公开(公告)号：US20130193468A1

公开(公告)日：2013-08-01

申请号：US13755993

申请日：2013-01-31

Applicant: CREE, INC.

Inventor： Christopher P. Hussell ,  Erin Welch ,  Jesse Colin Reiherzer ,  Peter Scott Andrews

IPC: H01L33/54

CPC classification number: H01L33/54 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: Submount based surface mount design (SMD) light emitter components and related methods are disclosed. In some aspects, light emitter components can include a submount with a first side having a first surface area, first and second electrical contacts disposed on the first side of the submount, and at least one light emitter chip on the first side. In some aspects, the electrical contact area can be less than half of the first surface area of the first side of the submount. Components disclosed herein can include low profile parts or domes where a ratio between a dome height and a dome width is less than 0.5. A method of providing components can include providing a panel of material and LED chips, dispensing a liquid encapsulant material over the panel, and singulating the panel into individual submount based components after the encapsulant material has hardened.

Abstract translation: 公开了基于底座的表面贴装设计（SMD）光发射器部件和相关方法。 在一些方面，光发射器部件可以包括具有第一侧面的第一表面区域的基座，以及设置在基座的第一侧上的第一和第二电触头以及第一侧上的至少一个发光芯片。 在一些方面，电接触面积可以小于底座第一侧的第一表面积的一半。 本文公开的组件可以包括半圆形高度和圆顶宽度之间的比率小于0.5的低轮廓部分或圆顶。 提供部件的方法可以包括提供材料面板和LED芯片，在面板上分配液体密封剂材料，以及在密封剂材料硬化之后将面板分成单独的基于底座的部件。

公开(公告)号：US20200043905A1

公开(公告)日：2020-02-06

申请号：US16601826

申请日：2019-10-15

Applicant: Cree, Inc.

Inventor： Jesse Colin Reiherzer ,  Colin Kelly Blakely ,  Arthur Fong-Yuen Pun ,  Troy Anthony Trottier

IPC: H01L25/075 ,  H01L33/54

Abstract: Light emitting diode (LED) components and related methods are disclosed. LED components include a submount, at least one LED chip on a first surface of the submount, and a light permeable structure or dam. The light permeable dam can provide a component having a viewing angle that is greater than 115°. A method of providing an LED component includes providing a non-metallic submount, attaching at least one LED chip to a first surface of the submount, and dispensing a light permeable dam over the first surface of the submount about the at least one LED chip thereby providing a component having a viewing angle that is greater than 115°.

公开(公告)号：US10453825B2

公开(公告)日：2019-10-22

申请号：US14538526

申请日：2014-11-11

Applicant: Cree, Inc.

Inventor： Jesse Colin Reiherzer ,  Colin Kelly Blakely ,  Arthur Fong-Yuen Pun ,  Troy Anthony Trottier

IPC: H01L25/075 ,  H01L33/54

Abstract: Light emitting diode (LED) components and related methods are disclosed. LED components include a submount, at least one LED chip on a first surface of the submount, and a non-reflective, light permeable structure or dam. The light permeable dam can provide a component having a viewing angle that is greater than 115°. A method of providing an LED component includes providing a non-metallic submount, attaching at least one LED chip to a first surface of the submount, and dispensing a non-reflective, light permeable dam over the first surface of the submount about the at least one LED chip thereby providing a component having a viewing angle that is greater than 115°.

公开(公告)号：US10439114B2

公开(公告)日：2019-10-08

申请号：US15453594

申请日：2017-03-08

Applicant: Cree, Inc.

Inventor： Erin R. F. Welch ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Arthur Fong-Yuen Pun

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  H01L21/48 ,  H01L25/075 ,  H01L33/54 ,  H01L33/56

Abstract: Light emitting diode (LED) devices, components and systems are provided. Improved substrates for LEDs and LED devices are provided, with one or more dielectric layers over a reflective layer sufficient to minimize or eliminate damage of the dielectric layer(s). More stable and efficient LED devices can be produced using such improved substrates. LED devices, and methods of making the same, are also provided wherein LED chips are embedded in fill material to attach the LEDs to a substrate and increase light reflectivity.

公开(公告)号：US10222032B2

公开(公告)日：2019-03-05

申请号：US13800260

申请日：2013-03-13

Applicant: CREE, Inc.

Inventor： Jesse Colin Reiherzer ,  Christopher P. Hussell

IPC: F21V19/00 ,  F21V23/06 ,  H01L33/62 ,  H01L23/00 ,  H01L33/48

Abstract: Light emitter components and methods having improved electrical contacts and related methods are disclosed. In one embodiment, a light emitter component can include a submount, at least one light emitter chip on the submount, and at least one electrical contact disposed along portions of at least three external surfaces of the submount. The at least one electrical contact can be electrically connected to the at least one light emitter chip.

公开(公告)号：US20180145059A1

公开(公告)日：2018-05-24

申请号：US15359517

申请日：2016-11-22

Applicant: Cree, Inc.

