瓦。 第二多个LED在基板上。 所述第二多个LED（21）串联连接以形成所述第一颜色的第二串LED，所述第二颜色的LED在所述瓦片的第一端处具有阴极触点（28），并且在所述第二颜色的第二端处具有阳极触点（26） 瓦。
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公开(公告)号：US20090152573A1
公开(公告)日：2009-06-18
申请号：US12002429
申请日：2007-12-14
申请人： Ban P. Loh , Chenhua You , Bernd Keller , Nathaniel O. Cannon , Mitch Jackson , Ernest W. Combs
发明人： Ban P. Loh , Chenhua You , Bernd Keller , Nathaniel O. Cannon , Mitch Jackson , Ernest W. Combs
CPC分类号： H01L33/54 , H01L25/0753 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously.
摘要翻译： 一种封装的LED器件，其具有纹理化的密封剂，其与其上设置有至少一个LED芯片的安装表面保持一致。 可以在包装之前或期间将可以使用添加剂或减色过程进行纹理化的纹理密封剂施加到LED。 密封剂包括至少一个纹理表面，光从该表面发射。 纹理表面有助于减少密封剂内的全内反射，提高输出分布的提取效率和色温均匀性。 几个芯片可以安装在单个纹理密封剂下面。 可以使用具有不规则表面的模具同时在许多LED上形成多个密封剂。
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公开(公告)号：US20070273058A1
公开(公告)日：2007-11-29
申请号：US11440166
申请日：2006-05-24
申请人： Ban P. Loh , Nicholas W. Medendorp
发明人： Ban P. Loh , Nicholas W. Medendorp
IPC分类号： B29D11/00
CPC分类号： B29D11/00432 , B29C33/0022 , B29C43/021 , B29C43/184 , B29C2043/5076 , B29K2105/0002 , B29L2011/0016
摘要： Method of forming a plastic element include dispensing a quantity of a liquid precursor material into a first die mold, positioning a carrier tape on the first die mold above the dispensed liquid precursor material, bringing a second die mold into contact with the carrier tape and the first die mold, and applying pressure to the first die mold and the second die mold. The liquid precursor material may include a liquid silicone.
摘要翻译： 形成塑料元件的方法包括将一定量的液体前体材料分配到第一模具模具中，将载带定位在分配的液体前体材料上方的第一模具模具上，使第二模具模具与载带接触，并且 第一模具，并向第一模具模具和第二模具模具施加压力。 液体前体材料可以包括液体硅酮。
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公开(公告)号：US09453617B2
公开(公告)日：2016-09-27
申请号：US13163437
申请日：2011-06-17
申请人： Ban P. Loh
发明人： Ban P. Loh
IPC分类号： F21V29/00 , F21K99/00 , F21V3/00 , F21Y101/02
CPC分类号： F21K9/233 , F21K9/232 , F21K9/60 , F21V3/00 , F21V29/00 , F21Y2101/00 , F21Y2115/10
摘要： A lighting device such as a light bulb is disclosed. The lighting device includes an optical sub-assembly adapted to generate light when electrically excited; a body sub-assembly thermally coupled to the optical sub-assembly to draw heat away from the optical sub-assembly and to dissipate it; an electrical sub-assembly electrically connecting the optical sub-assembly to the body sub-assembly; and a final assembly covering at least a portion of the optical sub-assembly.
摘要翻译： 公开了诸如灯泡的照明装置。 照明装置包括适于在电激励时产生光的光学子组件; 热耦合到光学子组件的主体子组件以将热量从光学子组件吸走并使其散开; 将所述光学子组件电连接到所述主体子组件的电子组件; 以及覆盖光学子组件的至少一部分的最终组件。
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公开(公告)号：US09431589B2
公开(公告)日：2016-08-30
申请号：US12002429
申请日：2007-12-14
申请人： Ban P. Loh , Chenhua You , Bernd Keller , Nathaniel O. Cannon , Mitch Jackson , Ernest W. Combs
发明人： Ban P. Loh , Chenhua You , Bernd Keller , Nathaniel O. Cannon , Mitch Jackson , Ernest W. Combs
IPC分类号： H01L33/54 , H01L25/075
CPC分类号： H01L33/54 , H01L25/0753 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously.
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59.发明授权Leadframe-based packages for solid state light emitting devices having heat dissipating regions in packaging 有权用于在封装中具有散热区域的固态发光器件的基于引线框的封装公开(公告)号：US08941134B2
公开(公告)日：2015-01-27
申请号：US13242103
申请日：2011-09-23
IPC分类号： H01L33/62 , H01L23/495 , H01L33/48 , H01L33/64 , H01L23/498 , H01L25/075
CPC分类号： H01L33/483 , H01L23/49861 , H01L24/73 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2924/01019 , H01L2924/01068 , H01L2924/01322 , H01L2924/3011 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe further includes an electrical lead extending laterally away from the second region, and the package further includes a thermoset package body on the leadframe and surrounding the first region. The thermoset package body may be on both the top and bottom surfaces of the second region. A leak barrier may be on the leadframe, and the package body may be on the leak barrier. Methods of forming modular packages including thermoset package bodies on leadframes are also disclosed.
摘要翻译： 用于发光器件的模块化封装包括引线框架，其包括具有顶表面，底表面和第一厚度的第一区域和具有小于第一厚度的顶表面，底表面和第二厚度的第二区域 。 引线框还包括从第二区域横向延伸的电引线，并且封装件还包括在引线框上并围绕第一区域的热固性封装主体。 热固性封装体可以在第二区域的顶表面和底表面上。 泄漏屏障可以在引线框架上，并且封装主体可以在泄漏屏障上。 还公开了在引线框架上形成包括热固性封装体的模块化封装的方法。
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公开(公告)号：US08791491B2
公开(公告)日：2014-07-29
申请号：US13164185
申请日：2011-06-20
申请人： Ban P. Loh , Nathaniel O. Cannon , Norbert Hiller , John Edmond , Mitch Jackson , Nicholas W. Medendorp, Jr.
发明人： Ban P. Loh , Nathaniel O. Cannon , Norbert Hiller , John Edmond , Mitch Jackson , Nicholas W. Medendorp, Jr.
CPC分类号： H01L33/52 , H01L24/97 , H01L25/167 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/32245 , H01L2224/32257 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48471 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2224/4554
摘要： A submount for a light emitting device package includes a substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.
摘要翻译： 用于发光器件封装的基座包括衬底。 第一接合焊盘和第二接合焊盘位于衬底的第一表面上。 第一接合焊盘包括朝向衬底的第一端偏移并且被配置为在其上接收发光二极管的管芯附着区域。 第二接合焊盘包括在第一接合焊盘和基板的第二端之间的接合区域以及第二接合焊盘延伸部，其在接合区域沿着基板的侧面朝向基板的角部在第一端部处延伸 基质。 第一和第二焊盘是基板的第二表面。 第一焊盘与衬底的第一端相邻并接触第二接合焊盘。 第二焊盘邻近衬底的第二端并接触第一接合焊盘。 公开了相关的LED封装和形成LED封装的方法。
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