公开(公告)号：US20080314635A1

公开(公告)日：2008-12-25

申请号：US12213291

申请日：2008-06-17

申请人： Han Kim ,  Hak-Sun Kim ,  Chang-Sup Ryu

发明人： Han Kim ,  Hak-Sun Kim ,  Chang-Sup Ryu

IPC分类号： H01R12/04

CPC分类号： H01P5/184 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01P1/2005 ,  H05K1/0236 ,  H05K1/162 ,  H05K3/4602 ,  H05K2201/093 ,  H05K2201/09663

摘要： A printed circuit board solving a mixed signal problem between an analog circuit and a digital circuit is disclosed. In accordance with an embodiment of the present invention, the printed circuit board, having an analog circuit and a digital circuit, includes: a first metal layer and a second metal layer, one of the first metal layer and the second metal layer being a power layer and the other being a ground layer; a third metal layer, layer-built between the first metal layer and the second metal layer; and a mushroom type structure including a via connected to a metal plate, the metal plate being arranged-in a space between circuit patterns of the third metal layer. With the present invention, the printed circuit board can lower the noise level within the same frequency band as compared with other structures having the same size.

摘要翻译： 公开了一种解决模拟电路和数字电路之间的混合信号问题的印刷电路板。 根据本发明的实施例，具有模拟电路和数字电路的印刷电路板包括：第一金属层和第二金属层，第一金属层和第二金属层中的一个是功率 层，另一层为地层; 在第一金属层和第二金属层之间层叠的第三金属层; 以及包括连接到金属板的通孔的蘑菇型结构，所述金属板布置在所述第三金属层的电路图案之间的空间中。 利用本发明，与具有相同尺寸的其他结构相比，印刷电路板可以降低相同频带内的噪声水平。

公开(公告)号：US20070210439A1

公开(公告)日：2007-09-13

申请号：US11715906

申请日：2007-03-09

申请人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

发明人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/3128 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An aspect of the present invention features a manufacturing method of a board on chip package. The method can comprise: (a) laminating a dry film on a carrier film, one side of which is laminated by a thin metal film; (b) patterning the dry film in accordance with a circuit wire through light exposure and developing process, and forming a solder ball pad and a circuit wire; (c) removing the dry film; (d) laminating an upper photo solder resist excluding a portion where the solder ball pad is formed; (e) etching the thin metal film formed on a portion where the upper photo solder resist is not laminated; (f) mounting a semiconductor chip on the solder ball pad by a flip chip bonding; (g) molding the semiconductor chip with a passivation material; (h) removing the carrier film and the thin metal film; and (i) laminating a lower photo solder resist under the solder ball pad. The board on chip package and the manufacturing method thereof according to the present invention can design a high density circuit since a circuit pattern is formed using a seed layer.

摘要翻译： 本发明的一个方面的特征在于片上封装的制造方法。 该方法可以包括：（a）在载体膜上层压干膜，其一面由薄金属膜层压; （b）通过曝光和显影工艺根据电路线图案化干膜，并形成焊球焊盘和电路线; （c）去除干膜; （d）层压除了形成焊锡球焊盘的部分之外的上光阻焊剂; （e）蚀刻形成在上层光阻抗层未层叠的部分上的金属薄膜; （f）通过倒装芯片接合将半导体芯片安装在焊球垫上; （g）用钝化材料模制半导体芯片; （h）去除载体膜和金属薄膜; 和（i）在焊球垫下方层叠下光阻焊剂。 根据本发明的片上封装及其制造方法可以设计高密度电路，因为使用种子层形成电路图案。

公开(公告)号：US20070120253A1

公开(公告)日：2007-05-31

申请号：US11602332

申请日：2006-11-21

申请人： Yoong Oh ,  Chang-Sup Ryu ,  Dong-Jin Park ,  Jee-Soo Mok ,  Byung-Bae Seo

发明人： Yoong Oh ,  Chang-Sup Ryu ,  Dong-Jin Park ,  Jee-Soo Mok ,  Byung-Bae Seo

IPC分类号： H01L23/48

CPC分类号： H01L21/486 ,  H01L21/4867 ,  H01L23/49827 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2203/063 ,  H05K2203/1572 ,  H01L2924/00