Inventor： Erin R.F. Welch ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Christopher P. Hussell

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/46 ,  H01L33/64 ,  H01L33/48

Abstract: Devices, components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include a metallic substrate with a mirrored surface, one or more light emitter devices mounted directly or indirectly on the mirrored surface, and one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitter devices, wherein the one or more electrical components can be spaced from the mirrored metal substrate by one or more non-metallic layers. Components disclosed herein can result in improved thermal management and light output.

公开(公告)号：US20180033924A1

公开(公告)日：2018-02-01

申请号：US15657027

申请日：2017-07-21

Applicant: Cree, Inc.

Inventor： Peter Scott Andrews ,  Jesse Colin Reiherzer ,  Amber C. Abare

IPC: H01L33/50 ,  H01L33/62 ,  H01L33/60 ,  H01L25/075 ,  H01L33/58

CPC classification number: H01L33/507 ,  H01L25/0753 ,  H01L33/501 ,  H01L33/502 ,  H01L33/505 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0091

Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

公开(公告)号：US20170373045A1

公开(公告)日：2017-12-28

申请号：US15192790

申请日：2016-06-24

Applicant: Cree, Inc.

Inventor： Erin R.F. Welch ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer

IPC: H01L25/075 ,  H01L33/60 ,  H01L33/56 ,  H01L33/62 ,  H01L23/538

CPC classification number: H01L25/0753 ,  H01L23/5386 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

Abstract: Light emitter components and related methods are provided. In some aspects, light emitter components and related methods include a ceramic submount having a reflective surface. Light emitter components and related methods can include light emitter chips disposed over the reflective surface. Each light emitter chip can include a sapphire substrate, an epi area disposed over the sapphire substrate, and first and second electrical contacts disposed over the epi area. The first and second electrical contacts may face the reflective surface. A ratio between a combined epi area of the plurality of light emitter chips and a surface area of the reflective surface may be at least 0.4 or more, and a ratio between a combined planar surface area of the plurality of light emitter chips and a planar surface area of the reflective surface may be at least approximately 0.25 or more.

公开(公告)号：US09601673B2

公开(公告)日：2017-03-21

申请号：US14550186

申请日：2014-11-21

Applicant: Cree, Inc.

Inventor： Michael John Bergmann ,  Colin Kelly Blakely ,  Arthur Fong-Yuen Pun ,  Jesse Colin Reiherzer

IPC: H01L33/62 ,  B23K1/00 ,  B23K1/19 ,  B23K35/26 ,  B23K35/30 ,  C22C13/00 ,  C22C19/03 ,  H01L25/075 ,  H01L33/36 ,  H01L33/48

CPC classification number: H01L33/62 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/262 ,  B23K35/3033 ,  C22C13/00 ,  C22C19/03 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/36 ,  H01L33/38 ,  H01L33/486 ,  H01L33/647 ,  H01L2224/16245 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A Light Emitting Diode (LED) component includes a lead frame and an LED that is electrically connected to the lead frame without wire bonds, using a solder layer. The lead frame includes a metal anode pad, a metal cathode pad and a plastic cup. The LED die includes LED die anode and cathode contacts with a solder layer on them. The metal anode pad, metal cathode pad, plastic cup and/or the solder layer are configured to facilitate the direct die attach of the LED die to the lead frame without wire bonds. Related fabrication methods are also described.

公开(公告)号：US20160149104A1

公开(公告)日：2016-05-26

申请号：US14550186

申请日：2014-11-21

Applicant: Cree, Inc.

Inventor： Michael John Bergmann ,  Colin Kelly Blakely ,  Arthur Fong-Yuen Pun ,  Jesse Colin Reiherzer

IPC: H01L33/62 ,  H01L33/36 ,  H01L25/075 ,  C22C13/00 ,  B23K1/00 ,  B23K35/26 ,  B23K35/30 ,  C22C19/03 ,  H01L33/48 ,  B23K1/19

CPC classification number: H01L33/62 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/262 ,  B23K35/3033 ,  C22C13/00 ,  C22C19/03 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/36 ,  H01L33/38 ,  H01L33/486 ,  H01L33/647 ,  H01L2224/16245 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A Light Emitting Diode (LED) component includes a lead frame and an LED that is electrically connected to the lead frame without wire bonds, using a solder layer. The lead frame includes a metal anode pad, a metal cathode pad and a plastic cup. The LED die includes LED die anode and cathode contacts with a solder layer on them. The metal anode pad, metal cathode pad, plastic cup and/or the solder layer are configured to facilitate the direct die attach of the LED die to the lead frame without wire bonds. Related fabrication methods are also described.

Abstract translation: 发光二极管（LED）部件包括使用焊料层的引线框架和LED，其与引线框架电连接而不引线接合。 引线框架包括金属阳极垫，金属阴极垫和塑料杯。 LED芯片包括在其上具有焊料层的LED裸片阳极和阴极触点。 金属阳极焊盘，金属阴极焊盘，塑料杯和/或焊料层被配置为便于将LED管芯直接连接到引线框架而不引线接合。 还描述了相关的制造方法。