利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

77 条记录 (耗时 0.03 秒)

    Structures and processes to create a desired probetip contact geometry on a wafer test probe
    51.
    发明授权
    Structures and processes to create a desired probetip contact geometry on a wafer test probe 失效
    在晶圆测试探针上创建所需的先天触点几何形状的结构和过程

    公开(公告)号：US06206273B1

    公开(公告)日：2001-03-27

    申请号：US09251864

    申请日：1999-02-17

    申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

    发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

    IPC分类号： B23K3100

    CPC分类号： G01R1/0675 ,  G01R1/07314 ,  G01R3/00 ,  Y10T29/4914

    摘要： The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are formed by cutting with one or more blades. The shape of the blades determines the shape of the probetips. The probetips can be coated with other conductive materials to enhance the hardness and profile of protuberances formed at the probetip ends by the blade-cutting process. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer. The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

    摘要翻译： 本发明涉及一种高密度测试探针，其提供用于测试晶片形式的高密度和高性能集成电路或作为离散芯片的装置。 测试探针由细长电导体的密集阵列形成，其通过用一个或多个刀片切割形成。 叶片的形状决定了先兆的形状。 可以使用其他导电材料涂覆先知，以通过叶片切割工艺增强在突齿端部处形成的突起的硬度和轮廓。 电线与接触位置阵列一样密集。 围绕着向外突出的线的阵列设置模具。 液体弹性体设置在模具中以填充电线之间的空间。 弹性体被固化并且模具被去除，留下布置在弹性体中并与空间变压器电接触的线阵列。 空间变压器可以具有一个引脚阵列，它们在空间变压器的与细长导体所接合的相反的表面上。 这些销插入第二空间变压器（例如印刷电路板）上的插座中以形成探针组件。 或者，插入器电连接器可以设置在第一和第二空间变压器之间。

    Pluggable chip scale package
    54.
    发明授权
    Pluggable chip scale package 失效
    可插拔芯片级封装

    公开(公告)号：US6078500A

    公开(公告)日：2000-06-20

    申请号：US76267

    申请日：1998-05-12

    申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

    发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

    IPC分类号： H01L23/31 ,  H01L23/32 ,  H01L23/48 ,  H05K3/32 ,  H05K3/34 ,  H05K7/20

    CPC分类号： H01L24/72 ,  H01L23/3107 ,  H01L23/32 ,  H05K3/325 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H05K2201/10393 ,  H05K3/3436 ,  Y10T29/49126 ,  Y10T29/49158 ,  Y10T29/49162

    摘要： A structure for packaging an electronic device. The package has: an electronic device having a first surface and an opposite second surface, the first surface having a plurality of first electrical contact locations; a substrate having a surface having a plurality of substrate electrical contact locations; a flexible interposer comprising a flexible material and a plurality of elongated electrical conductors disposed therein and extending from the first side to the second side, each of the elongated electrical conductors has a first end at the first side of the flexible interposer and a second end at the second side of the flexible interposer; the flexible interposer is disposed between the electronic device and the substrate; means for pushing the electronic device towards the substrate so that the flexible interposer is disposed between the first surface of the electronic device and the surface of the substrate so that the first ends of the elongated electrical conductors of the flexible interposer contact the first electrical contact locations at the first surface of the electronic device and so that the second ends of the elongated electrical conductors of the flexible interposer contact the substrate electrical contact locations; and, means for aligning the electronic device to the substrate so that the first and the second ends of the elongated electrical conductors of the flexible interposer align to the first electrical contact pads on the electronic device and to the substrate contact locations, respectively.

    摘要翻译： 一种用于封装电子设备的结构。 所述封装具有：具有第一表面和相对的第二表面的电子器件，所述第一表面具有多个第一电接触位置; 具有表面的基板，所述表面具有多个基板电接触位置; 柔性插入件，其包括柔性材料和布置在其中并从第一侧延伸到第二侧的多个细长电导体，每个细长电导体在柔性插入件的第一侧具有第一端，第二端在 柔性插入片的第二面; 柔性插入件设置在电子器件和基板之间; 用于将电子装置推向基板的装置，使得柔性插入件设置在电子装置的第一表面和基板的表面之间，使得柔性插入件的细长电导体的第一端接触第一电接触位置 在电子设备的第一表面处，并且使得柔性插入件的细长电导体的第二端接触基板电接触位置; 以及用于将电子器件对准到衬底的装置，使得柔性插入器的细长电导体的第一和第二端分别与电子器件上的第一电接触焊盘和衬底接触位置对准。

    High density integral test probe
    56.
    发明授权
    High density integral test probe 失效
    高密度积分测试探头

    公开(公告)号：US07276919B1

    公开(公告)日：2007-10-02

    申请号：US08756830

    申请日：1996-11-20

    申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice H. Norcott ,  Da-Yuan Shih ,  George Frederick Walker

    发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice H. Norcott ,  Da-Yuan Shih ,  George Frederick Walker

    IPC分类号： G01R31/06

    CPC分类号： G01R1/07314 ,  G01R1/06761 ,  G01R1/0735

    摘要： A high density integrated test probe and method of fabrication is described. A group of wires are ball bonded to contact locations on the surface of a fan out substrate. The wires are sheared off leaving a stub, the end of which is flattened by an anvil. Before flattening a sheet of material having a group of holes is arranged for alignment with the group of stubs is disposed over the stubs. The sheet of material supports the enlarged tip. The substrate with stubs form a probe which is moved into engagement with contact locations on a work piece such as a drip or packaging substrate.

    摘要翻译： 描述了高密度集成测试探针和制造方法。 将一组电线球焊接到扇形外壳的表面上的接触位置。 电线被剪断，留下一个短截线，其末端被砧平坦化。 在平坦化具有一组孔的材料的片材之前，布置成使一组短截线对准，以便将短截线组放置在短截线上。 该材料片支撑放大的尖端。 具有短截线的基底形成探针，该探针移动成与诸如滴液或包装基底的工件上的接触位置接合。