摘要： A core substrate and multilayer printed circuit board using paste bumps and manufacturing method thereof are disclosed. With the method of manufacturing a core substrate using paste bumps comprising: (a) aligning a pair of paste bump boards, each of which has a plurality of paste bumps joined to its surface, such that the paste bumps face each other, and (b) pressing the pair of paste bump boards together, where an insulation element is placed between the pair of paste bump boards, it is easier to implement interlayer electrical interconnection between circuit patterns, the thickness of the core substrate can readily be adjusted by adjusting the thickness of the insulation layer, the stiffness is improved as a pair of paste bump boards are pressed from the top and bottom, and high-density wiring can be formed more easily as the paste bumps are connected in pairs so that the diameters of the paste bumps formed on the paste bump boards can be reduced.

摘要翻译： 公开了一种使用糊状凸块的芯基板和多层印刷电路板及其制造方法。 利用使用糊状凸块的芯基板的制造方法，其特征在于，包括：（a）对准一对粘贴凸块，其中，每一个均具有与其表面接合的多个焊料凸块，使得所述焊膏凸起彼此面对;以及（b ）将一对焊膏凸块按压在一起，其中绝缘元件放置在一对焊膏凸块之间，更容易实现电路图案之间的层间电互连，通过调节厚度可以容易地调节芯基板的厚度 的绝缘层，由于从顶部和底部按压一对糊状凸块，刚度得以改善，并且随着糊料凸块成对连接，可以更容易地形成高密度布线，使得糊料凸块的直径 可以减少形成在糊状凸块上。

公开(公告)号：US08310840B2

公开(公告)日：2012-11-13

申请号：US12222057

申请日：2008-07-31

申请人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

发明人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

IPC分类号： H05K7/00

CPC分类号： H05K9/0039 ,  H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09663

摘要： Disclosed are an electromagnetic bandgap structure and a printed circuit board including the same. In accordance with an embodiment of the present invention, the printed circuit board can include a dielectric layer, a plurality of conductive plates, and a stitching via, which is configured to electrically connect the conductive plates to each other. The stitching via can pass through the dielectric layer, and a part of the stitching via can be placed in a planar surface that is different from a planar surface in which the conductive plates are placed. With the present invention, the electromagnetic bandgap structure can prevent a signal of a predetermined frequency band from being transferred.

摘要翻译： 公开了一种电磁带隙结构和包括该电阻带隙结构的印刷电路板。 根据本发明的实施例，印刷电路板可以包括介电层，多个导电板和缝合通孔，其被配置为将导电板彼此电连接。 缝合通孔可以穿过介电层，并且缝合通孔的一部分可以放置在与放置导电板的平坦表面不同的平面表面中。 利用本发明，电磁带隙结构可以防止预定频带的信号被传送。

公开(公告)号：US08169790B2

公开(公告)日：2012-05-01

申请号：US12010561

申请日：2008-01-25

申请人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

发明人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

IPC分类号： H05K7/00

CPC分类号： H01P1/2005 ,  H01L2224/16225 ,  H01Q15/006 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure and a printed circuit board having the electromagnetic bandgap that intercepts the transfer of a signal ranging a frequency band are disclosed. The electromagnetic bandgap structure includes a metal layer; a dielectric layer, stacked on the metal layer; at least two metal plates, stacked on the same planar surface of the dielectric layer; and a stitching via, connecting the adjacent metal plates. The stitching via passes through the dielectric layer, and a part of the stitching via is placed on the same planar surface of the metal layer. With the present invention, the electromagnetic bandgap can decrease the noise of a particular frequency by having a compact size and a low bandgap frequency.

摘要翻译： 公开了一种具有电磁带隙的电磁带隙结构和印刷电路板，该电磁带隙拦截了频带范围内的信号的传送。 电磁带隙结构包括金属层; 介电层，堆叠在金属层上; 至少两个金属板，堆叠在介电层的相同平面上; 和缝合通孔，连接相邻的金属板。 缝合通孔穿过电介质层，并且缝合通孔的一部分被放置在金属层的同一平面上。 利用本发明，电磁带隙可以通过具有紧凑的尺寸和低的带隙频率来降低​​特定频率的噪声。

公开(公告)号：US20110221074A1

公开(公告)日：2011-09-15

申请号：US13067219

申请日：2011-05-17

申请人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

发明人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Jung-Hyun Park ,  Hoe-Ku Jung ,  Ji-Eun Kim

IPC分类号： H01L23/488

CPC分类号： H01L23/3128 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A board on chip package including a photo solder resist having a cavity and a pattern on one side, the pattern corresponding to a circuit wire; a solder ball pad accommodated in the cavity; a circuit wire electrically connected with the solder ball pad, and formed on the other side of the photo solder resist; a semiconductor chip mounted on the solder ball pad by a flip chip bonding; and a passivation material to mold the semiconductor chip.

摘要翻译： 一种片上封装，包括具有空腔和一侧图案的光阻焊剂，该图案对应于电路线; 容纳在腔中的焊球垫; 与焊锡球焊盘电连接并形成在光阻焊剂的另一侧上的电路线; 通过倒装芯片焊接安装在焊球垫上的半导体芯片; 以及用于模制半导体芯片的钝化材料。

公开(公告)号：US07973248B2

公开(公告)日：2011-07-05

申请号：US12219381

申请日：2008-07-21

申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H05K3/462 ,  H01R12/523 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0353 ,  Y10T29/49155

摘要： A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

摘要翻译： 公开了一种使用糊状凸块的印刷电路板及其制造方法。 使用糊状凸块制造印刷电路板的方法包括：（a）穿孔芯板以形成至少一个通孔，（b）通过填充电镀填充至少一个通孔并在其上形成电路图案 芯板的至少一个表面，（c）在芯板的至少一个表面上堆叠焊料凸块，以及（d）在焊料凸块的表面上形成外层电路，结构稳定的全层 由于镀层芯板的BVH的强度增加，可以实现IVH结构，由于并行处理和集体堆叠，制造时间可以减少，由于粘贴凸块的铜箔堆叠而实现微电路变得容易 在最外层，可以减少制造成本，因为可以省略某些电镀和钻孔工艺，在电路图案之间增加层间连接面积以提高连接可靠性，并且可以获得凹坑覆盖 d。

公开(公告)号：US20110026234A1

公开(公告)日：2011-02-03

申请号：US12654541

申请日：2009-12-22

申请人： Han Kim ,  Chang-Sup Ryu

发明人： Han Kim ,  Chang-Sup Ryu

IPC分类号： H05K9/00 ,  H05K7/14

CPC分类号： H05K1/0237 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/3025 ,  H01Q1/526 ,  H05K1/0224 ,  H05K1/0236 ,  H05K1/0298 ,  H05K1/144 ,  H05K1/183 ,  H05K9/0009 ,  H05K9/0052 ,  H05K2201/09681 ,  H05K2201/10371

摘要： A printed circuit board and an electronic product are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a first board, which has an electronic component mounted thereon, and a second board, which is positioned on an upper side of the first board and covers at least a portion of an upper surface of the first board and in which an EBG structure is inserted into the second board such that a noise radiating upwards from the first board is shielded. Thus, the printed circuit board can readily absorb various frequencies, be easily applied without any antenna effect and be cost-effective in manufacturing.

摘要翻译： 公开了印刷电路板和电子产品。 根据本发明的实施例，印刷电路板包括：第一板，其上安装有电子部件;第二板，其位于第一板的上侧，并且覆盖至少一部分 第一板的上表面，并且其中EBG结构插入到第二板中，使得从第一板向上辐射的噪声被屏蔽。 因此，印刷电路板可以容易地吸收各种频率，容易应用而没有任何天线效应，并且在制造中是成本有效的。

公开(公告)号：US07592708B2

公开(公告)日：2009-09-22

申请号：US11528324

申请日：2006-09-28

申请人： Seung-Gu Kim ,  Je-Gwang Yoo ,  Yong-Bin Lee ,  Yoo-Keum Wee ,  Seok-Hwan Huh ,  Chang-Sup Ryu

发明人： Seung-Gu Kim ,  Je-Gwang Yoo ,  Yong-Bin Lee ,  Yoo-Keum Wee ,  Seok-Hwan Huh ,  Chang-Sup Ryu

IPC分类号： H01L21/31 ,  H01L21/469

CPC分类号： H01L21/563 ,  H01L2224/73203 ,  H01L2924/0102 ,  H01L2924/01078

摘要： With a semiconductor package according to an aspect of the present invention comprising a board having circuit lines, solder resist formed on a surface of the board, and a chip mounted on the board and having at least one bump attached to at least a portion of the circuit lines, where the solder resist comprises a perimeter groove, which exposes at least a portion of the circuit lines, and an extension groove, which is connected to the perimeter groove, and where encapsulant is filled in the perimeter groove and the extension groove, the filling characteristics of the encapsulant is improved for greater reliability in the electrical connections between the chip and the board.

摘要翻译： 根据本发明的一个方面的半导体封装，其包括具有电路线的板，形成在所述板的表面上的阻焊剂和安装在所述板上的芯片，并且具有附着到所述板的至少一部分上的至少一个凸块 电路线，其中阻焊剂包括暴露至少一部分电路线的周边凹槽和连接到周边凹槽的延伸凹槽，并且其中密封剂填充在周边凹槽和延伸凹槽中， 提高了密封剂的填充特性，以便在芯片和电路板之间的电连接中获得更高的可靠性。

公开(公告)号：US20090229875A1

公开(公告)日：2009-09-17

申请号：US12453741

申请日：2009-05-20

申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Ki-Hwan Kim ,  Sung-Yong Kim

发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Ki-Hwan Kim ,  Sung-Yong Kim

IPC分类号： H05K1/11

CPC分类号： H05K3/4664 ,  H05K3/0023 ,  H05K3/1216 ,  H05K3/1258 ,  H05K3/207 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/465 ,  H05K2201/09536 ,  H05K2203/0143 ,  H05K2203/0568

摘要： A printed circuit board having a fine pattern and related manufacturing method that includes providing a carrier plate; coating the carrier plate with a photosensitive material; forming a first circuit pattern on the photosensitive material; forming a first circuit layer by drying a conductive paste printed into a space between the photosensitive materials where the first circuit pattern is formed; depositing an insulation layer on the first circuit layer; processing via holes penetrating the insulation layer; coating the insulation layer with the photosensitive material and then forming a second circuit pattern in the photosensitive material; forming a second circuit layer and filling the via holes by drying the conductive paste printed into a space between the photosensitive materials, where the second circuit pattern is formed, and the via holes; and removing the carrier plate.

摘要翻译： 一种具有精细图案和相关制造方法的印刷电路板，包括提供载板; 用感光材料涂覆载体板; 在感光材料上形成第一电路图案; 通过干燥印刷在形成有第一电路图案的感光材料之间的空间中的导电浆料形成第一电路层; 在第一电路层上沉积绝缘层; 通过贯穿绝缘层的孔加工; 用感光材料涂覆绝缘层，然后在感光材料中形成第二电路图案; 形成第二电路层，并通过干燥印刷在其中形成第二电路图案的感光材料之间的空间中的导电浆料和通孔来填充通孔; 并移除载体板。